A chip capacitor includes a substrate having a main surface, a first conductive film including a first connecting region and a first capacitor forming region and formed on the main surface of the substrate, a dielectric film covering the first capacitor forming region of the first conductive film, a second conductive film including a second connecting region facing to the first capacitor forming region of the first conductive film across the dielectric film, and a second capacitor forming region facing to the first capacitor forming region of the first conductive film across the dielectric film, a first external electrode electrically connected to the first connecting region of the first conductive film, and a second external electrode electrically connected to the second connecting region of the second conductive film.

A capacitor module includes at least one capacitor element (101) and a cooling structure (103) for cooling the capacitor element. The electrical terminals (102a, 102b) of the capacitor element are mechanically connected to the cooling structure to be in heat-conductive relations with the cooling structure so that at least one of the electrical terminals of the capacitor element is mechanically connected to the cooling structure via a flexible connection element (104a, 104b) made of electrically conductive material. The flexible connection element allows the corresponding electrical terminal to move with respect to the cooling structure when the distance (D) between the electrical terminals is changing because of changes in load and/or temperature, and/or because of ageing.

A capacitor module includes at least one capacitor element (101) and a cooling structure (103) for cooling the capacitor element. The electrical terminals (102a, 102b) of the capacitor element are mechanically connected to the cooling structure to be in heat-conductive relations with the cooling structure so that at least one of the electrical terminals of the capacitor element is mechanically connected to the cooling structure via a flexible connection element (104a, 104b) made of electrically conductive material. The flexible connection element allows the corresponding electrical terminal to move with respect to the cooling structure when the distance (D) between the electrical terminals is changing because of changes in load and/or temperature, and/or because of ageing.

An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, and a frame terminal having a supporting portion disposed on the external electrode, and a mounting portion disposed at one end of the supporting portion. The supporting portion has a concave portion spaced apart from the mounting portion and having a distance to the mounting portion less than a distance from the capacitor boy to the mounting portion.

An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, and a frame terminal having a supporting portion disposed on the external electrode, and a mounting portion disposed at one end of the supporting portion. The supporting portion has a concave portion spaced apart from the mounting portion and having a distance to the mounting portion less than a distance from the capacitor boy to the mounting portion.

An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, a frame terminal disposed on the external electrode, and a conductive bonding portion disposed between the external electrode and the frame terminal. The frame terminal has a groove portion extending along an outer periphery of an area in contact with the conductive bonding portion.

An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, a frame terminal disposed on the external electrode, and a conductive bonding portion disposed between the external electrode and the frame terminal. The frame terminal has a groove portion extending along an outer periphery of an area in contact with the conductive bonding portion.

A capacitor with a first voltage layer guided around the capacitor structure, so that the first voltage layer and the second planar electrode of the capacitor form an overlap region in which the first voltage layer and the second planar electrode are arranged, parallel to one another and separated from one another by a gap, on a base side of the capacitor directly one above the other, wherein the first voltage layer is arranged on an outer side of the second planar electrode, which outer side is averted from the capacitor structure).

A capacitor with a first voltage layer guided around the capacitor structure, so that the first voltage layer and the second planar electrode of the capacitor form an overlap region in which the first voltage layer and the second planar electrode are arranged, parallel to one another and separated from one another by a gap, on a base side of the capacitor directly one above the other, wherein the first voltage layer is arranged on an outer side of the second planar electrode, which outer side is averted from the capacitor structure).

A capacitor comprising first and second end sprays respectively located at distal ends of a capacitor cell, a positive polarity bus bar extending from a first wound conductive layer of the capacitor cell adjacent to the first end spray, a negative polarity bus bar extending from a second wound conductive layer of the capacitor cell adjacent to the second end spray, and a capacitor film wrapped around an area between the first and second conductive layers.