A vibration device includes a semiconductor substrate having a first surface and a second surface in an obverse-reverse relationship, a vibration element disposed on the first surface, a lid bonded to the first surface, an integrated circuit disposed on the first surface, a terminal disposed on the second surface, a through electrode which penetrates the semiconductor substrate, and is configured to electrically couple the terminal and the integrated circuit to each other, and a first capacitor which is provided with a first recess provided to the semiconductor substrate and opening in the first surface, an insulating film disposed on an inside surface of the first recess, and an electrically-conductive material filling the first recess, and has a first capacitance between the electrically-conductive material and the semiconductor substrate, wherein the electrically-conductive material does not have contact with the terminal at the second surface side.

A hard start capacitor replacement unit includes a capacitor container having a cover, a plurality of capacitors received within the container, each of said capacitors having a capacitance value, a common terminal mounted on the cover and electrically connected to a common terminal of each of said plurality of capacitors, a plurality of cover terminals mounted on the cover spaced apart from the common terminal and from each other, each cover terminal respectively electrically connected to one of the plurality of capacitors, a relay having contacts and being capable of opening and closing said contacts in response to a monitored condition of the motor, the relay having relay terminals, a fuse electrically connected to one of the relay terminals by a first wire wherein the fuse electrically disconnects the hard start capacitor replacement unit and the motor upon a failure, and a second wire electrically connecting one of the relay terminals and the motor, a third wire electrically connecting the common terminal and one of the relay terminals, a fourth wire electrically connecting one or more cover terminals to one of the relay terminals, wherein the contacts of the relay close to electrically connect one or more capacitors of the plurality of capacitors to the motor, and the contacts of the relay open to electrically disconnect the one or more capacitors of the plurality of capacitors from the motor.

The present disclosure provides a chip part. The chip part includes: a substrate, having a first main surface and a second main surface opposite to the first main surface; a capacitive film, disposed on the first main surface; a plurality of first external electrodes, disposed on the capacitive film and separated from each other; a second external electrode, disposed on the second main surface; a resistance layer, disposed between the capacitive film and the plurality of first external electrodes, and formed across the plurality of first external electrodes.

A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.

A capacitor structure is provided, which includes a contact layer, an insulating layer, a bottom conductive plate, a dielectric layer and a top conductive plate. The contact layer has first, second, third, fourth and fifth portions arranged from periphery to center. The insulating layer is disposed over the contact layer and has an opening exposing the contact layer. The bottom conductive plate is disposed in the opening and including first, second and third portions extending along a depth direction of the opening and separated from each other and in contact with the first, third and fifth portions of the contact layer, respectively. The dielectric layer is conformally disposed on the bottom conductive plate and in contact with the second and fourth portions of the contact layer. The top conductive plate is disposed on the dielectric layer. A method of manufacturing the capacitor is also provided.

The present disclosure provides a chip part. The chip part includes a substrate, a first external electrode, a second external electrode, a capacitor portion, a lower electrode, a capacitive film and an upper electrode. The first external electrode and the second external electrode are disposed on a first main surface of the substrate. The capacitor portion is disposed on the first main surface of the substrate. The lower electrode includes a first body portion and a first peripheral portion integrally drawn out around the capacitor portion from the first body portion. The capacitive film includes a second body portion disposed within the capacitor portion and a second peripheral portion integrally drawn out from the second body portion to the first peripheral portion. The upper electrode is disposed on the capacitive film.

The present disclosure provides a chip part. The chip part includes a substrate, a capacitor portion and a substrate body portion. The capacitor portion includes a plurality of wall portions having a lengthwise direction and separated from each other by a trench formed on a first main surface of the substrate. The substrate body portion is formed around the capacitor portion using a portion of the substrate. The plurality of wall portions are formed of a plurality of pillar units. The capacitor portion, in the plan view, includes a first capacitor portion and a second capacitor portion. The first capacitor portion includes the plurality of wall portions having the lengthwise direction as a first lengthwise direction. The second capacitor portion includes the plurality of wall portions having the lengthwise direction as a second lengthwise direction orthogonal to the first lengthwise direction.

The present application discloses a flexible flat cable and a display panel. The flexible flat cable includes a substrate, a first terminal and a second terminal. The substrate is insulating, and the first terminal and the second terminal are disposed at the first end and the second end of the substrate respectively, and are coupled with each other by a capacitor assembly.

The present application discloses a flexible flat cable and a display panel. The flexible flat cable includes a substrate, a first terminal and a second terminal. The substrate is insulating, and the first terminal and the second terminal are disposed at the first end and the second end of the substrate respectively, and are coupled with each other by a capacitor assembly.

A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension unit extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension unit. The electrode facing portion has a recess dented in a direction away from the terminal electrode. A center of the recess is located below a center of the electrode facing portion in a height direction.