Electronic device package stiffener and capacitor technology is disclosed. A combination stiffener and capacitor can include a structural material configured to be coupled to a substrate. The structural material can have a shape configured to provide mechanical support for the substrate. The combination stiffener and capacitor can also include first and second electrodes forming a capacitor. An electronic device package and a package substrate configured to receive the combination stiffener and capacitor are also disclosed.

Electronic device package stiffener and capacitor technology is disclosed. A combination stiffener and capacitor can include a structural material configured to be coupled to a substrate. The structural material can have a shape configured to provide mechanical support for the substrate. The combination stiffener and capacitor can also include first and second electrodes forming a capacitor. An electronic device package and a package substrate configured to receive the combination stiffener and capacitor are also disclosed.

A multilayer ceramic electronic component includes a laminate including dielectric ceramic layers and at least a pair of internal electrode layers laminated together, the laminate including a pair of main surfaces that oppose each other in a lamination direction, a pair of side surfaces that oppose each other in a width direction perpendicular or substantially perpendicular to the lamination direction, and a pair of end surfaces that oppose each other in a length direction perpendicular or substantially perpendicular to the lamination direction and the width direction, a pair of side surface layers respectively provided on the side surfaces of the laminate, a pair of main surface layers covering interfaces between the laminate and the side surface layers respectively provided on the main surfaces of the laminate, and a pair of external electrodes respectively connected to the internal electrode layers respectively provided on the end surfaces of the laminate.

A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and having a rectangular parallelepiped shape, and first and second outer electrodes covering both end surfaces of the multilayer body and extending from both the end surfaces so as to cover at least portions of a first main surface, a second main surface, a first side surface, and a second side surface of the multilayer body. An insulating layer is provided on a surface of the first main surface of the multilayer body. The first outer electrode and the second outer electrode disposed on the first main surface side are disposed on the insulating layer.

A multilayer ceramic electronic component includes a multilayer body including layered ceramic layers and having a rectangular parallelepiped shape, and first and second outer electrodes covering both end surfaces of the multilayer body and extending from both the end surfaces so as to cover at least portions of a first main surface, a second main surface, a first side surface, and a second side surface of the multilayer body. An insulating layer is provided on a surface of the first main surface of the multilayer body. The first outer electrode and the second outer electrode disposed on the first main surface side are disposed on the insulating layer.

A multilayer capacitor includes a body including a plurality of dielectric layers, an active region and upper and lower cover regions; first and second internal electrodes disposed with the dielectric layer interposed therebetween in the active region to be alternately exposed through both end surfaces of the body; and first and second external electrodes disposed on both ends of the body and connected to the first and second internal electrodes, respectively. The body further includes a buffer layer including first and second dummy electrodes disposed on a lower surface of the lower cover region to be spaced apart from each other in a length direction of the body, and a groove is recessed in a lower surface of the buffer layer.

Electrical energy storage device (1), including at least one electrical component (2) and a busbar (5) for electrical power distribution, where the electrical component (2) is arranged on the busbar (5), and at least a first contact side (11) and/or a second contact side (12) of the electrical component (2) is connected to the busbar (5) by a contact element (8), and wherein the contact element (8) is formed at least partially as a mesh (7). The electrical component (2) is preferably a capacitor.

Electrical energy storage device (1), including at least one electrical component (2) and a busbar (5) for electrical power distribution, where the electrical component (2) is arranged on the busbar (5), and at least a first contact side (11) and/or a second contact side (12) of the electrical component (2) is connected to the busbar (5) by a contact element (8), and wherein the contact element (8) is formed at least partially as a mesh (7). The electrical component (2) is preferably a capacitor.

A multilayer ceramic electronic component includes a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; and an external electrode disposed on one of the third and fourth surfaces and extending onto the first and second surfaces of. A relational expression of 0.9≤A/BW<1.0 is satisfied, where a shortest distance, in the second direction, from an end portion of the ceramic body which the external electrode is disposed at to an end portion of the external electrode disposed on one of the first and second surfaces, is denoted by “A”, and a longest distance, in the second direction, from the end portion of the ceramic body to the end portion of the external electrode, is denoted by “BW”.

An implantable pulse generator including a header, a can, and a filtered feedthrough assembly. The header including lead connector blocks. The can coupled to the header and including a wall and an electronic substrate housed within the wall. The filtered feedthrough assembly including a flange mounted to the can and having a feedthrough port, a plurality of feedthrough wires extending through the feedthrough port, and an insulator brazed to the feedthrough port of the flange. The filtered feedthrough assembly further including a capacitor having the plurality of feedthrough wires extending there through, an insulating washer positioned between and abutting the insulator and the capacitor at least in the area of the braze joint such that the capacitor and the braze joint are non-conductive, and an electrically conductive material adhered to the capacitor and the flange for grounding of the capacitor.