The present technology provides an electronic component with an interposer, including an electronic component and an interposer. An adhesive section is disposed in an opposing space between a main body of the electronic component and a substrate. When a direction in which first and second external electrodes of the electronic component face each other is a first direction, a direction orthogonal to the first direction is a second direction, and a direction in which the electronic component and the interposer face each other is a third direction, the adhesive section includes a plurality of unitary adhesive sections separated from each other, and the unitary adhesive sections are disposed in a two-dimensional array such that the number of unitary adhesive sections arrayed along the second direction is smaller on opposing sides in the first direction than at a center.

The present technology provides an electronic component with an interposer, including an electronic component and an interposer. An adhesive section is disposed in an opposing space between a main body of the electronic component and a substrate. When a direction in which first and second external electrodes of the electronic component face each other is a first direction, a direction orthogonal to the first direction is a second direction, and a direction in which the electronic component and the interposer face each other is a third direction, the adhesive section includes a plurality of unitary adhesive sections separated from each other, and the unitary adhesive sections are disposed in a two-dimensional array such that the number of unitary adhesive sections arrayed along the second direction is smaller on opposing sides in the first direction than at a center.

A capacitor comprises an electrically conductive cylinder, an electrically conductive or semi-conductive cylindrical shell or shell segment arranged concentrically around the electrically conductive cylinder, and a dielectric arranged between the electrically conductive cylinder and the electrically conductive or semi-conductive cylindrical shell or shell segment. The dielectric comprises at least one dielectric layer having a positive thermal coefficient of relative permittivity, and at least one compensation dielectric layer having a negative thermal coefficient of relative permittivity. The thermal coefficient of relative permittivity is thereby selected such that the capacitance value of the capacitor is constant within a stability margin over a predefined temperature interval.

A capacitor comprises an electrically conductive cylinder, an electrically conductive or semi-conductive cylindrical shell or shell segment arranged concentrically around the electrically conductive cylinder, and a dielectric arranged between the electrically conductive cylinder and the electrically conductive or semi-conductive cylindrical shell or shell segment. The dielectric comprises at least one dielectric layer having a positive thermal coefficient of relative permittivity, and at least one compensation dielectric layer having a negative thermal coefficient of relative permittivity. The thermal coefficient of relative permittivity is thereby selected such that the capacitance value of the capacitor is constant within a stability margin over a predefined temperature interval.

An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.

An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.

A capacitor module is provided which includes a plurality of capacitors, a capacitor case, and a sealing resin with which the capacitor case is filled to seal the capacitors in the capacitor case. The capacitor case includes inward-facing portions of an outer wall thereof each of which bulges or protrudes between every adjacent two of the capacitors. As viewed in a height-wise direction perpendicular both to a direction in which the inward-facing portions protrude and to a direction in which two of the capacitors adjacent each other across one of the inward-facing portions are aligned, the intervening inward-facing portion traverses a line segment passing through centers of the two adjacent capacitors. This structure minimizes thermal interference between the capacitors.

A capacitor module is provided which includes a plurality of capacitors, a capacitor case, and a sealing resin with which the capacitor case is filled to seal the capacitors in the capacitor case. The capacitor case includes inward-facing portions of an outer wall thereof each of which bulges or protrudes between every adjacent two of the capacitors. As viewed in a height-wise direction perpendicular both to a direction in which the inward-facing portions protrude and to a direction in which two of the capacitors adjacent each other across one of the inward-facing portions are aligned, the intervening inward-facing portion traverses a line segment passing through centers of the two adjacent capacitors. This structure minimizes thermal interference between the capacitors.

A DC link capacitor comprises a lower busbar, an upper busbar, a cooling structure, and a plurality of structurally identical capacitor elements which are arranged between the lower busbar and the upper busbar and in electrical contact with the lower busbar and the upper busbar. The capacitor elements are spaced from each other in a longitudinal direction and in a transverse direction and are in thermally conductive contact with the cooling structure. The cooling structure includes thermally conductive element connected in a materially bonded manner to one of the lower busbar and the upper busbar. An active or passive cooling means is connected to an outer surface of one of the lower busbar and the upper busbar.

In an embodiment, a multilayer ceramic capacitor 10 has a first metal layer 14 having many holes 14a, and a second metal layer 15 having many holes 15a, with a clearance CL provided in between in the length direction, on the other height-direction side face of the capacitor body; the first metal layer 14 is partially covered by a third part 12c of a first external electrode 12, while the remainder is exposed; and the second metal layer 15 is partially covered by a third part 13c of a second external electrode 13, while the remainder is exposed. The multilayer ceramic capacitor can have excellent heat dissipation property.