A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.

A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.

A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.

Disclosed is a high-voltage AC capacitor for reactive power compensation of 10 kV-35 kV power grid, and in particular to a high-voltage AC capacitor with a high-voltage switching switch provided therein, as well as a structure for prolonging the service life of a thin film metalized high-voltage capacitor and a control method for prolonging the service life of the thin film metalized high-voltage capacitor. The AC capacitor is formed by multiple intelligent switch capacitor units connected in series, and each capacitor unit is formed by a switch contact (K11-Kn1) and a capacitor (C1-Cn) connected in series. If there are N capacitor units, when each switch contact is disconnected, the endurable voltage of each switch contact, the endurable voltage between the switch contact and a coil and the voltage each capacitor withstands are 1/Nth of the total voltage; when the switch operates, all the contacts operate at the same instant, the switch contacts are prevented from striking sparks or discharging arcs under the protection of the contact protection circuits, and the high-voltage switch is realized through multiple air contact switches connected in series.

Disclosed is a high-voltage AC capacitor for reactive power compensation of 10 kV-35 kV power grid, and in particular to a high-voltage AC capacitor with a high-voltage switching switch provided therein, as well as a structure for prolonging the service life of a thin film metalized high-voltage capacitor and a control method for prolonging the service life of the thin film metalized high-voltage capacitor. The AC capacitor is formed by multiple intelligent switch capacitor units connected in series, and each capacitor unit is formed by a switch contact (K11-Kn1) and a capacitor (C1-Cn) connected in series. If there are N capacitor units, when each switch contact is disconnected, the endurable voltage of each switch contact, the endurable voltage between the switch contact and a coil and the voltage each capacitor withstands are 1/Nth of the total voltage; when the switch operates, all the contacts operate at the same instant, the switch contacts are prevented from striking sparks or discharging arcs under the protection of the contact protection circuits, and the high-voltage switch is realized through multiple air contact switches connected in series.

A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.

A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.

A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

A film capacitor includes: a capacitor element in which a metallikon electrode is formed at an end; a bus bar connected with the metallikon electrode; a case having a container for housing the capacitor element and the bus bar; a lid member which covers an opening of the container; and a heat conducting member disposed between the bus bar and the lid member. The lid member has a protrusion on a side facing the heat conducting member, the protrusion is in contact with the heat conducting member, and the heat conducting member is in contact with the bus bar.

A film capacitor includes: a capacitor element in which a metallikon electrode is formed at an end; a bus bar connected with the metallikon electrode; a case having a container for housing the capacitor element and the bus bar; a lid member which covers an opening of the container; and a heat conducting member disposed between the bus bar and the lid member. The lid member has a protrusion on a side facing the heat conducting member, the protrusion is in contact with the heat conducting member, and the heat conducting member is in contact with the bus bar.