Patent classifications
H01F27/10
COOLING DEVICE AND ELECTROMAGNETIC INDUCTION CHARGING DEVICE
A cooling device for an electromagnetic induction charging device for inductive charging of a motor vehicle with electrical energy. The cooling device may include a housing, an air path, a coolant path, a heat exchanger, and a fan. The housing may include an upper housing shell and a lower housing shell, which may surround a housing interior. The heat exchanger and the fan may be arranged in the housing interior. The air path and the coolant path may be arranged in the housing interior fluidically separated from one another. The coolant path and the air path may be directed through the heat exchanger such that, in the heat exchanger, heat is transferrable from coolant in the coolant path to air in the air path. The fan may be arranged upstream of the heat exchanger in the air path.
EMBEDDED COOLING CHANNEL IN MAGNETICS
Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, an electronic package comprises, a package substrate, and a magnetic block, where the magnetic block passes through the package substrate. In an embodiment, the electronic package further comprises a fluidic path from an inlet to the package substrate to an outlet of the package substrate. In an embodiment, the electronic package further comprises a conductive winding in the package substrate, where the conductive winding wraps around the magnetic block, and where the conductive winding is tubular and the fluidic path passes through the conductive winding.
EMBEDDED COOLING CHANNEL IN MAGNETICS
Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, an electronic package comprises, a package substrate, and a magnetic block, where the magnetic block passes through the package substrate. In an embodiment, the electronic package further comprises a fluidic path from an inlet to the package substrate to an outlet of the package substrate. In an embodiment, the electronic package further comprises a conductive winding in the package substrate, where the conductive winding wraps around the magnetic block, and where the conductive winding is tubular and the fluidic path passes through the conductive winding.
Flat winding / equal coupling common mode inductor apparatus and method of use thereof
The invention comprises an inductor, such as used in processing transmission of a 3-phase power system. The inductor comprises a flat/rectangular winding with a narrow edge of the flat winding wound around a core, where the width of the winding exceeds three times the height of the inductor facing edge of the winding. The inductor optionally comprises a distributed gap particle core and/or is wound in parallel with multiple windings. Optionally, the inductor is used as part of an equal coupling common mode electrical system for processing the 3-phase transmission and/or a high frequency inverter comprising a switching device, such as a silicon carbide metal-oxide-semiconductor field-effect transistor.
Flat winding / equal coupling common mode inductor apparatus and method of use thereof
The invention comprises an inductor, such as used in processing transmission of a 3-phase power system. The inductor comprises a flat/rectangular winding with a narrow edge of the flat winding wound around a core, where the width of the winding exceeds three times the height of the inductor facing edge of the winding. The inductor optionally comprises a distributed gap particle core and/or is wound in parallel with multiple windings. Optionally, the inductor is used as part of an equal coupling common mode electrical system for processing the 3-phase transmission and/or a high frequency inverter comprising a switching device, such as a silicon carbide metal-oxide-semiconductor field-effect transistor.
ACTIVELY COOLED COIL
A coil system, including: pairs of planar coils vertically stacked in a vertical direction, each pair of planar coils including a first planar coil including a first outer turn and a second planar coil including a second outer turn overlapping the first outer turn and laterally offset from the first outer turn; and pairs of vertically stacked thermal conductor tracks, each pair of thermal conductor tracks including a first track and a second track overlapping the first track, laterally offset from the first track, and overlapping the first outer turns of the pairs of planar coils. The pairs of thermal conductor tracks are DC isolated from pairs of planar coils. The first outer turns and the second outer turns of the pairs of planar coils form a first comb-like structure. The plurality of pairs of thermal conductor tracks form a second comb-like structure engaged with the first comb-like structure.
ON-LOAD TAP CHANGER HEAD AND ON-LOAD TAP CHANGER HAVING AN ON-LOAD TAP CHANGER HEAD
An on-load tap changer head includes: a first region for an insulating fluid of the on-load tap changer to flow; a second region separated from the first region by a wall; and a detector for detecting an increased flow speed of the insulating fluid. The detector includes: a flow flap in the first region configured to tilt from a defined flow speed of the insulating fluid from a first position to a second position; a first magnet secured to the flap such that in the second position of the flow flap, the first magnet is in an immediate vicinity of the wall; a second magnet in the second region in the immediate vicinity of the wall; and a switch in the second region that is operationally coupled to the second magnet such that tilting over of the flow flap from the first position to the second position actuates the switch.
COOLING ARRANGEMENT FOR A HIGH VOLTAGE POWER DEVICE
The invention is concerned with a cooling arrangement for a high voltage power device in an enclosure and immersed in an insulating fluid. The arrangement includes a cooling device for placing in the interior of the enclosure and having a channel formed as a duct for the insulating fluid the duct having a first wall including a phase change material for cooling insulating fluid that passes through the channel. The invention is also concerned with a method of operating a valve of a cooling device in such a cooling arrangement.
COOLING ARRANGEMENT FOR A HIGH VOLTAGE POWER DEVICE
The invention is concerned with a cooling arrangement for a high voltage power device in an enclosure and immersed in an insulating fluid. The arrangement includes a cooling device for placing in the interior of the enclosure and having a channel formed as a duct for the insulating fluid the duct having a first wall including a phase change material for cooling insulating fluid that passes through the channel. The invention is also concerned with a method of operating a valve of a cooling device in such a cooling arrangement.
FRACTAL SWITCHING SYSTEMS AND RELATED ELECTROMECHANICAL DEVICES
This invention entails the use of fractal shapes as cores for electromagnets, and a concurrent shape of a fractal for the windings which surround it. The novelty of this invention lies not only with the shaping, but the advantage of such shaping, which includes producing a smaller form factor electromagnet for the same desired magnetic field strength, when compared to a conventional electromagnet. It will be appreciated that a range of devices including electromagnets, based on such fractal shaping, are additionally novel and include but are not limited to solenoid switches, relays, and other devices in which the fractal electromagnets are used to make a change in state of some device.