Provided is a method for producing a joined body, the method including a first step of preparing a laminated body which includes a first member having a metal pillar provided on a surface thereof, a second member having an electrode pad provided on a surface thereof, and a joining material provided between the metal pillar and the electrode pad and containing metal particles and an organic compound, and a second step of heating the laminated body to sinter the joining material at a predetermined sintering temperature, in which the joining material satisfies the condition of the following Formula (I):
(M.sub.1−M.sub.2)/M.sub.1×100≥1.0  (I)
[in Formula (I), M.sub.1 represents a mass of the joining material when a temperature of the joining material reaches the sintering temperature in the second step, and M.sub.2 represents a non-volatile content in the joining material.]

A conductive structure is provided. The conductive ink composition includes a silver complex formed by mixing a silver carboxylate, at least one dissolving agent that dissolves the silver carboxylate, and a catalyst. The catalyst includes an amine that decarboxylates the silver carboxylate to make the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100° C. or less. An ink composition comprising a metallic salt with a sterically bulky counter ion and a ligand is also provided. An ink composition for making a conductive structure, comprising a reducible metal complex formed by mixing: a reducing agent, wherein the reducing agent is dissolved in a dissolving agent; and at least one metal salt or metal complex comprising a Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal, wherein the reducing agent reduces the metal to forms the conductive structure is further provided.

A conductive structure is provided. The conductive ink composition includes a silver complex formed by mixing a silver carboxylate, at least one dissolving agent that dissolves the silver carboxylate, and a catalyst. The catalyst includes an amine that decarboxylates the silver carboxylate to make the conductive ink composition. The catalyst decarboxylates the silver carboxylate at a temperature of 100° C. or less. An ink composition comprising a metallic salt with a sterically bulky counter ion and a ligand is also provided. An ink composition for making a conductive structure, comprising a reducible metal complex formed by mixing: a reducing agent, wherein the reducing agent is dissolved in a dissolving agent; and at least one metal salt or metal complex comprising a Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal, wherein the reducing agent reduces the metal to forms the conductive structure is further provided.

The present disclosure discloses a lithium-tellurium silicon-lead bismuth multi-component glass-oxide-complex system and conductive paste containing same, belonging to the technical field of solar cells. According to the present disclosure, a “functional modularization” strategy is adopted in a formula design of the glass-oxide-complex system, and glass oxide systems with selective reactivity for different passivation layers are compounded based on the structures, compositions and thicknesses of the passivation layers, so that a paste formula is developed, which is composed of lithium-containing, tellurium-silicon-containing and lead-containing glass oxides. Due to adoption of the modularized formula strategy, active ingredients can be better controlled, and the overall paste formula is more optimized, so that the laminated passivation layers can be selectively burned through to obtain a more balanced contact, and better battery performance on silicon wafers with different passivation layer thicknesses can be achieved, thus achieving excellent photoelectric conversion efficiency.

In view of the problem with the prior art, the present invention addresses the following problems: providing a method that can suppress the generation of fine silver particles in a silver nanowire dispersion better than prior methods; and inhibiting, by a convenient method, particulation of silver nanowires on the anode side. A solution is a silver nanowire dispersion that contains silver nanowires, a dispersion solvent, and a chelating agent with the average diameter of the silver nanowires being not more than 100 nm, the silver nanowire dispersion being characterized in that the chelating agent content is 0.1 to 1,000 μmol/g with reference to the silver nanowire content, and the chelating agent is a prescribed aromatic heterocyclic compound having at least one imine skeleton in the molecule.

In view of the problem with the prior art, the present invention addresses the following problems: providing a method that can suppress the generation of fine silver particles in a silver nanowire dispersion better than prior methods; and inhibiting, by a convenient method, particulation of silver nanowires on the anode side. A solution is a silver nanowire dispersion that contains silver nanowires, a dispersion solvent, and a chelating agent with the average diameter of the silver nanowires being not more than 100 nm, the silver nanowire dispersion being characterized in that the chelating agent content is 0.1 to 1,000 μmol/g with reference to the silver nanowire content, and the chelating agent is a prescribed aromatic heterocyclic compound having at least one imine skeleton in the molecule.

Devices, systems, and methods related to a transparent conductive film are disclosed. In one aspect, a method of forming a transparent conductive member (e.g., a transparent conductive film) includes extruding a metallic nanoparticle composition from a capillary tube onto a temporary substrate to form an extrudate. The extrudate can include metallic nanoparticle lines. The method further includes sintering the extrudate and the temporary substrate, dispensing a photocurable polymer onto the temporary substrate, and laminating a second substrate to the photocurable polymer. The photocurable polymer and the extrudate are interposed between the temporary substrate and the second substrate. The method further includes curing the photocurable polymer to form a transparent polymer layer and separating the temporary substrate from the transparent layer to form the transparent conductive member. The transparent conductive member includes the transparent polymer layer and the extrudate embedded in the transparent polymer layer.

This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200° C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.

This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200° C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.

There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.