A film capacitor and a related current conversion unit is provided. The film capacitor comprises: a capacitor housing having an end wall and a peripheral wall arranged circumferentially along the end wall, wherein the end wall and the peripheral wall collectively enclose an accommodating space of the capacitor housing, and wherein the end wall is configured as a thermally conductive metal wall; a busbar, arranged in the accommodating space of the capacitor housing and having a connection end extending from the accommodating space away from the end wall; a plurality of capacitor cores connected in parallel, arranged in the accommodating space of the capacitor housing and respectively connected to the busbar; and potting compound, filled in the accommodating space of the capacitor housing and separating the plurality of capacitor cores from the thermally conductive metal wall.

A capacitor includes a plurality of capacitor elements aligned in a first direction, a first bus bar, and a second bus bar. Each of the plurality of capacitor elements includes an element body, a first electrode, and a second electrode. The first bus bar includes a first internal terminal connected to the first electrode, a first external terminal, and a first connecting part that connects the first internal terminal with the first external terminal. The first connecting part includes a side plate positioned at a side of the plurality of capacitor elements in a second direction orthogonal to the first direction. A capacitor element disposed at a position farthest from the first external terminal in the first direction among the plurality of capacitor elements is disposed at a position closest to the side plate of the first connecting part in the second direction.

A capacitor includes a plurality of capacitor elements aligned in a first direction, a first bus bar, and a second bus bar. Each of the plurality of capacitor elements includes an element body, a first electrode, and a second electrode. The first bus bar includes a first internal terminal connected to the first electrode, a first external terminal, and a first connecting part that connects the first internal terminal with the first external terminal. The first connecting part includes a side plate positioned at a side of the plurality of capacitor elements in a second direction orthogonal to the first direction. A capacitor element disposed at a position farthest from the first external terminal in the first direction among the plurality of capacitor elements is disposed at a position closest to the side plate of the first connecting part in the second direction.

A multilayer electronic component includes a body including dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, and having a respective one of the dielectric layers interposed therebetween; a thermoelectric element disposed inside the body; and external electrodes disposed outside the body.

A multilayer electronic component includes a body including dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, and having a respective one of the dielectric layers interposed therebetween; a thermoelectric element disposed inside the body; and external electrodes disposed outside the body.

A DC link capacitor includes a lower busbar, an upper busbar, a cooling structure, and a plurality of structurally identical capacitor elements which are arranged between the lower busbar and the upper busbar and in electrical contact with the lower busbar and the upper busbar. The capacitor elements are spaced from each other in a longitudinal direction and in a transverse direction and are in thermally conductive contact with the cooling structure. The cooling structure includes thermally conductive element connected in a materially bonded manner to one of the lower busbar and the upper busbar. An active or passive cooling means is connected to an outer surface of one of the lower busbar and the upper busbar.

A multilayer ceramic capacitor includes a multilayer body including layered dielectric layers and internal electrode layers, a first external electrode on a third surface, a second external electrode on a fourth surface, a third external electrode on a fifth surface, and a fourth external electrode on a sixth surface. The internal electrode layers include first internal electrode layers exposed at the third and fourth surfaces and second internal electrode layers exposed at the fifth and sixth surfaces. The multilayer body includes a capacitance generating portion in which the first and second internal electrode layers oppose each other, and first and second outer layer portions. The capacitance generating portion is arranged at a center in a layering direction. The first outer layer portion is provided on a non-mount substrate side. An electrical conduction portion is provided in the first outer layer portion.

A multilayer ceramic capacitor includes a multilayer body including layered dielectric layers and internal electrode layers, a first external electrode on a third surface, a second external electrode on a fourth surface, a third external electrode on a fifth surface, and a fourth external electrode on a sixth surface. The internal electrode layers include first internal electrode layers exposed at the third and fourth surfaces and second internal electrode layers exposed at the fifth and sixth surfaces. The multilayer body includes a capacitance generating portion in which the first and second internal electrode layers oppose each other, and first and second outer layer portions. The capacitance generating portion is arranged at a center in a layering direction. The first outer layer portion is provided on a non-mount substrate side. An electrical conduction portion is provided in the first outer layer portion.

Provided is a polypropylene film having a high dielectric breakdown strength at high temperatures. Provided is a polypropylene film in which a polypropylene resin constituting the polypropylene film has a molecular-weight distribution (Mw/Mn) of the weight-average molecular weight Mw to the number-average molecular weight Mn of has a Z-average molecular weight Mz of 950,000-1,500,000, and has a weight proportion w of 2.6-4.2% in an integral molecular-weight distribution curve when the logarithmic molecular weight Log(M) is 4.0.

Provided is a polypropylene film having a high dielectric breakdown strength at high temperatures. Provided is a polypropylene film in which a polypropylene resin constituting the polypropylene film has a molecular-weight distribution (Mw/Mn) of the weight-average molecular weight Mw to the number-average molecular weight Mn of has a Z-average molecular weight Mz of 950,000-1,500,000, and has a weight proportion w of 2.6-4.2% in an integral molecular-weight distribution curve when the logarithmic molecular weight Log(M) is 4.0.