A Dense Energy Ultracapacitor DEUC preform, thin film, and module and methods of fabrication therefor, are provided. The DEUC thin film includes: a multilayer polymer thin film (2210) including a plurality of matched polymer layers (2215) having DEUC structural features resulting from drawing, by a draw process, and/or stretching, of a multilayer polymer DEUC preform (2201) having size, shape, and an arrangement of matched polymer layers (2205), where the multilayer polymer thin film (2210) having DEUC structural features in at least one dimension proportionally reduced in comparison to the same features in the Preform (2201). The multilayer polymer thin film includes negative and positive electrodes (903) made from conducting polymer and spaced apart by suspended particle high dielectric energy storage media (904) including high dielectric nano and/or micro sized particles (901, 902) suspended in a binder (904) including at least one of a polymer, a copolymer, and a terpolymer. All the layers (903, 904) are bound and unified together.

An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.

An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.

A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.

A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.

Disclosed is a high-voltage AC capacitor for reactive power compensation of 10 kV-35 kV power grid, and in particular to a high-voltage AC capacitor with a high-voltage switching switch provided therein, as well as a structure for prolonging the service life of a thin film metalized high-voltage capacitor and a control method for prolonging the service life of the thin film metalized high-voltage capacitor. The AC capacitor is formed by multiple intelligent switch capacitor units connected in series, and each capacitor unit is formed by a switch contact (K11-Kn1) and a capacitor (C1-Cn) connected in series. If there are N capacitor units, when each switch contact is disconnected, the endurable voltage of each switch contact, the endurable voltage between the switch contact and a coil and the voltage each capacitor withstands are 1/Nth of the total voltage; when the switch operates, all the contacts operate at the same instant.

Disclosed is a high-voltage AC capacitor for reactive power compensation of 10 kV-35 kV power grid, and in particular to a high-voltage AC capacitor with a high-voltage switching switch provided therein, as well as a structure for prolonging the service life of a thin film metalized high-voltage capacitor and a control method for prolonging the service life of the thin film metalized high-voltage capacitor. The AC capacitor is formed by multiple intelligent switch capacitor units connected in series, and each capacitor unit is formed by a switch contact (K11-Kn1) and a capacitor (C1-Cn) connected in series. If there are N capacitor units, when each switch contact is disconnected, the endurable voltage of each switch contact, the endurable voltage between the switch contact and a coil and the voltage each capacitor withstands are 1/Nth of the total voltage; when the switch operates, all the contacts operate at the same instant.

A multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, first and second main surfaces, first and second lateral surfaces, first and second end surfaces, first and second internal electrode layers laminated alternately with the dielectric layers and respectively exposed at the first and second end surfaces, first and second external electrodes respectively connected to the first and second internal electrode layers. The dielectric layers include a ceramic material. The ceramic material includes ceramic particles with an average particle diameter of about 710 nm or greater and about 830 nm or less. A percent coverage of the dielectric layers by the first internal electrode layers and a percent coverage of the dielectric layers by the second internal electrode layers are about 60% or higher and about 85% or lower.

A multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, first and second main surfaces, first and second lateral surfaces, first and second end surfaces, first and second internal electrode layers laminated alternately with the dielectric layers and respectively exposed at the first and second end surfaces, first and second external electrodes respectively connected to the first and second internal electrode layers. The dielectric layers include a ceramic material. The ceramic material includes ceramic particles with an average particle diameter of about 710 nm or greater and about 830 nm or less. A percent coverage of the dielectric layers by the first internal electrode layers and a percent coverage of the dielectric layers by the second internal electrode layers are about 60% or higher and about 85% or lower.

A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.