A magnet assembly in a magnetic resonance apparatus includes a cryostat and a superconducting main field magnet coil system arranged therein for generating a magnetic field in the direction of a z-axis in a working volume. The magnet assembly includes a shim device arranged inside the cryostat for adjusting the spatial variation or homogeneity of the magnetic field generated in the working volume by the magnet coil system. The shim device comprises at least one closed superconducting shim conductor path having an HTS layer. The HTS layer forms a surface that is geometrically developable such that unwrapping onto a plane changes the geodesic distance between any two points on the surface formed by the HTS layer by no more than 10%. The inner and/or outer contour of the geometrical development of the HTS layer describes a non-convex curve.

An improved electrical contact alloy, useful for example, in vacuum interrupters used in vacuum contactors is provided. The contact alloy according to the disclosed concept comprises copper particles and chromium particles present in a ratio of copper to chromium of 2:3 to 20:1. The electrical contact alloy also comprises particles of a carbide, which reduces the weld break strength of the electrical contact alloy without reducing its interruption performance.

The embodiments herein describe technologies of cryogenic digital systems with a first component located in a first cryogenic temperature domain and a second component located in a second cryogenic temperature domain that is lower in temperature than the first cryogenic temperature domain. An electrical conductor is coupled between the first component and the second component along a first plane. The electrical conductor carries a signal between the first component and the second component. A cooling assembly is coupled to a segment of the electrical conductor. The cooling assembly may include an electrical insulator including ceramic material. The cooling assembly may include a cold plate, two cold plates, or an orthogonal cold strip.

Systems and methods for fabricating nanostructures using other nanostructures as templates. A method includes mixing a dispersion and a reagent solution. The dispersion includes nanostructures such as nanowires including a first element such as copper. The reagent solution includes a second element such as silver. The second element at least partially replaces the first element in the nanostructures. The nanostructures are optionally washed, filtered, and/or deoxidized.

An electrical cable includes a cable jacket surrounding a cable interior. At least one electrical cable conductor is disposed in the cable interior and has an insulating sheath. A cable shield shields the cable interior. At least one electrically conductive drain wire associated with the cable shield is disposed in the cable interior in electrical contact with the cable shield. The at least one drain wire includes a ferromagnetic material.

Provided is a silver-coated copper powder which can be utilized as an electrically conductive paste and an electromagnetic wave shield. A silver-coated copper powder has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic (SEM) observation gather, the surface of the copper particles is coated with silver, the average particle diameter (D50) of the silver-coated copper powder 1 is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.

The disclosure relates to a touch panel. The touch panel includes a substrate having a surface, a transparent conductive layer, at least one electrode, and a conductive trace. The transparent conductive layer includes a metal nanowire film. The metal nanowire film includes a number of first metal nanowire bundles parallel with and spaced from each other. Each of the number of first metal nanowire bundles includes a number of first metal nanowires parallel with each other. The first distance between adjacent two of the number of first metal nanowires is less than the second distance between adjacent two of the number of first metal nanowire bundles.

A method of manufacturing a lead wire for a solar cell includes heating a wire material by a direct resistance heating or by an induction heating to reduce a 0.2% proof stress of the wire material while conveying the wire material and plating the wire material that is in a heated condition obtained by the direct resistance heating or by the induction heating while further conveying the wire material. An apparatus is configured to implement the method, and includes a plating bath, a conveyor mechanism configured to convey the wire material, a heater configured to heat the wire material, and a controller configured to control the conveyor mechanism and the heater.

A method is provided for preparing a wire for installation of a terminal. The method comprises removing an insulating layer from a conductor to expose a portion of a conductor. The method further includes attaching a conductive foil layer to a portion of the exposed portion of the conductor by applying pressure to the conductive foil layer. Terminated wires are also provided.

There is provided a copper foil having a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board. A surface-treated copper foil according to the present invention includes a copper foil and a silicon-based surface coating layer provided on at least one surface of the copper foil, the silicon-based surface coating layer being mainly composed of silicon (Si). The silicon-based surface coating layer has a carbon content of 1.0 to 35.0 atomic % and an oxygen content of 12.0 to 40.0 atomic % relative to a total content in 100 atomic % of carbon (C), oxygen (O) and silicon (Si) elements as measured by X-ray photoelectron spectroscopy (XPS).