A heat dissipation structure of the multilayer ceramic capacitor is provided. The capacitor body includes ceramic dielectric layers stacked longitudinally, and inner electrodes disposed between and outside the ceramic dielectric layers and stacked in an interleaved manner, and two outer terminal electrodes disposed on two ends thereof and electrically connected to the inner electrodes. At least one pair of metal layers is disposed on an outer surface of the capacitor body in a minor symmetry, and extended inwardly from the two outer terminal electrodes. The metal layers on an upper cover of capacitor body can dissipate heat through a large area in contact or convection with air, and the metal layers on a lower cover can conduct heat to a circuit board for dissipating heat to the outside. Furthermore, the metal layers disposed on the upper and lower covers can increase a heat dissipation area.

A heat dissipation structure of the multilayer ceramic capacitor is provided. The capacitor body includes ceramic dielectric layers stacked longitudinally, and inner electrodes disposed between and outside the ceramic dielectric layers and stacked in an interleaved manner, and two outer terminal electrodes disposed on two ends thereof and electrically connected to the inner electrodes. At least one pair of metal layers is disposed on an outer surface of the capacitor body in a minor symmetry, and extended inwardly from the two outer terminal electrodes. The metal layers on an upper cover of capacitor body can dissipate heat through a large area in contact or convection with air, and the metal layers on a lower cover can conduct heat to a circuit board for dissipating heat to the outside. Furthermore, the metal layers disposed on the upper and lower covers can increase a heat dissipation area.

An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.

An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.

A system for preventing overheating of a DC link capacitor in an electric vehicle, including: a DC link capacitor having a positive electrode and a negative electrode; a pair of busbars, with the positive busbar connected to the positive electrode of the DC link capacitor, and the negative busbar connected to the negative electrode of the DC link capacitor; a dielectric layer between the positive and negative busbars; a pair of DC output connectors connected to the busbars; and a heat sink positioned under the busbars and in contact with the busbars.

A system for preventing overheating of a DC link capacitor in an electric vehicle, including: a DC link capacitor having a positive electrode and a negative electrode; a pair of busbars, with the positive busbar connected to the positive electrode of the DC link capacitor, and the negative busbar connected to the negative electrode of the DC link capacitor; a dielectric layer between the positive and negative busbars; a pair of DC output connectors connected to the busbars; and a heat sink positioned under the busbars and in contact with the busbars.

In an embodiment, a multilayer ceramic capacitor 10 includes external electrodes 12 on both of first-direction ends of a capacitor body 11. Also, groups of metal grains 13 are provided on one third-direction face and another third-direction face of the capacitor body 11. Both of the first-direction ends of the groups of metal grains 13 provided on the other third-direction face of the capacitor body 11 are covered by second parts 12c of the respective external electrodes 12, while both of the first-direction ends of the groups of metal grains 13 provided on the one third-direction face of the capacitor body 11 are covered by first parts 12b of the respective external electrodes 12. The multilayer ceramic electronic component can offer excellent heat dissipation property.

In an embodiment, a multilayer ceramic capacitor 10 includes external electrodes 12 on both of first-direction ends of a capacitor body 11. Also, groups of metal grains 13 are provided on one third-direction face and another third-direction face of the capacitor body 11. Both of the first-direction ends of the groups of metal grains 13 provided on the other third-direction face of the capacitor body 11 are covered by second parts 12c of the respective external electrodes 12, while both of the first-direction ends of the groups of metal grains 13 provided on the one third-direction face of the capacitor body 11 are covered by first parts 12b of the respective external electrodes 12. The multilayer ceramic electronic component can offer excellent heat dissipation property.

To provide a capacitor device capable of preventing thermal interference between a filter capacitor and a plurality of smoothing capacitors. A capacitor device provided in an energization circuit between a power source and a semiconductor module as a power supply device includes a filter capacitor for removing a noise included in a current supplied from a power input terminal, a plurality of smoothing capacitors for smoothing a voltage, and a capacitor case that houses the filter capacitor and the plurality of smoothing capacitors, and a first gap between the filter capacitor and a smoothing capacitor provided at a position closest to the filter capacitor among the plurality of smoothing capacitors is configured to be larger than a second gap between two smoothing capacitors adjacent to each other among the plurality of smoothing capacitors.

To provide a capacitor device capable of preventing thermal interference between a filter capacitor and a plurality of smoothing capacitors. A capacitor device provided in an energization circuit between a power source and a semiconductor module as a power supply device includes a filter capacitor for removing a noise included in a current supplied from a power input terminal, a plurality of smoothing capacitors for smoothing a voltage, and a capacitor case that houses the filter capacitor and the plurality of smoothing capacitors, and a first gap between the filter capacitor and a smoothing capacitor provided at a position closest to the filter capacitor among the plurality of smoothing capacitors is configured to be larger than a second gap between two smoothing capacitors adjacent to each other among the plurality of smoothing capacitors.