An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.

An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.

A multilayer capacitor includes a ceramic body including a dielectric layer, and having first to sixth surfaces, connected to the first surface to the fourth surface and opposing each other, a plurality of internal electrodes disposed inside the ceramic body, exposed to the fifth surface and the sixth surface, and having one ends exposed to the third surface or the fourth surface, and a first side margin portion and a second side margin portion disposed on end portions of the internal electrode, exposed to the fifth surface and the sixth surface, the first and second side margin portions are divided into an inner layer formed to be adjacent to the ceramic body, and an outer layer formed on the inner layer, and a dielectric constant of the inner layer is lower than a dielectric constant of the outer layer.

A multilayer ceramic electronic component includes multilayer ceramic electronic component bodies each including a laminate and first and second outer electrodes respectively disposed on two end surfaces of the laminate, first and second metal terminals respectively connected to the first and second outer electrodes, and first and second terminal blocks respectively connected to the first and second metal terminals. A thickness dimension of each multilayer ceramic electronic component body in a height direction is less than a width dimension of the multilayer ceramic electronic component body in a width direction. Each multilayer ceramic electronic component body is disposed such that a first or second side surface faces a mounting surface. The first and second metal terminals are respectively disposed astride the first and second outer electrodes of the multilayer ceramic electronic component bodies.

The present invention is directed to a multilayer ceramic capacitor that includes a plurality of active electrodes and at least one shield electrode that are each arranged within a monolithic body and parallel with a longitudinal direction. The capacitor may exhibit a first insertion loss value at a test frequency, which may be greater than about 2 GHz, in a first orientation relative to the mounting surface. The capacitor may exhibit a second insertion loss value at about the test frequency in a second orientation relative to the mounting surface and the capacitor is rotated 90 degrees or more about the longitudinal direction with respect to the first orientation. The longitudinal direction of the capacitor may be parallel with the mounting surface in each of the first and second orientations. The second insertion loss value may differ from the first insertion loss value by at least about 0.3 dB.

An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

A multi-layer ceramic electronic component includes a ceramic body and a pair of external electrodes. The ceramic body includes a pair of main surfaces perpendicular to a first axis, a pair of end surfaces perpendicular to a second axis, a pair of side surfaces perpendicular to a third axis, and internal electrodes drawn to the end surfaces, and has a substantially rectangular parallelepiped shape. The external electrodes each include an end-surface-covering portion that covers one of the end surfaces, and a main-surface-covering portion that is formed to be continuous from the end-surface-covering portion and covers a part of the main surface. The main-surface-covering portion includes a conductive resin layer, and first and second convex portions formed on the basis of a shape of the conductive resin layer, each swelling toward the center in the direction of the second axis, and disposed apart from each other in the third axis direction.

An electronic component with a metal terminal includes a plurality of electronic components each including an element body and a pair of external electrodes provided on each of a pair of end surfaces facing each other in an X direction in the element body, and disposed in a Y direction, and a pair of plate-shaped metal terminals each including a plurality of joint portions to which external electrodes of the plurality of electronic components are joined, and a leg portion provided to protrude further than the electronic component in a Z direction, wherein a portion of the metal terminal that extends in the Y direction to straddle the plurality of joint portions is an easily deformable portion made of a second metal material having a Young's modulus smaller than that of a first metal material constituting the other portion.

An electronic component with a metal terminal includes a plurality of electronic components each including an element body and a pair of external electrodes provided on each of a pair of end surfaces facing each other in an X direction in the element body, and disposed in a Y direction, and a pair of plate-shaped metal terminals each including a plurality of joint portions to which external electrodes of the plurality of electronic components are joined, and a leg portion provided to protrude further than the electronic component in a Z direction, wherein a portion of the metal terminal that extends in the Y direction to straddle the plurality of joint portions is an easily deformable portion made of a second metal material having a Young's modulus smaller than that of a first metal material constituting the other portion.

This invention concerns a power module comprising a power device, a baseplate, circuit carrier, and a flat stacked aluminium electrolytic snubber capacitor comprising a layered structure of a cathode layer, a separator layer, comprising paper and an electrolyte and an anode layer, comprising an aluminium material with an aluminium oxide dielectric, wherein the circuit carrier are mounted on the baseplate, the power device and snubber capacitor are placed on the circuit carrier within the power module and electrically connected to the circuit carrier, the circuit carrier being configured for providing an electrical connection between the power device and the snubber capacitor.