The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.

The present disclosure relates to a case molding including: a plastic case having an accommodation chamber formed by four sides and a bottom to accommodate the capacitor module, and having an open side on the top for filling a molding agent; a capacitor module including a capacitor device, a first busbar electrically connected with a thermally-sprayed surface of the capacitor device, a second busbar electrically connected with the other thermally-sprayed surface of the capacitor, and an insulating sheet disposed between the first busbar and the second busbar; a filler permeating in a gel or fluid state into the space between the capacitor module and inner walls of the plastic case, and then hardened therein; and a horizontal plate part positioned over the capacitor module and the filler, and has a horizontal plate integrated thereto with the bottom pressing the filler.

A multilayer electronic component according to another exemplary embodiment of the present disclosure may prevent penetration of moisture by disposing the sealing portions between an external electrode and a body, wherein the sealing portions includes a first sealing portion and a second sealing portion, and an average length of the second sealing portion is 20 μm or more.

A multilayer electronic component according to another exemplary embodiment of the present disclosure may prevent penetration of moisture by disposing the sealing portions between an external electrode and a body, wherein the sealing portions includes a first sealing portion and a second sealing portion, and an average length of the second sealing portion is 20 μm or more.

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

A cooling system for a capacitor may include a housing for the capacitor, the housing comprising of a bottom surface, a top surface, and at least one side surface connecting the bottom surface and the top surface, the housing further including: a bottom inlet manifold and a bottom outlet manifold extending along the bottom surface; an inlet side channel extending along the side surface, the inlet side channel being in fluid communication with the bottom inlet manifold; an outlet side channel extending along the side surface, the outlet side channel being in fluid communication with the bottom outlet manifold; a top inlet manifold extending along the top surface, the top inlet manifold being in fluid communication with the inlet side channel; and a top outlet manifold extending along the top surface, the top outlet manifold being in fluid communication with the outlet side channel.

A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.

A body includes dielectric films, first electrode films, and second electrode films being stacked on one another or being wound together. A first external electrode is at one end of the body and electrically connected to the first electrode films. A second external electrode is at another end of the body and electrically connected to the second electrode films. The body includes a capacitance portion in which each of the first electrode films faces a corresponding second electrode film of the second electrode films with a corresponding dielectric film of the dielectric films in between, and the capacitance portion includes spaces each between a corresponding dielectric film of the dielectric films and a corresponding first electrode film of the first electrode films or between a corresponding dielectric film of the dielectric films and a corresponding second electrode film of the second electrode films.