The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.

An insulating device includes a first electrode, a second electrode, and an insulating film. The insulating film is located between the first electrode and the second electrode. The insulating film includes a positive charged region. The positive charged region is located at a portion in a direction from the first electrode toward the second electrode.

A capacitor component includes a body including a dielectric layer, a layering portion in which first and second internal electrodes opposing each other are layered in a first direction, and first and second connecting portions disposed on both surfaces of the layering portion taken in a second direction perpendicular to the first direction and connected to the first and second internal electrodes, respectively; and first and second external electrodes disposed on the first and second connecting portions, respectively, and the first and second external electrodes include metal powder particles, a surface of each of which is coated with at least one of graphene and carbon nanotubes.

A capacitor includes a capacitor element, a case that houses the capacitor element and contains a resin, a metal plate insert molded in the case, and a filler resin filled in the case. The metal plate includes a main plate portion and a covered portion disposed along a perimeter of the main plate portion. The main plate portion has an outer surface exposed outwardly from an opening of the case. The covered portion has an outer surface covered by a peripheral portion of the case, the peripheral portion being disposed around the opening.

A capacitor includes a capacitor element, a case that houses the capacitor element and contains a resin, a metal plate insert molded in the case, and a filler resin filled in the case. The metal plate includes a main plate portion and a covered portion disposed along a perimeter of the main plate portion. The main plate portion has an outer surface exposed outwardly from an opening of the case. The covered portion has an outer surface covered by a peripheral portion of the case, the peripheral portion being disposed around the opening.

A method for manufacturing a multilayer ceramic electronic device includes punching out a ceramic sheet by one of left and right side surfaces of a laminated body so as to form a side margin part on the one of the left and right side surfaces of said laminated body; and punching out another ceramic sheet by another of the left and right side surfaces of the laminated body so as to form a side margin part on the another of the left and right side surfaces of said laminated body, thereby forming a ceramic main body having the laminated body and the pair of side margin parts that respectively cover the left and right side surfaces of the laminated body. The width W is greater than the length L in the multilayer ceramic electronic device.

A method for manufacturing a multilayer ceramic electronic device includes punching out a ceramic sheet by one of left and right side surfaces of a laminated body so as to form a side margin part on the one of the left and right side surfaces of said laminated body; and punching out another ceramic sheet by another of the left and right side surfaces of the laminated body so as to form a side margin part on the another of the left and right side surfaces of said laminated body, thereby forming a ceramic main body having the laminated body and the pair of side margin parts that respectively cover the left and right side surfaces of the laminated body. The width W is greater than the length L in the multilayer ceramic electronic device.

A capacitor module includes a capacitor element, a plurality of connection terminals for electrically connecting the capacitor element to a semiconductor module and a power supply that are another equipment, and an exterior coating that includes a resin film having electrical insulating property and wraps the capacitor element except the plurality of connection terminals.

A capacitor module includes a capacitor element, a plurality of connection terminals for electrically connecting the capacitor element to a semiconductor module and a power supply that are another equipment, and an exterior coating that includes a resin film having electrical insulating property and wraps the capacitor element except the plurality of connection terminals.

A wiring board includes an insulating layer, a thin film capacitor laminated on the insulating layer, an interconnect layer electrically connected to the thin film capacitor, and an encapsulating resin layer laminated on the thin film capacitor. The interconnect layer includes a pad protruding from the thin film capacitor. The encapsulating resin layer is a mold resin having a non-photosensitive thermosetting resin as a main component thereof. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad.