A multilayer electronic component includes a main body including an active region in which a plurality of internal electrodes are stacked with respective dielectric layers interposed therebetween, and upper and lower cover regions disposed above and below the active region, respectively, external electrodes disposed on external surfaces of the main body and electrically connected to the plurality of internal electrodes, and a composite body disposed below the lower cover region of the main body and lower portions of the external electrodes.

An electrode pattern forming method capable of forming an electrode pattern having a desired thickness in each of a plurality of areas on an identical surface by an ink-jet method is provided. In a method of forming an electrode pattern including a first conductive portion and a second conductive portion connected with each other onto a work piece by an ink-jet method, a first area corresponding to at least part of the first conductive portion and a second area corresponding to at least part of the second conductive portion are defined on an identical surface of the work piece, conductive ink droplets are ejected toward the first area and the second area to form the first conductive portion and the second conductive portion, and a resolution of conductive ink droplets differs between the first area and the second area.

The invention provides a process and an apparatus for producing a high quality electronic component by reducing sagging at pattern side walls, which may occur when patterns of a wiring, an electrode, etc. are printed by a screen printing process using an electroconductive paste, an insulation paste, or a semiconductor paste, and reducing a mesh mark on the patterns of a wiring, an electrode, etc., or a full solid surface film, as well as a pattern formation process, by which screen printing can be applied and double face printing can be conducted with the number of process steps less than a conventional process. A pattern is formed by that a pattern is printed on a blanket having a surface comprising polydimethylsiloxane using an electroconductive paste, an insulation paste, or a semiconductor paste by a screen printing process, and the pattern is transferred from the blanket to a printing object.

A perovskite ceramic composition that contains Sn, Ba, and Ti, and where the Sn content is within a range of about 0.001 parts by molSnabout 0.999 parts by mole with respect to 100 parts by mole of the Ti. The perovskite ceramic composition can be used in a composition that further includes a rare earth element R, Mn, and Si, and optionally Mg, where proportions of the R, the Mn, the Si, and the optional Mg, satisfy R: 0<Rabout 10 parts by mole, Mn: 0<Mnabout 5 parts by mole, Si: 0<Siabout 5 parts by mole Mg: 0<Mgabout 5 parts by mole with respect to 100 parts by mole of Ti.

A multilayer ceramic capacitor that includes a laminated body having a plurality of ceramic layers including crystal grains that have a perovskite structure, and a plurality of internal electrode layers; and external electrodes on first and second end surfaces of the laminated body and electrically connected to respective sets of the plurality of internal electrodes. In the ceramic layers, when the content of Ti is 100 parts by mol, the ceramic layers contain Ca at 0.10 to 15.00 parts by mol; Mg at 0.0010 to 0.0097 parts by mol; R at 0.50 to 4.00 parts by mol; M at 0.10 to 2.00 parts by mol; and Si at 0.50 to 2.00 parts by mol, and core parts of the crystal grains contain Ca.

A capacitor includes a body including a plurality of dielectric layers and internal electrodes which are alternately stacked, and a compensation region formed in the interior of the body, the compensation region including portions of the plurality of dielectric layers and including a central portion and an end portion extended from the central portion. A thickness of the central portion of the compensation region is between 4 and 13 times as great as that of a dielectric layer among the plurality of dielectric layers on which the internal electrodes are formed.

A multilayer ceramic electronic component includes a ceramic body contributing to capacitance formation and including an active region formed by alternately stacking dielectric layers and first and second internal electrodes and, and a protective layer provided on at least one of upper and lower surfaces of the active region; and first and second external electrodes formed on respective ends of the ceramic body, wherein a step portion absorption layer is disposed in at least one of: both end portions of the ceramic body in a length direction or both end portions of the ceramic body in a width direction, and a total thickness of dielectric layers disposed on the same plane as the step portion absorption layer is greater than a thickness of a dielectric layer disposed in another region.

A process for forming a capacitor is presented. The process includes providing a laminate including a dielectric layer disposed on a sacrificial substrate, forming a free-standing metallized dielectric layer and packaging the free-standing metallized dielectric layer to form a capacitor. The dielectric layer includes a polyetherimide. The step of forming the free-standing metallized dielectric layer is performed by: (a) disposing a metal layer on the dielectric layer to form a metalized laminate such that a metalized dielectric layer is formed on the sacrificial substrate, and removing the sacrificial substrate to form the free-standing metallized dielectric layer; or (b) removing the sacrificial substrate from the laminate to form a free-standing dielectric layer, and disposing a metal layer on the free-standing dielectric layer to form the free-standing metallized dielectric layer. A capacitor formed by the process is presented. A process for forming a capacitor by a roll-to-roll processing technique is also presented.

An electronic component includes a laminated capacitor and a substrate-type terminal on which the laminated capacitor is mounted, with an viscoelastic resin located in a space between the laminated capacitor and the substrate-type terminal. The substrate-type terminal includes a substrate body, component connecting electrodes to mount the laminated capacitor are located on a component mounting surface of the substrate body, and external connecting electrodes to be connected to a circuit board are located on a substrate mounting surface of the substrate body.

A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600 C. or more.