Patent classifications
H01G4/302
METHOD FOR MANUFACTURING CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT
A method for manufacturing a conductive paste includes preparing a first solution including a metal particle and a first solvent, preparing a second solvent, preparing a surfactant including a core particle and an organic material disposed on a surface of the core particle, and mixing the first solution, the second solvent, and the surfactant to form a mixed solution.
MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
A multilayer ceramic device includes a multilayer chip. The multilayer chip has a capacity section, a side margin and an intermediate portion. The intermediate portion is provided between the capacity section and the side margin. An A/B ratio is larger in the side margin than in the capacity section, and is smaller in the intermediate portion than in the capacity section.
Multilayer Ceramic Capacitor Having Ultra-Broadband Performance
A multilayer capacitor may include a monolithic body including a plurality of dielectric layers. A first external terminal may be disposed along a first end, and a second external terminal may be disposed along a second end of the capacitor. The external terminals may include respective bottom portions that extend along a bottom surface of the capacitor. The bottom portions of the external terminals may be spaced apart by a bottom external terminal spacing distance. A bottom shield electrode may be arranged within the monolithic body between a plurality of active electrodes and the bottom surface of the capacitor. The bottom shield electrode may be spaced apart from the bottom surface of the capacitor by a bottom-shield-to-bottom distance that may range from about 3 microns to about 100 microns. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be less than about 4.
CERAMIC ELECTRONIC DEVICE
A ceramic electronic device includes an element body and an external electrode. The element body is formed by laminating a ceramic layer and an internal electrode layer. The external electrode is electrically connected to at least one end of the internal, electrode layer. The element body includes a boundary layer at an end of the ceramic layer. The ceramic layer includes a perovskite compound represented by ABO.sub.3 as a main component. The boundary layer includes Ba and Ti as a main component. The boundary layer includes 0.27-0.40 parts by mol of Ba, provided that a total of Ba and Ti included in the boundary layer is 1 part by mol.
DIELECTRIC POWDER AND MULTILAYER CAPACITOR USING THE SAME
A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO.sub.3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
Dielectric powder and multilayer capacitor using the same
A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO.sub.3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
Multilayer Ceramic Capacitor Having Ultra-Broadband Performance
A multilayer capacitor may include a monolithic body including a plurality of dielectric layers. A first external terminal may be disposed along a first end, and a second external terminal may be disposed along a second end of the capacitor. The external terminals may include respective bottom portions that extend along a bottom surface of the capacitor. The bottom portions of the external terminals may be spaced apart by a bottom external terminal spacing distance. A bottom shield electrode may be arranged within the monolithic body between a plurality of active electrodes and the bottom surface of the capacitor. The bottom shield electrode may be spaced apart from the bottom surface of the capacitor by a bottom-shield-to-bottom distance that may range from about 3 microns to about 100 microns. A ratio of a length of the capacitor to the bottom external terminal spacing distance may be less than about 4.
DIELECTRIC POWDER AND MULTILAYER CAPACITOR USING THE SAME
A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO.sub.3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
Multilayer component having internal electrodes alternatingly connected to external electrodes
A multilayer component is disclosed. In an embodiment, a multilayer component includes a fully active stack comprising a plurality of dielectric layers, internal electrodes and two external electrodes arranged on opposite sides of the stack, wherein at least one portion of the internal electrode layers are coated.
Dielectric powder and multilayer capacitor using the same
A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO.sub.3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.