A baking slurry composition of the present invention contains an amino alcohol compound represented by formula, inorganic powder , a polyvinyl alcohol resin, and water. In the formula,

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R is a hydrogen atom or an alkyl group having a carbon number larger than or equal to 1 and smaller than or equal to 20, and m and n being values satisfying conditions m0, n0, and m+n1.

A capacitor includes: at least one multi-wing structure including N axes and M wings, where the N axes extend along a first direction, and the M wings are a convex structure formed by extending from side walls of the N axes toward a direction perpendicular to the first direction, a first wing of the M wings and the N axes are formed of a first conductive material, and other wings are formed of a second conductive material; a conductive structure cladding the multi-wing structure; a dielectric layer disposed between the multi-wing structure and the conductive structure to isolate the multi-wing structure from the conductive structure; a first external electrode electrically connected to some or all multi-wing structures; and a second external electrode electrically connected to the conductive structure.

A capacitor includes a structure including a plurality of openings penetrating from a first surface of the structure to a second surface opposing the first surface; a capacitor layer disposed on the second surface of the structure and in the plurality of the openings and including a dielectric layer, and a first electrode and a second electrode, the dielectric layer interposed between the first electrode and the second electrode; a first connection layer disposed on the first surface of the structure and connected to the first electrode; a second connection layer disposed on the capacitor layer on the second surface and connected to the second electrode of the structure; and first and second terminals disposed on opposite side surfaces of the structure and connected to the first connection layer and the second connection layer, respectively.

A composite film having a high dielectric permittivity engineered particles dispersed in a high breakdown strength polymer material to achieve high energy density.

A composite film having a high dielectric permittivity engineered particles dispersed in a high breakdown strength polymer material to achieve high energy density.

An integrated-circuit device having a layered structure including a plurality of wiring layers with a via layer sandwiched between adjacent wiring layers, wherein: a capacitor having first and second terminals is formed from conductive structures implemented in first and second wiring layers, the conductive structures including arrangements of conductive strips; the strips formed in the first wiring layer are organized into a first-terminal comb arrangement connected to the first terminal and a second-terminal comb arrangement connected to the second terminal, each of comb arrangements having a base strip and a plurality of finger strips extending from the base strip; and the strips formed in the second wiring layer include a plurality of separate strips which constitute finger strips of a cross-layer comb arrangement whose base strip is a finger strip of the first-terminal comb arrangement of the first wiring layer to which those separate strips are conductively connected by vias.

Planarization of the M1 metal layer reduces surface roughness and fills in pin-holes for a more reliable capacitor. For example, a MIM capacitor on a glass substrate may begin with patterning of the M1 layer, deposition of a planarization material, etch back the planarization material to planarize the M1 surface and fill in any pits/pin-holes. In addition, multiple-cycles of deposit and etch back further reduce M1 surface roughness and fill in possible pin-holes to acceptable level.

A method for producing a multilayer ceramic electronic component the includes producing a multilayer sheet having a plurality of multilayer ceramic green sheets and internal electrode patterns respectively arranged along a plurality of interfaces between the ceramic green sheets, and having a first main surface and a second main surface that face each other in a lamination direction thereof; placing, and pressure-bonding under heating, a resin composition onto at least one of the first main surface and the second main surface of the multilayer sheet to produce a mother block having an unfixed protection layer thereon; and cutting the mother block along a first-direction cutting-plane line and a second-direction cutting-plane line that are orthogonal to each other to produce a plurality of green chips. The resin composition includes a resin component having a melting point or a glass transition temperature of lower than 100 C. and inorganic compound particles.

Embodiments disclosed herein include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a package substrate, an organic layer over the package substrate, and a capacitor embedded in the organic layer. In an embodiment, the capacitor comprises, a first electrode, where the first electrode comprises a seam between a first conductive layer and a second conductive layer, a dielectric layer over the first electrode, and a second electrode over the dielectric layer.

In an embodiment, a multilayer ceramic capacitor 10 has supplementary dielectric layers 11d, each having a first cover part 11d1 that covers the space between two first base conductor films 11c on each of both height-direction faces, and second cover parts 11d2 that connect to the first cover part 11d1 and also cover parts of the first base conductor films 11c, respectively, in the length direction. External electrodes 12, 13 each have a second base conductor film 12a, 13a attached to a one length-direction face and to one length-direction edges of two first base conductor films 11c on the respective height-direction faces, and a surface conductor film 12b, 13b attached continuously to the surface of the second base conductor film 12a, 13a and also to the parts of the surfaces of the two first base conductor films 11c not covered by the second cover parts 11d2.