A combined transformer/inductor device includes a core having a central core leg and an outer core leg spaced apart from the central core leg, an inner bobbin disposed around the central core leg, an outer bobbin disposed around the inner bobbin and the central core leg and having an upper portion having a first oblong portion disposed around the outer core leg, a lower portion having a second oblong portion disposed around the outer core leg, and a central portion disposed around the inner bobbin and the central core leg, a first winding wound around the inner bobbin, and a second winding wound around the outer bobbin, the second winding having a first portion wound around the first oblong portion, a second portion wound around the central portion, and a third portion wound around the second oblong portion.

The present application provides a packaged gate drive circuit having a transformer. The transformer which is used to transfer both signals and power from a primary side to a secondary side. The windings of the transformer are formed using a combination of tracks and wirebond wires. The transformer is positioned in a well formed using a first insulating material and covered with a second insulating material.

A coil component includes a core including a winding core portion and a first flange portion that is disposed on a first end portion of the winding core portion in a direction in which the winding core portion extends. A first curved portion is formed at a connection between a bottom surface of the winding core portion and the first flange portion. A ratio of a length of the first curved portion in a height direction to a distance in the height direction between the bottom surface and a first terminal electrode is no less than 20% and no more than 60% (i.e., from 20% to 60%).

A method for manufacturing an inductive conductivity sensor, with coils on both sides of a circuit board are placed surrounding an opening of the circuit board. The circuit board with the coils is inserted into a housing, wherein a sleeve is inserted in the housing through a second opening of the housing through the opening of the circuit board out to a first opening. The first opening, the second opening and the opening of the circuit board are aligned with one another, wherein the sleeve includes a first end section and a second end section and the sleeve is inserted with the first end section first in the housing, and wherein the sleeve is welded with the housing by means of a sonotrode by ultrasonic welding. The first end section of the sleeve is welded with the housing and with a counterpart inserted into the first opening. The invention relates further to an inductive conductivity sensor.

An electronic apparatus includes a base and an electronic module. The base includes first and second base walls, a separating wall connected between the first and second base walls, and two receiving spaces disposed at opposite sides of the separating wall. The electronic module includes a terminal unit, and two electronic units respectively received in the receiving spaces and connected to the terminal unit. The terminal unit includes two pairs of first terminals, each of which has a connecting section protruding from one of two opposite side surfaces of the second base wall, and two second terminals, each of which has two connecting sections respectively protruding from two opposite side surfaces of the first base wall.

The present invention provides a coil apparatus formed by mounting a coil component to a casing. A core coil apparatus according to the present invention has a main body (30) and a segment (40) that are obtained by a molded core (20) including an annular magnetic body made of a magnetic material and an insulating resin covering part that covers the magnetic body being cut at a first cutting part and a second cutting part that transect an outer peripheral surface and an inner peripheral surface and approach each other toward an inner periphery of the molded core, the segment being disposed in a cutout part (31) formed on the main body, the resin covering part (22) having a main body-side flange part (25) and a segment-side flange part (27) that project toward the outer peripheral side and/or the lateral side, a coil (51) wound around the core and a casing (70) mounted with the core, the casing having a recess (72) into which the main body-side flange part and the segment-side flange part are inserted.

A transformer module and a power module are provided. The transformer module includes: a magnetic core, a first winding and a second winding. The magnetic core includes at least one magnetic column at least partially covered by a multi-layer carrier including a plurality of horizontal copper foils and connecting copper foils. Horizontal copper foils are located on horizontal wiring layers, and connecting copper foils are disposed to connect horizontal copper foils. First and second windings surround the magnetic column, and the second winding is located outside the first winding. Both the first and second windings are formed by a horizontal copper foil and a connecting copper foil; two ends of the first winding are electrically connected to first and second surface-mounted pins; two ends of the second winding are electrically connected to third and fourth surface-mounted pins; these pins are disposed on at least one surface of the transformer module.

An electronic component includes: a body including a coil part disposed therein and containing magnetic metal particles; and a surface protection layer disposed on a surface of the body. The magnetic metal particles comprise two or more kinds of particles having different particle sizes from each other, a portion of the magnetic metal particles are exposed to the surface of the body, and uneven regions are formed on the regions of the surfaces of the magnetic metal particles exposed to the surface of the body, and the surface protection layer is in contact with the uneven regions.

An electronic device package includes a molded case and a plurality of leads. The molded case includes integrally formed side walls, end walls, and a top wall, the side walls, end walls and top wall defining an interior for receiving one or more electronic components. Each side wall includes a top portion, an intermediate portion, and a bottom portion. The top portion includes plate-like structure having first and second surfaces extending downward from the top wall. The intermediate portion includes a shelf structure having a shelf surface that extends from the first surface in a direction away from the interior, and a third surface extending downward from the shelf surface. The bottom portion extends downward from the intermediate portion. The leads are molded at least in part of the intermediate portion. Each lead has a first end portion exposed in the interior, and a second end portion extending along a bottom edge of the bottom portion.

A magnetic assembly packaging process is described. The magnetic assembly packaging process comprises the steps of setting a first substrate and a second substrate in a jig; performing electrical connection of the magnetic component to the first substrate and the second substrate; overlaying the enclosure over the first substrate and the second substrate; overturning the preformed magnetic assembly; and injecting an insulation paste layer between the first substrate and the second substrate. Accordingly, the magnetic assembly packaging process can effectively minimize the manufacturing cost and the volume of the magnetic element through reducing the overall volume of the substrate.