A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.

The present invention relates in particular to a very high capacitance film capacitor (1) that comprises a dielectric layer (100) consisting of at least one dielectric film (100a, . . . , 100i), each dielectric film (100a, . . . , 100i) of this dielectric layer (100) having the following parameters: a relative dielectric permittivity [.sub.f.sup.i] such that .sub.f.sup.i10, a thickness [e.sub.f.sup.i] such that 0.05 me.sub.f.sup.i50 m, a dielectric strength [E.sub.f.sup.i] such that E.sub.f.sup.i50 V/m, parameters in which f signifies film and i1, i designating the i.sup.th dielectric film (100i) of said dielectric layer (100), this dielectric layer (100) separating a first electronic charge carrier structure (200) from a second electronic charge carrier structure (300), these two structures having an opposite surface (S) separated by the dielectric layer (100).

Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films (100) may include a plurality of co-extensive electrical protolayers (22, 23, 24) forming an electrical protolayer stack (20), at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 10.sup.3 and 10.sup.4 Poise at a shear rate of 100/s when heated to a temperature between its Tg and T.sub.dec.

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

A method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated. The green multilayer body 11 is formed on the temporary holding film 62 formed on the release substrate. The green multilayer body 11 is formed by repeating the first step forming a green functional part using the first ink containing the functional particles and the second step forming the green conductor part using the second ink containing the conductive particles. The temporary holding film 62 has conductivity.

A multilayer ceramic electronic component includes a ceramic body contributing to capacitance formation and including an active region formed by alternately stacking dielectric layers and first and second internal electrodes and, and a protective layer provided on at least one of upper and lower surfaces of the active region; and first and second external electrodes formed on respective ends of the ceramic body, wherein a step portion absorption layer is disposed in at least one of: both end portions of the ceramic body in a length direction or both end portions of the ceramic body in a width direction, and a total thickness of dielectric layers disposed on the same plane as the step portion absorption layer is greater than a thickness of a dielectric layer disposed in another region.

A multilayer ceramic capacitor includes: a capacitance layer including dielectric layers and first and second internal electrodes disposed with respective dielectric layers interposed therebetween; a protection layer disposed on one surface of the capacitance layer; an alpha connection electrode provided in an alpha via penetrating through the protection layer; and a beta connection electrode provided in a beta via penetrating through the capacitance layer and connected to the alpha via. The alpha via has a diameter greater than that of the beta via.

A multilayer electronic component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with the dielectric layers in a first direction, wherein when a space where the plurality of internal electrodes overlap each other in the first direction is defined as a capacitance forming portion, the plurality of internal electrodes include internal electrodes that are curved at end portions thereof in the capacitance forming portion and internal electrodes that are flat in the capacitance forming portion, and in a cross section of the body in the first and second directions.

A multilayer ceramic electronic component includes a ceramic body contributing to capacitance formation and including an active region formed by alternately stacking dielectric layers and first and second internal electrodes and, and a protective layer provided on at least one of upper and lower surfaces of the active region; and first and second external electrodes formed on respective ends of the ceramic body, wherein a step portion absorption layer is disposed in at least one of: both end portions of the ceramic body in a length direction or both end portions of the ceramic body in a width direction, and a total thickness of dielectric layers disposed on the same plane as the step portion absorption layer is greater than a thickness of a dielectric layer disposed in another region.

A multilayer capacitor includes a body including dielectric layers and first and second internal electrodes alternately disposed with dielectric layers interposed therebetween. First and second external electrodes are on the body and connected to the first and second internal electrodes, respectively. The first and second internal electrodes are plating layers. A manufacturing method of a multilayer capacitor includes preparing a plurality of laminated sheets including internal electrodes, dummy electrodes, and dielectric layers. The plurality of laminated sheets, and covers on and below the laminated sheets, are simultaneously stacked and then cured to prepare a cured product. The cured product is then diced depending on the size of the capacitor to prepare a body where the internal electrodes and the dummy electrodes are partially exposed. External electrodes are formed on external surfaces of the body using the dummy electrodes as seeds in a plating method.