Patent classifications
H01F2017/0073
Active Shield Structure
Various implementations described herein are related to a device having a first coil-shaped spiral structure for an active shield and a second coil-shaped spiral structure that is wound in-between windings of the first coil-shaped spiral structure. The first coil-shaped spiral structure may provide for a coil-based electro-magnetic (EM) shield as a counter-measure circuit for protecting an underlying circuit.
Inductive device having electromagnetic radiation shielding mechanism and manufacturing method of the same
The present invention discloses an inductive device having electromagnetic radiation shielding mechanism used to establish electromagnetic radiation shielding mechanism against an electronic device that includes an inductive unit and a first shielding structure. The first shielding structure forms a closed shape and is disposed next to a side of the inductive unit, wherein the first shielding structure is located between the inductive unit and the electronic device.
Inductor Inlay for a Component Carrier and a Method of Manufacturing the Same
An inductor inlay, a component carrier, and methods for manufacturing the inductor inlay and the component carrier. The inductor inlay has a magnetic layer stack of interconnected magnetic layers and an electrically conductive structure embedded in the magnetic stack. The electrically conductive structure is configured as an inductor element with a coil-like shape. A component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure and the inductor inlay with the magnetic layer stack with interconnected magnetic layers and the electrically conductive structure embedded in the magnetic layer stack. Methods for manufacturing the inductor inlay and component carrier are further described.
COMMON MODE FILTER AND TERMINAL DEVICE
The technology of this application relates to the field of filter technologies, and provides a common mode filter and a terminal device. The common mode filter includes a first winding and a second winding. A portion of the first winding and a portion of the second winding are formed, by rotating around a same axis, at a first coil layer. The other portion of the first winding and the other portion of the second winding are formed, by rotating around another same axis, at a second coil layer stacked with the first coil layer. At the first coil layer and the second coil layer, there is one turn of the second winding between each two adjacent turns of the first winding.
STACKED INDUCTOR DEVICE
A stacked inductor device including an 8-shaped inductor structure a stacked coil. The 8-shaped inductor structure includes a first coil and a second coil. The first coil is disposed in a first area. The first coil includes a first sub-coil and a second sub-coil, and the first sub-coil and the second sub-coil are disposed with an interval circularly with each other. The second coil is disposed in a second area, and the second coil is coupled with the first coil on a boundary between the first area and the second area. The second coil includes a third sub-coil and a fourth sub-coil, and the third sub-coil and the fourth sub-coil are disposed with an interval circularly with each other. The stacked coil is coupled to the first coil and the second coil and is stacked partially on or under the first coil and the second coil.
Multilayer inductor manufacturing method and multilayer inductor
A multilayer inductor manufacturing method includes stacking a first coil conductor layer on a first magnetic layer; stacking a first burn-away material on side surfaces of the first coil conductor layer; stacking a second magnetic layer on the first burn-away material and first magnetic layer; stacking a second burn-away material on the second magnetic layer laterally outside an upper surface of the first coil conductor layer; stacking a second coil conductor layer on the upper surface of the first coil conductor layer and second burn-away material; stacking a third burn-away material on side surfaces and an upper surface of the second coil conductor layer; stacking a third magnetic layer on side surfaces of the third burn-away material and the second magnetic layer; stacking a fourth magnetic layer on the third burn-away material and the third magnetic layer; and burning away the first, second, and third burn-away materials via firing.
Coil component and manufacturing method thereof
A coil component includes: a body in which a coil part is embedded, wherein the coil part includes: a support member; a pattern wall disposed on the support member; and a coil pattern extending between the pattern walls on the support member and including a plurality of winding turns. A width of an intermediate winding turn between innermost and outermost winding turns, among the plurality of winding turns of the coil pattern, is larger than widths of the innermost and outermost winding turns.
Planar coil element and method for producing planar coil element
A planar coil element of the present invention includes an insulating base film having a first surface and a second surface opposite to the first surface, a first conductive pattern deposited on the first surface side of the insulating base film, and a first insulating layer covering the first conductive pattern on the first surface side, in which the first conductive pattern includes a core body and a widening layer deposited by plating on the outer surface of the core body, the core body includes a thin conductive layer on the insulating base film, and the ratio of the average thickness of the first conductive pattern to the average circuit pitch of the first conductive pattern is 1/2 or more and 5 or less.
Inductor device
An inductor device includes a first inductor and a second inductor. The first inductor has a first winding and a second winding. The second inductor has a third winding and a fourth winding, and the second inductor is disposed adjacent to the first inductor, and the second inductor is coupled to the first inductor in an interlaced manner.
Tapered multipath inductors
In an embodiment, an integrated circuit die includes a semiconductor substrate, patterned metal layers compiled over the semiconductor substrate, and a tapered multipath inductor formed in the patterned metal layers. The tapered multipath inductor includes, in turn, an inductor input terminal, an inductor output terminal, and N number of parallel inductor tracks electrically coupled between the inductor input terminal and the inductor output terminal. The parallel inductor tracks wind or wrap around an inductor centerline to define a plurality of multipath inductor windings including an innermost winding and an outermost winding. The parallel inductor tracks further vary in track width when progressing from the outermost winding to the innermost winding of the plurality of multipath inductor windings.