Disclosed is an assembly including a busbar that includes: a first layer that defines: first layer top and bottom surfaces; first layer first and second ends; and a first layer center region between the first layer first and second ends; and the first layer forms first layer perforations of different sizes about the first layer center region so perforations closer to the first layer first end are smaller than perforations spaced apart therefrom; a second layer that is disposed against and electrically isolated from the first layer bottom surface, wherein the second layer defines connector orifices having a same size as each other that are aligned with the first layer perforations; and a first capacitor supported against and electrically connected to the first layer top surface, wherein the first capacitor includes busbar connectors that respectively extend through the first layer perforations to electrically connect with the connector orifices.

Disclosed is an assembly including a busbar that includes: a first layer that defines: first layer top and bottom surfaces; first layer first and second ends; and a first layer center region between the first layer first and second ends; and the first layer forms first layer perforations of different sizes about the first layer center region so perforations closer to the first layer first end are smaller than perforations spaced apart therefrom; a second layer that is disposed against and electrically isolated from the first layer bottom surface, wherein the second layer defines connector orifices having a same size as each other that are aligned with the first layer perforations; and a first capacitor supported against and electrically connected to the first layer top surface, wherein the first capacitor includes busbar connectors that respectively extend through the first layer perforations to electrically connect with the connector orifices.

An electronic component device includes an electronic component, a pair of metal terminals, a bonding member, and an expansion member having thermal expansibility. The electronic component includes an element body and a pair of external electrodes. The element body has a pair of end faces opposed to each other. The pair of external electrodes is disposed on the pair of end faces. The pair of metal terminals is electrically connected to the pair of external electrodes. The bonding member bonds one of the pair of external electrodes to one of the pair of metal terminals. The bonding member electrically connects the one of the pair of external electrodes to the one of the pair of metal terminals. The one of the pair of metal terminals includes an opposing face. The opposing face is a flat face.

An electronic component device includes an electronic component, a pair of metal terminals, a bonding member, and an expansion member having thermal expansibility. The electronic component includes an element body and a pair of external electrodes. The element body has a pair of end faces opposed to each other. The pair of external electrodes is disposed on the pair of end faces. The pair of metal terminals is electrically connected to the pair of external electrodes. The bonding member bonds one of the pair of external electrodes to one of the pair of metal terminals. The bonding member electrically connects the one of the pair of external electrodes to the one of the pair of metal terminals. The one of the pair of metal terminals includes an opposing face. The opposing face is a flat face.

An embodiment of the present disclosure provides a MIM capacitor by High-k dielectric and method for fabricating the same to prevent formation of oxygen-based interface films between a lower electrode and a dielectric layer, and between an upper electrode and a dielectric layer by stacking a first film formed of metal between the dielectric layer formed of a High-k material having a high dielectric constant and the lower electrode formed of metal, and a second film formed of metal between the dielectric layer and the upper electrode.

A capacitor that includes a substrate having a first principal surface and a second principal surface, a lower electrode on the first principal surface, a dielectric film on the lower electrode, and an upper electrode on the dielectric film, wherein at least one of the lower electrode and the upper electrode has, in plan view of the first principal surface, a first region having a rectangular shape, and at least one second region protruding from at least one side of the first region.

A capacitor that includes a substrate having a first principal surface and a second principal surface, a lower electrode on the first principal surface, a dielectric film on the lower electrode, and an upper electrode on the dielectric film, wherein at least one of the lower electrode and the upper electrode has, in plan view of the first principal surface, a first region having a rectangular shape, and at least one second region protruding from at least one side of the first region.

An energy storage apparatus includes: an energy storage unit including an energy storage device; a substrate electrically connected to the energy storage unit; a cover disposed on one side in a first direction of the substrate; and a cable in which one end is electrically connected to the energy storage unit while the other end is connected to an external conductive member of the energy storage apparatus. The cable is disposed on one side in the first direction of at least a part of the cover while connected to the external conductive member.

An onboard power supply device includes capacitors, a holder holding the capacitors, a mounting board having the capacitors mounted thereon and having the holder fixed thereto, and a heat-generating component mounted on the mounting board. Each of the capacitors includes a capacitor body and a lead terminal extending from the capacitor body. The holder includes a base part, first holding parts bundled by the base part and holding the capacitors, second holding parts each connected to a corresponding one of the first holding parts, and a fixing part extending from an outer edge of the base part toward the mounting board and fixed to the mounting board. The capacitor body of each of the capacitors is held by a corresponding one of the first holding parts. The lead terminal of each of the capacitors is held by a corresponding one of the second holding parts. The mounting board has a through-hole therein through which the lead terminal passes. The through-hole is connected to the lead terminal. The corresponding one of the second holding parts has a holding through-hole therein extending along a through-axis coinciding with the through-hole. An inner wall of the holding through-hole contacts the lead terminal. This onboard power supply device has a small size.

A semiconductor device is provided that includes a substrate 10 with first and second opposing main surfaces, a circuit layer disposed on the first main surface, and a first resin body on a surface of the circuit layer opposite from the substrate. The circuit layer includes first and second electrode layers on a side of the semiconductor substrate, a dielectric layer disposed between the electrode layers, a first outer electrode electrically connected to the first electrode layer and extended to the surface of the circuit layer, and a second outer electrode electrically connected to the second electrode layer and extended to the surface of the circuit layer. The first resin body is between the first and second outer electrodes in a plan view, and in sectional view, a tip end of the first resin body is positioned higher than tip ends of the first and second outer electrodes.