Patent classifications
H01F2027/065
Coil component and circuit board having the same
Disclosed herein is a coil component that includes a core, first to fourth terminal electrodes provided on a first flange part, fifth to eighth terminal electrodes provided on a second flange part, first and second wires bifilar wound around a winding core part, and third and fourth wires bifilar wound around the winding core part. One and other ends of the first to eighth wires are connected corresponding one of the first to eighth terminal electrodes. The first and second wires cross each other in a first crossing area. The third and fourth wires cross each other in a second crossing area different from the first crossing area.
LINE FILTER AND DISPLAY DEVICE COMPRISING SAME
A display device including a display panel which comprises: a power supply board comprising a line filter. The line filter, to remove noise, comprising: a case connectable to a printed circuit board to thereby electrically connect the line filter to the printed circuit board; a magnetic core to be accommodated in the case; a core cover coupleable to the case to cover the magnetic core; a coil wound around an outside of the case and the core cover; and a separator coupleable to the case and the core cover. The separator comprises: a base; an isolating portion protruding from the base to be insertable into the case and the core cover so as to isolate a region in which the coil is wound; and a stepped portion protruding from the base and in contact with one surface of the case to separate the base from the printed circuit board.
Multi-chip package with reinforced isolation
A multi-chip isolation (ISO) device package includes a leadframe including leads, an interposer substrate including a top copper layer and a bottom metal layer, with a dielectric layer in-between. A first IC die and a second IC die include circuitry including a transmitter or a receiver, and first and second bond pads are both attached top side up in the package. A laminate transformer is attached to the top copper layer positioned lateral to the IC die. Bondwires wirebond the first bond pads to first pads on the laminate transformer and to a first group of the leads or the lead terminals, and bondwires wirebond the second bond pads to second pads on the laminate transformer and to a second group of the leads or the lead terminals. A mold compound provides encapsulation.
Split transformer assembly
The invention describes a split transformer assembly (1) comprising a first partial assembly (10) comprising a primary winding arrangement (10W) shaped to accommodate a first core half (10C); a second partial assembly (20) comprising a secondary winding arrangement (20W) shaped to accommodate a second core half (20C); and wherein the first partial assembly (10) is realized for mounting on one side of a circuit board (3) and the second partial assembly (20) is realized for mounting on the opposite side of the circuit board (3) such that the core halves (10C, 20C) of the partial assemblies (10, 20) are completely isolated by the material of the circuit board (3). The invention further describes a switching converter circuit arrangement (2), and a method of assembling a split transformer (1).
RESONANT LC STRUCTURES
A resonant coil structure may include a plurality of conductors, including: a first conductor having a first end and a second end; a second conductor having a third end and a fourth end; a third conductor having a fifth end and a sixth end; and a fourth conductor having a seventh end and an eight end; and at least one galvanic coupling conductor that galvanically couples the first end to the fifth end and galvanically couples the fourth end to the eighth end.
MAGNETIC ELEMENT AND CIRCUIT BOARD COMPRISING THE SAME
An inductor according to an embodiment includes a core unit and a coil unit wherein a first coil unit includes a first upper conductive pattern and a first lower conductive pattern, wherein the second coil unit includes a second upper conductive pattern and a second lower conductive pattern, wherein the coil unit includes a center portion, a first pattern lead-out portion, and a second pattern lead-out portion, and wherein, in the second pattern lead-out portion, the second upper conductive pattern and the second lower conductive pattern overlap each other in a vertical direction such that at least a portion of the second upper conductive pattern and at least a portion of the second lower conductive pattern intersect each other when viewed in a plan view.
CASE WITH ISOLATION BARRIERS
A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.
INDUCTOR FRAMEWORK, INDUCTOR DEVICE AND LAMP
The present disclosure discloses an inductor framework, an inductor device and a lamp. The inductor framework includes a main winding part and at least two conductive welding components; the main winding is configured to fix a winding and has a connection surface, the conductive welding components are under the connection surface and cover the connection surface, and the conductive welding components are in fixed connection with the main winding part and the at least two conductive welding components are insulated from each other; the conductive welding components have a wire accommodation region.
METHOD FOR MANUFACTURING COMMON MODE OR DIFFERENTIAL MODE INDUCTOR AND COMMON MODE OR DIFFERENTIAL MODE INDUCTOR
The present disclosure provides a common or differential mode inductor for connection to a printed circuit board. The inductor includes a core, a first coil including a first insulated wire wound with a number of turns around the core, and a supporting device for supporting the core and the first coil. The supporting device includes a base element having a PCB contacting surface, and a first alignment element having a proximal end connected to the base element and a distal end provided at a distance from the PCB contacting surface, wherein the distal end is defining an alignment plane. The core has a first end plane facing the alignment plane and a second end plane, wherein the first end plane is facing the alignment plane. The second end plane is facing the base element.
PACKAGE WITH OVERHANG INDUCTOR
This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.