An energy storage device includes: an external terminal having any one of positive and negative polarities and including a protrusion and a first terminal; a case having a polarity opposite to the external terminal and including an extension; a substrate disposed to surround an outer circumference of the protrusion of the external terminal through a hole formed at a center thereof; and a connection member located at an upper surface of the substrate and coupled to the first terminal of the external terminal, wherein the first terminal and the substrate are connected by means of the connection member, and the extension is connected to the substrate. Since positive and negative electrodes of the energy storage device are electrically connected to a substrate having a cell balancing function without a harness or any other member, it is possible to improve the economic feasibility and productivity of the energy storage device module.

A positioning jig assembly includes a positioning main body with holes into which electronic component bodies are respectively press-fit, a first and a second guide bodies disposed to be superimposed on the positioning main body in a planar view. First through-holes are formed in the first guide body. Second through-holes formed in the second guide body guide the electronic component main bodies to the first through-holes. The first through-holes provisionally position the electronic component main bodies. When height in the first direction of the electronic component main bodies is represented as H, lengths of the first through-hole and the second through-hole are respectively represented as L1 and L2, and depth of the hole is represented as D, L1<H<D+L1+L2 and D<H hold.

The insulating member is integrated with only one of the busbars by insert molding in which one of opposing plate members in either one of the busbars is used as an insert target. The insulating member includes an insulation active portion, a reinforcing portion and a connecting portion. The insulation active portion is disposed on a back-surface side of one of the opposing plate portions and is interposed between the back-surface side and the other one of the opposing plate portions. The reinforcing portion is disposed on the front-surface side of the one of the opposing plate portions.

The connecting portion serves to connect the insulation active portion and the reinforcing portion into an integral unit. In the insulating member, lower end regions of the insulation active portion, reinforcing portion and connecting portion, which are close to the capacitor element and extending from an upper-surface side to a lower-surface side of a side plate portion, are embedded in a mold resin that covers the side plate portion.

The insulating member is integrated with only one of the busbars by insert molding in which one of opposing plate members in either one of the busbars is used as an insert target. The insulating member includes an insulation active portion, a reinforcing portion and a connecting portion. The insulation active portion is disposed on a back-surface side of one of the opposing plate portions and is interposed between the back-surface side and the other one of the opposing plate portions. The reinforcing portion is disposed on the front-surface side of the one of the opposing plate portions.

The connecting portion serves to connect the insulation active portion and the reinforcing portion into an integral unit. In the insulating member, lower end regions of the insulation active portion, reinforcing portion and connecting portion, which are close to the capacitor element and extending from an upper-surface side to a lower-surface side of a side plate portion, are embedded in a mold resin that covers the side plate portion.

A capacitor is disclosed that includes a plurality of electrically conductive capacitor layers wound around a winding center and a cooling channel, wherein the cooling channel is disposed between the capacitor layers, and wherein the cooling channel is electrically conductive. A system and a motor vehicle that includes the capacitors is also disclosed.

A capacitor is disclosed that includes a plurality of electrically conductive capacitor layers wound around a winding center and a cooling channel, wherein the cooling channel is disposed between the capacitor layers, and wherein the cooling channel is electrically conductive. A system and a motor vehicle that includes the capacitors is also disclosed.

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.

A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.

A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.