A device and its method of manufacture, the device configured for providing electrical energy storage of high specific energy density. The device contains one or more layers of high dielectric constant material, such as Barium Titanate or Hexagonal Barium Titanate, sandwiched between electrode layers made up of one or more of a variety of possible conducting materials. The device includes one or more electrically insulating layers including carbon, such as carbon formed into diamond or a diamond-like arrangement, for insulating the electrode(s) from the dielectric layer(s) to provide for very high breakdown voltages with good heat conductivity. The layers can be created by a variety of methods including laser deposition, and assembled to form a capacitor device provides the high energy density storage.

A device and its method of manufacture, the device configured for providing electrical energy storage of high specific energy density. The device contains one or more layers of high dielectric constant material, such as Barium Titanate or Hexagonal Barium Titanate, sandwiched between electrode layers made up of one or more of a variety of possible conducting materials. The device includes one or more electrically insulating layers including carbon, such as carbon formed into diamond or a diamond-like arrangement, for insulating the electrode(s) from the dielectric layer(s) to provide for very high breakdown voltages with good heat conductivity. The layers can be created by a variety of methods including laser deposition, and assembled to form a capacitor device provides the high energy density storage.

A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.

A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.

A film capacitor includes: a capacitor element in which a metallikon electrode is formed at an end; a bus bar connected with the metallikon electrode; a case having a container for housing the capacitor element and the bus bar; a lid member which covers an opening of the container; and a heat conducting member disposed between the bus bar and the lid member. The lid member has a protrusion on a side facing the heat conducting member, the protrusion is in contact with the heat conducting member, and the heat conducting member is in contact with the bus bar.

A film capacitor includes: a capacitor element in which a metallikon electrode is formed at an end; a bus bar connected with the metallikon electrode; a case having a container for housing the capacitor element and the bus bar; a lid member which covers an opening of the container; and a heat conducting member disposed between the bus bar and the lid member. The lid member has a protrusion on a side facing the heat conducting member, the protrusion is in contact with the heat conducting member, and the heat conducting member is in contact with the bus bar.

A gas laser device may include: a laser chamber containing laser gas; a first discharge electrode disposed in the laser chamber; a second discharge electrode disposed to face the first discharge electrode in the laser chamber; and a condenser including a polyimide dielectric and configured to supply power to between the first discharge electrode and the second discharge electrode.

A gas laser device may include: a laser chamber containing laser gas; a first discharge electrode disposed in the laser chamber; a second discharge electrode disposed to face the first discharge electrode in the laser chamber; and a condenser including a polyimide dielectric and configured to supply power to between the first discharge electrode and the second discharge electrode.

A multi-layer ceramic capacitor assembly includes a first terminal assembly member formed by arranging first protruded members at specific intervals, a second terminal assembly member formed by arranging second protruded members at specific intervals so that they face the respective first protruded members, insulated heat dissipation members supported by the first protruded members and the second protruded members and disposed therein, and multi-layer ceramic capacitors alternately disposed between the insulated heat dissipation members so that each multi-layer ceramic capacitor comes into contact with one side and the other side of each insulated heat dissipation member in a first direction, the end on one side of the multi-layer ceramic capacitor in a second direction orthogonal to the first direction is connected to the first terminal assembly member, and the end on the other side of the multi-layer ceramic capacitor in the second direction is connected to the second terminal assembly member.

A multi-layer ceramic capacitor assembly includes a first terminal assembly member formed by arranging first protruded members at specific intervals, a second terminal assembly member formed by arranging second protruded members at specific intervals so that they face the respective first protruded members, insulated heat dissipation members supported by the first protruded members and the second protruded members and disposed therein, and multi-layer ceramic capacitors alternately disposed between the insulated heat dissipation members so that each multi-layer ceramic capacitor comes into contact with one side and the other side of each insulated heat dissipation member in a first direction, the end on one side of the multi-layer ceramic capacitor in a second direction orthogonal to the first direction is connected to the first terminal assembly member, and the end on the other side of the multi-layer ceramic capacitor in the second direction is connected to the second terminal assembly member.