A method of manufacturing a winding capacitor package structure is provided. The method of manufacturing the winding capacitor package structure includes: forming a base layer on an inner bottom surface of a casing structure; placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure; sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and then placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure. The casing structure includes a main casing for enclosing the base layer and the filling layer and a retaining body inwardly bent from a bottom side of the main casing, and the base layer and the filling layer are retained and limited inside the casing structure by the retaining body.

A method of manufacturing a winding capacitor package structure is provided. The method of manufacturing the winding capacitor package structure includes: forming a base layer on an inner bottom surface of a casing structure; placing a winding assembly and a part of a conductive assembly inside an accommodating space of the casing structure; sequentially forming a plurality of filling layers between the winding assembly and the casing structure; and then placing a bottom carrier frame on a bottom portion of the casing structure so as to match with the casing structure. The casing structure includes a main casing for enclosing the base layer and the filling layer and a retaining body inwardly bent from a bottom side of the main casing, and the base layer and the filling layer are retained and limited inside the casing structure by the retaining body.

A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a first portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions, the insulating layer including a first glass and a first oxide including aluminum (Al).

A multilayer electronic component includes a body and first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer includes an oxide including silicon (Si).

A multilayer electronic component includes a body and first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer includes an oxide including silicon (Si).

An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other, having at least one dielectric layer interposed therebetween in a first direction; and first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to the at least one first internal electrode and the at least one second internal electrode. The body further includes a cover layer disposed to overlap the capacitance region in the first direction, and 1.11 or more is a value obtained by dividing a sum of respective major-axis lengths Lx of a plurality of crystal grains included in the cover layer by a sum of respective minor-axis lengths Sx of the plurality of crystal grains.

A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.

A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween in a first direction, first and second side margin portions respectively disposed on surfaces of the body in a third direction, and external electrodes respectively disposed on surfaces of the body in a second direction. The first side margin portion includes first dielectric grains, the dielectric layer includes second dielectric grains, and in cross-sections of the first side margin portion and the body in the first and third directions, a ratio of a major axis length to a minor axis length of the first dielectric grain is 3 or greater and 30 or less, and a ratio of a major axis length to a minor axis length of the second dielectric grain is 1.5 or less.

A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on a portion of the first surface, and a third band portion on a portion of the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on a portion of the first surface, and a fourth band portion on a portion of the second surface, an insulating layer disposed on the first and second connection portions and covering the second surface and the third and fourth band portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes an oxide containing Ba.