A noble metal-coated copper wire for ball bonding, with a wire diameter between 10 m or more, and 25 m or less, includes a core material having a copper alloy having a copper purity of 98 mass % or higher, and a noble metal-coating layer formed on the core material. The noble metal-coating layer includes a palladium cavitating layer containing palladium; at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed in the palladium; and a diffusion layer formed of copper diffused into the palladium. The noble metal-coating layer may include a palladium cavitating layer containing palladium, at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed therein, and a nickel intermediate layer disposed between the core material and the noble metal-coating layer.

An electrical connection structure includes: a first metal member including copper or a copper alloy, a plated tin layer being formed on at least a portion of the first metal member; a second metal member that is electrically connected or connectable to the first metal member; and a surface treating layer formed on the surface of the first metal member. The surface treating layer is formed by applying a surface treating agent containing base oil and a metal affinity compound having a lipophilic group and an affinity group that has an affinity for metal. The metal affinity compound contains an adduct between an acidic alkyl phosphate ester and an azole compound and an adduct between an acidic alkyl phosphate ester and a metal and/or an organic amine compound.

The present invention relates to electrical conductors for electrical transmission and distribution with pre-stress conditioning of the strength member so that the conductive materials of aluminum, aluminum alloys, copper, copper alloys, or copper micro-alloys are mostly tension free or under compressive stress in the conductor, while the strength member is under tensile stress prior to conductor stringing, resulting in a lower thermal knee point in the conductor.

The present invention relates to manufacturing of litz wire. In order to provide thinner litz wires, a system (100) for manufacturing litz wire is provided, the system comprising a provision unit (102) and a conversion unit (104). The provision unit is configured to provide a strand (106) with a plurality (108) of thin conductive wires (110) embedded in a matrix (112), which matrix is having first characteristics comprising metallic connection of the conductive wires and the matrix, and comprising electrical conductivity for electrically connecting of the conductive wires and the matrix. The conversion unit is configured to convert at least a part of the matrix into material (114) having second characteristics comprising electrical insulation for providing at least a part of the plurality of thin conductive wires with an electrical insulation.

A wire cable assembly capable of transmitting signals at speeds of 5 Gigabits per second over a single pair or conductors. The cable has a characteristic impedance of 95 Ohms and can support transmission data according to either USB 3.0 or HDMI 1.3 performance specifications. The wire cable includes a pair of conductors, a shield surrounding the conductors, and a dielectric structure configured to maintain a first predetermined spacing between the conductors and a second predetermined spacing between said the conductors said shield. The shield includes an inner shield conductor enclosing the dielectric structure, a ground conductor external to the inner shield conductor, extending generally parallel to the pair of conductors, an outer shield conductor enclosing the inner shield conductor and the ground conductor.

A composition that includes a high-valent compound of copper, silver or indium; a linear, branched or cyclic C.sub.1-18 alcohol; and a Group VIII metal catalyst forms a metal film of copper, silver or indium on a substrate when the composition is coated on the substrate and heated to reduce the high-valent compound. The composition may alternatively include metal particles of silver, copper or indium in which the surface layer of the particle includes a high-valent compound of copper, silver or indium. A metal film of copper, silver or indium may also be formed on a substrate by coating a substrate with the composition including the metal particles, and heating to reduce the high-valent compound in the same manner as above.

The present invention provides a method for manufacturing a metal material. The method comprises a temperature increasing step of increasing the temperature of a silver material having undergone final plastic working to 700 C. or more and less than a melting point of the silver material in a vacuum or a helium gas atmosphere, a heating step of maintaining the silver material at 700 C. or more and less than the melting point, and a cooling step of cooling the silver material to room temperature in a vacuum or a helium gas atmosphere. For a part of the period of the heating step, the silver material is heated in a mixed atmosphere in which hydrogen gas is mixed with helium gas.

A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0([Co]0.007)/([P]0.008)6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.

Tin-plated copper-alloy material for terminal in which: a Sn-based surface layer is formed on a surface of a substrate made of Cu alloy, and a CuSn alloy layer is formed between the Sn-based surface layer and the substrate; the CuSn alloy layer is an alloy layer containing Cu.sub.6Sn.sub.5 as a major proportion and having a compound in which a part of Cu in the Cu.sub.6Sn.sub.5 is substituted by Ni and Si in the vicinity of a boundary face at the substrate side; an average thickness of the Sn-based surface layer is 0.2 m or more and 0.6 m or less; an oil-sump depth Rvk of the CuSn alloy layer is 0.2 m or more; an area rate of the CuSn alloy layer exposed at a surface of the Sn-based surface layer is 10% or more and 40% or less; and dynamic friction coefficient is 0.3 or less.

[Problem to be Solved] The present invention provides a CuCoNiSi alloy for an electronic component having improved reliability in which in addition to high strength and high electrical conduction, bendability generally difficult to achieve with strength is also provided to a Corson copper alloy.

[Solution] The present invention is a CuCoNiSi alloy for an electronic component comprising 0.5 to 3.0% by mass of Co and 0.1 to 1.0% by mass of Ni, a concentration (% by mass) ratio of Ni to Co (Ni/Co) being adjusted in the range of 0.1 to 1.0, the alloy comprising Si so that a (Co+Ni)/Si mass ratio is in the range of 3 to 5, and comprising a balance comprising Cu and unavoidable impurities, wherein a coefficient of variation of concentration ratios of Co to Ni (Co/Ni) measured for at least 100 second-phase particles is 20% or less.