A capacitor module that includes: a case defining an interior space; a sealing resin in the interior space; one or more capacitors in the sealing resin; a first bus bar and a second bus bar each having a contact portion that is in contact with an electrode of the one or more capacitors, a buried portion in the sealing resin and extending from the contact portion, and an exposed portion that extends from the first buried portion outside the sealing resin, wherein at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion define one or more through holes that are filled with the sealing resin or include one or more protrusions surrounded by the sealing resin.

A capacitor module that includes: a case defining an interior space; a sealing resin in the interior space; one or more capacitors in the sealing resin; a first bus bar and a second bus bar each having a contact portion that is in contact with an electrode of the one or more capacitors, a buried portion in the sealing resin and extending from the contact portion, and an exposed portion that extends from the first buried portion outside the sealing resin, wherein at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion define one or more through holes that are filled with the sealing resin or include one or more protrusions surrounded by the sealing resin.

A capacitor module is provided which includes a plurality of capacitors, a capacitor case, and a sealing resin with which the capacitor case is filled to seal the capacitors in the capacitor case. The capacitor case includes inward-facing portions of an outer wall thereof each of which bulges or protrudes between every adjacent two of the capacitors. As viewed in a height-wise direction perpendicular both to a direction in which the inward-facing portions protrude and to a direction in which two of the capacitors adjacent each other across one of the inward-facing portions are aligned, the intervening inward-facing portion traverses a line segment passing through centers of the two adjacent capacitors. This structure minimizes thermal interference between the capacitors.

A capacitor module is provided which includes a plurality of capacitors, a capacitor case, and a sealing resin with which the capacitor case is filled to seal the capacitors in the capacitor case. The capacitor case includes inward-facing portions of an outer wall thereof each of which bulges or protrudes between every adjacent two of the capacitors. As viewed in a height-wise direction perpendicular both to a direction in which the inward-facing portions protrude and to a direction in which two of the capacitors adjacent each other across one of the inward-facing portions are aligned, the intervening inward-facing portion traverses a line segment passing through centers of the two adjacent capacitors. This structure minimizes thermal interference between the capacitors.

A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.

A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.

Provided is a polypropylene film having a high dielectric breakdown strength at high temperatures. Provided is a polypropylene film in which a polypropylene resin constituting the polypropylene film has a molecular-weight distribution (Mw/Mn) of the weight-average molecular weight Mw to the number-average molecular weight Mn of has a Z-average molecular weight Mz of 950,000-1,500,000, and has a weight proportion w of 2.6-4.2% in an integral molecular-weight distribution curve when the logarithmic molecular weight Log(M) is 4.0.

Provided is a polypropylene film having a high dielectric breakdown strength at high temperatures. Provided is a polypropylene film in which a polypropylene resin constituting the polypropylene film has a molecular-weight distribution (Mw/Mn) of the weight-average molecular weight Mw to the number-average molecular weight Mn of has a Z-average molecular weight Mz of 950,000-1,500,000, and has a weight proportion w of 2.6-4.2% in an integral molecular-weight distribution curve when the logarithmic molecular weight Log(M) is 4.0.

The present technology provides an electronic component with an interposer, including an electronic component and an interposer. An adhesive section is disposed in an opposing space between a main body of the electronic component and a substrate. When a direction in which first and second external electrodes of the electronic component face each other is a first direction, a direction orthogonal to the first direction is a second direction, and a direction in which the electronic component and the interposer face each other is a third direction, the adhesive section includes a plurality of unitary adhesive sections separated from each other, and the unitary adhesive sections are disposed in a two-dimensional array such that the number of unitary adhesive sections arrayed along the second direction is smaller on opposing sides in the first direction than at a center.

The present technology provides an electronic component with an interposer, including an electronic component and an interposer. An adhesive section is disposed in an opposing space between a main body of the electronic component and a substrate. When a direction in which first and second external electrodes of the electronic component face each other is a first direction, a direction orthogonal to the first direction is a second direction, and a direction in which the electronic component and the interposer face each other is a third direction, the adhesive section includes a plurality of unitary adhesive sections separated from each other, and the unitary adhesive sections are disposed in a two-dimensional array such that the number of unitary adhesive sections arrayed along the second direction is smaller on opposing sides in the first direction than at a center.