A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first edge face and a second edge face of the multilayer structure, wherein 1.5Db/Da10.0 is satisfied in a side margin region that covers edge portions to which the plurality of internal electrode layers extend toward two side faces other than the first edge face and the second edge face, when Da is an average grain diameter of a main component ceramic within 20 m from an edge of the plurality of internal electrode layers in the side margin region and Db is an average grain diameter of a main component ceramic within 20 m from a surface layer of the side margin region.

A method of manufacturing a multilayer ceramic capacitor includes preparing a laminate by providing ceramic layers and internal electrode layers arranged in a stacking direction, and providing two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed, and transferring a first conductive paste to the laminate. In the preparing, forming the laminate to have a rectangular parallelepiped configuration or shape and to include two longitudinal end surfaces, and four surfaces orthogonal to the end surfaces and, on at least one of the four surfaces, a protrusion in which the exposure region protrudes outward. In the transferring, the first conductive paste is applied to a transfer jig including a groove, and the first conductive paste in the groove is transferred to a surface of the protrusion.

A capacitor component includes a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween to be exposed to the third and fourth surfaces of the body, respectively; first and second conductive layers covering the third and fourth surfaces and connected to the first and second internal electrodes, respectively; first and second insulating layers covering the first and second conductive layers, respectively; first and second band portions spaced apart from each other on the second surface of the body; first and second external electrodes covering a portion of the first and second band portions and the first insulating layer, respectively; and third and fourth external electrodes covering a portion of the first and second insulating layers and a portion of the first surface of the body, respectively; and a method of manufacturing the same.

A multilayer ceramic capacitor includes a body including first and second dielectric layers and having first to sixth surfaces; a second internal electrode disposed on the second dielectric layer to face the first internal electrode with the first or second dielectric layer interposed therebetween, exposed to the fourth, fifth, and sixth surfaces, and disposed to be spaced apart from the third surface by a second space; a first dielectric pattern disposed in at least a portion of the first space; a second dielectric pattern disposed in at least a portion of the second space; a side insulating layer disposed on the fifth and sixth surfaces; a first external electrode disposed on the third surface; and a second external electrode disposed on the fourth surface, in which the first and second dielectric patterns have a color different from the first and second dielectric layers.

A method of manufacturing a multilayer ceramic capacitor includes preparing a laminate by providing ceramic layers and internal electrode layers arranged in a stacking direction, and providing two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed, and transferring a first conductive paste to the laminate. In the preparing, forming the laminate to have a rectangular parallelepiped configuration or shape and to includes two longitudinal end surfaces, and four surfaces orthogonal or substantially orthogonal to the end surfaces and, on at least one of the four surfaces, a protrusion in which the exposure region protrudes outward. In the transferring, the first conductive paste is applied to a transfer jig including a groove, and the first conductive paste in the groove is transferred to a surface of the protrusion.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface, respectively; internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, and having one ends exposed to the third surface or the fourth surface; a first side margin portion and a second side margin portion disposed on sides of the internal electrodes exposed to the first and second surfaces; and adhesive layers disposed between the first surface of the ceramic body and the first side margin portion and between the first surface of the ceramic body and the second side margin portion, respectively. An average thickness of each of the first and second side margin portions is 2 m or more and 10 m or less.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first surface and the second surface, respectively; internal electrodes disposed inside the ceramic body and exposed to the first and second surfaces, and having one ends exposed to the third surface or the fourth surface; a first side margin portion and a second side margin portion disposed on sides of the internal electrodes exposed to the first and second surfaces; and adhesive layers disposed between the first surface of the ceramic body and the first side margin portion and between the first surface of the ceramic body and the second side margin portion, respectively. An average thickness of each of the first and second side margin portions is 2 m or more and 10 m or less.

A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 10.sup.3 and 10.sup.4 Poise at a shear rate of 100/s when heated to a temperature between its T.sub.g and T.sub.dec.

A perovskite ceramic composition that contains Sn, Ba, and Ti, and where the Sn content is within a range of about 0.001 parts by molSnabout 0.999 parts by mole with respect to 100 parts by mole of the Ti. The perovskite ceramic composition can be used in a composition that further includes a rare earth element R, Mn, and Si, and optionally Mg, where proportions of the R, the Mn, the Si, and the optional Mg, satisfy R: 0<Rabout 10 parts by mole, Mn: 0<Mnabout 5 parts by mole, Si: 0<Siabout 5 parts by mole Mg: 0<Mgabout 5 parts by mole with respect to 100 parts by mole of Ti.