A copper alloy for an electronic and electric device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; and a Cu balance including inevitable impurities, wherein the electrical conductivity of the copper alloy is more than 75% IACS, and a strength ratio TS.sub.TD/TS.sub.LD, which is calculated from strength TS.sub.TD obtained in a tensile test performed in a direction perpendicular to a rolling direction and strength TS.sub.LD obtained in a tensile test performed in a direction parallel to a rolling direction, is more than 0.9 and less than 1.1. The copper alloy may further include P in a range of 0.0005 mass % or more and less than 0.01 mass %.

Apparatuses and associated methods of manufacturing are described that provide an adaptive connector configured to connect between a cable connector and a switch module in a datacenter. The adaptive connector includes a body defining a top, bottom, and two side portions extending between the top and bottom portion. The body of the adaptive connector defines a first end for receiving the cable connector and a second end that is received by a switch module for enabling signals to pass between the cable connector and switch module. The adaptive connector further defines a heat dissipation elements for transferring heat between the adaptive connector and an external environment of the adaptive connector.

Provided is a method of manufacturing a downhole cable, the method including, forming a helical shape in an outer circumferential surface of a metal tube, the metal tube having a fiber element housed therein, and stranding a copper element in a helical space formed by the metallic tube. Also provided is a downhole cable including, a metallic tube having a helical space in an outer circumferential surface thereof, wherein the metallic tube has a fiber element housed therein, and a copper element disposed in a helical space formed by the steel tube. Double-tube and multi-tube configurations of the downhole cable are also provided.

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

There are provided a surface-coated copper filler having an excellent oxidation resistance for use in a conductive composition, a method for producing the surface-coated copper filler, and a conductive composition containing the surface-coated copper filler. The surface-coated copper filler comprises: a copper particle; a first coating layer containing an amine compound, which is bonded to copper on a surface of the copper particle via a chemical bond and/or a physical bond; and a second coating layer containing an aliphatic monocarboxylic acid having 8 to 20 carbon atoms, which is bonded to the amine compound via a chemical bond. The amine compound is represented by the following formula (1):

H.sub.2NCH.sub.2.sub.mNH.sub.nCH.sub.2.sub.mNH.sub.2(1)

wherein m is an integer of 0 to 3, n is an integer of 0 to 2, m is 0 to 3 when n is 0, and m is 1 to 3 when n is 1 or 2.

A copper alloy for an electronic and electric device is provided. The copper alloy includes: Mg in a range of 0.15 mass % or more and less than 0.35 mass %; and a Cu balance including inevitable impurities, wherein the electrical conductivity of the copper alloy is more than 75% IACS, and a yield ratio YS/TS, which is calculated from strength TS in a tensile test performed in a direction parallel to a rolling direction and 0.2% yield strength YS, is more than 88%. The copper alloy may further include P in a range of 0.0005 mass % or more and less than 0.01 mass %.

A copper alloy according to the present invention is a copper alloy rolled to be plate-shaped. The copper alloy contains 8.5 to 9.5 mass % of Ni, 5.5 to 6.5 mass % of Sn with a remainder being Cu and unavoidable impurities. An average diameter of crystal grains in a cross section perpendicular to a rolling direction is less than 6 m. A ratio x/y of an average length x of the crystal grains in a plate width direction to an average length y in a plate thickness direction satisfies 1x/y2.5. An X-ray diffracted intensity ratio in a plate surface parallel to the rolling direction of the copper alloy includes, when an X-ray diffracted intensity of a (220) plane is standardized as 1, an intensity ratio of a (200) plane being 0.30 or less, an intensity ratio of a (111) plane being 0.45 or less, and an intensity ratio of a (311) plane being 0.60 or less. The intensity ratio of the (111) plane is greater than the intensity ratio of the (200) plane and smaller than the intensity ratio of the (311) plane.

An improved Ethernet cable with an undulating and folding jacket housing external spatial channels. The undulating housing provides for multiple connection configurations from a flat cable to rectangular block configurations. The cable has a plurality of internal electronic signal channels, each channel having a pair of conductors. Each channel is also further isolated by a multi-layer protective shield, the protective shield encasing the pair of conductors. This unique design meets the new requirements of CAT8 cables, and substantially enhances video and audio streaming and transmission speeds, while eliminating deleterious effects of prior cables.

The invention relates to a method for manufacturing a composite material (8) comprising a metal matrix reinforced by a carbon reinforcement, characterised in that the method is a continuous extrusion method which comprises friction-heating of a mixture (7) obtained from a mixture of powders comprising a metal-matrix powder and a carbon-reinforcement powder, by means of a movable extrusion wheel (2), in a passage formed between a groove (2a) of the wheel (2) and a stationary element referred to as shoe (3), followed by carrying the mixture (7) thus heated towards an extrusion die (4).

An elastic conductor includes a stretchable base, and conductors each having a longitudinal shape, being arranged on a surface of the stretchable base, and having a lower specific resistance and a higher modulus of elasticity than the stretchable base. In the first state, the conductors are spaced apart from each other in the second direction perpendicular or substantially perpendicular to the first direction, and are continuous in a section extending in the first direction as seen in the second direction from one end of the section to the other end of the section, in which a distance between the conductors adjacent to each other in the second direction in the second state is shorter than a distance between the conductors adjacent to each other in the second direction in the first state.