A multilayer inductor manufacturing method includes stacking a first coil conductor layer on a first magnetic layer; stacking a first burn-away material on side surfaces of the first coil conductor layer; stacking a second magnetic layer on the first burn-away material and first magnetic layer; stacking a second burn-away material on the second magnetic layer laterally outside an upper surface of the first coil conductor layer; stacking a second coil conductor layer on the upper surface of the first coil conductor layer and second burn-away material; stacking a third burn-away material on side surfaces and an upper surface of the second coil conductor layer; stacking a third magnetic layer on side surfaces of the third burn-away material and the second magnetic layer; stacking a fourth magnetic layer on the third burn-away material and the third magnetic layer; and burning away the first, second, and third burn-away materials via firing.

A multilayer coil array includes an element body including a magnetic layer; first and second built-in coils; and first to fourth outer electrodes connected to the first and second coils. A non-magnetic layer is provided between the first and second coils. The first and second coils are each formed by a plurality of coil conductors being connected to each other. At least one out of a coil conductor of the first coil that is closest to the second coil among the plurality of coil conductors of the first coil and a coil conductor of the second coil that is closest to the first coil among the plurality of coil conductors of the second coil contacts the non-magnetic layer. The length of a coil conductor layer that contacts the non-magnetic layer of the coil conductor contacting the non-magnetic layer is different from the length of the other coil conductor layers.

An inductor array component includes a substantially flat plate-shaped main body including a magnetic layer having resin and metal magnetic powder contained in the resin, a first inductor wiring and a second inductor wiring disposed on the same plane in the main body and adjacent to each other, and a plurality of first vertical wirings extending in a first direction of a normal direction with respect to the plane so as to penetrate through inside of the main body and being exposed on a side of a first main surface of the main body. Also, the inductor array component includes a plurality of second vertical wirings extending in a second direction of the normal direction with respect to the plane so as to penetrate through the inside of the main body and being exposed on a side of a second main surface of the main body.

The present disclosure relates to, in part, an inductor structure that includes an etch stop layer arranged over an interconnect structure overlying a substrate. A magnetic structure includes a plurality of stacked layers is arranged over the etch stop layer. The magnetic structure includes a bottommost layer that is wider than a topmost layer. A first conductive wire and a second conductive wire extend in parallel over the magnetic structure. The magnetic structure is configured to modify magnetic fields generated by the first and second conductive wires. A pattern enhancement layer is arranged between the bottommost layer of the magnetic structure and the etch stop layer. The pattern enhancement layer has a first thickness, and the bottommost layer of the magnetic structure has a second thickness that is less than the first thickness.

A method of forming a magnetic core on a substrate having a stacked inductor coil includes etching a plurality of polymer layers to form at least one feature through the plurality of polymer layers, wherein the at least one feature is disposed within a central region of a stacked inductor coil formed on the substrate; and depositing a magnetic material within the at least one feature.

A thin-film inductor device includes a substrate made of an electrically insulating material, a first coil unit, a second coil unit, and an inductance-enhancing structure. The first coil unit includes a first upper coil, a first lower coil, and two first electrodes electrically connected to the first upper and lower coils, respectively. The second coil includes a second upper coil, a second lower coil, and two second electrodes electrically connected to the second upper and lower coils, respectively. The first and second upper/lower coils are disposed spacedly and arranged by bifilar winding. The inductance-enhancing structure encapsulates the substrate, the first coil unit, and the second coil unit such that two terminal parts of each of the first electrodes and the second electrodes are exposed for external electrical connection.

In an inductor component, an inductor wire is formed inside a main body. The inductor wire has a circular columnar body extending in the height direction. An end surface of the inductor wire at a first end in the wire extending direction serves as a first external terminal and is exposed at a first terminal surface of the main body. The first external terminal is exposed only at the first terminal surface. An end surface of the inductor wire at a second end in the wire extending direction serves as a second external terminal and is exposed at a second terminal surface of the main body. The second external terminal is exposed only at the second terminal surface.

A multilayer coil component includes an element body including a plurality of metal magnetic particles, and a plurality of coil conductors. The plurality of coil conductors is disposed in the element body. The plurality of coil conductors is separated from each other in a predetermined direction and electrically connected to each other. The plurality of coil conductors includes one pair of side surfaces opposing each other in the predetermined direction. Surface roughness of the one pair of side surfaces is less than 40% of an average particle size of the plurality of metal magnetic particles.

A coil element according to one embodiment includes: an insulator body including first insulating layers and second insulating layers laminated in a stacking direction; first conductive patterns formed on the first insulating layers; and second conductive patterns formed on the second insulating layers. The insulator body includes a first end region situated at a top in the stacking direction, a second end region situated at a bottom in the stacking direction, and an intermediate region situated between the first end region and the second end region. The insulator body includes a first portion and a second portion that is an area other than the first portion. The first portion covers upper and lower surfaces of one or more intermediate first conductive patterns in the intermediate region among the plurality of first conductive patterns. The electrical resistivity of the first portion is higher than that of the second portion.

An electronic component that has fewer cracks during production is provided. The electronic component includes an outer electrode on a multilayer body, which includes an inner glass layer, a magnetic material layer on top and bottom surfaces of the inner glass layer, and an outer glass layer on top and bottom surfaces of the magnetic material layer. The insulating layers of the inner glass layer and the outer glass layers contain a dielectric glass material that contains a glass material containing at least K, B, and Si, quartz, and alumina. The glass material content of each insulating layer of the inner glass layer ranges from approximately 60%-65% by weight, the quartz content of each insulating layer of the inner glass layer ranges from approximately 34%-37% by weight, and the alumina content of each insulating layer of the inner glass layer ranges from approximately 0.5%-4% by weight.