A parallel plate capacitor including a cathode core that further includes a pair of parallel electrodes and a dielectric material layer positioned between the pair of parallel electrodes. The capacitor also includes a dielectric liquid medium, where the cathode core is at least partially submerged in the dielectric liquid medium.

A multilayer ceramic electronic component includes multilayer ceramic electronic component bodies each including a laminate and first and second outer electrodes respectively disposed on two end surfaces of the laminate, first and second metal terminals respectively connected to the first and second outer electrodes, and first and second terminal blocks respectively connected to the first and second metal terminals. A thickness dimension of each multilayer ceramic electronic component body in a height direction is less than a width dimension of the multilayer ceramic electronic component body in a width direction. Each multilayer ceramic electronic component body is disposed such that a first or second side surface faces a mounting surface. The first and second metal terminals are respectively disposed astride the first and second outer electrodes of the multilayer ceramic electronic component bodies.

A multilayer ceramic electronic component includes multilayer ceramic electronic component bodies each including a laminate and first and second outer electrodes respectively disposed on two end surfaces of the laminate, first and second metal terminals respectively connected to the first and second outer electrodes, and first and second terminal blocks respectively connected to the first and second metal terminals. A thickness dimension of each multilayer ceramic electronic component body in a height direction is less than a width dimension of the multilayer ceramic electronic component body in a width direction. Each multilayer ceramic electronic component body is disposed such that a first or second side surface faces a mounting surface. The first and second metal terminals are respectively disposed astride the first and second outer electrodes of the multilayer ceramic electronic component bodies.

A material for 3D printing is described. The material comprises a polymeric composition comprising a thermoplastic polymer; and from 50 to 99 wt. % ceramic particles comprising a metal, wherein at least 50% by weight of the particles have a diameter in a range from 10 to 100 μm; wherein the material has a dielectric strength of at least 5 kV/mm and/or a dielectric constant of at least 5.

A material for 3D printing is described. The material comprises a polymeric composition comprising a thermoplastic polymer; and from 50 to 99 wt. % ceramic particles comprising a metal, wherein at least 50% by weight of the particles have a diameter in a range from 10 to 100 μm; wherein the material has a dielectric strength of at least 5 kV/mm and/or a dielectric constant of at least 5.

An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.

A metal-oxide-semiconductor (MOS) capacitor can include a substrate including a semiconductor material, an oxide layer formed on a surface of the substrate, a conductive layer formed over at least a portion of the oxide layer, a first terminal connected with the surface of the substrate, and a second terminal connected with the conductive layer. The oxide layer can be connected in series between the substrate and the conductive layer to form a capacitor between the first terminal and the second terminal. Each of the first terminal and the second terminal can be exposed along the surface of the substrate for surface mounting the capacitor. The MOS capacitor can exhibit excellent high frequency performance. For example, an insertion loss of the MOS capacitor can be greater than about −0.75 dB for frequencies ranging from about 5 GHz to about 40 GHz.

An LC filter includes a multilayer body including dielectric layers layered therein, plate electrodes, capacitor electrodes, inductor vias, and ground vias. The plate electrodes are provided on different layers of the multilayer body. The capacitor electrodes each define a capacitor between itself and the electrode. The inductor via is connected with the electrode and the capacitor electrode, while the inductor via is connected with the electrode and the capacitor electrode. The ground vias connect the plate electrodes to each other. The inductor via and the capacitor electrode define a resonance circuit that receives a signal from an input terminal. The inductor via and the capacitor electrode define a resonance circuit that transfers a signal to the output terminal.