A protective element has a body, an inner connection layer, an outer connection layer, a heating layer and a low-melting-point alloy layer. The body is made of a single insulation material. The inner and outer connection layers are formed on two upper and lower surfaces of the body. The low-melting-point alloy layer is formed on the upper surface of the body and is electrically connected to the inner connection layer. The heating layer is mounted inside the body and is electrically connected to the low-melting-point alloy layer by the inner connection layer. The outer connection layer is electrically connected to the low-melting-point alloy layer and the heating layer. The outer connection layer is soldered on a power circuit. When the power circuit encounters overcurrent, the heating layer is heated to fuse the low-melting-point alloy layer faster. Thus, power circuit is cut to protect the power circuit.

A method of manufacturing a fuse includes stacking a base plate, an at least partially conductive fabric over the base plate and a cover layer over the fabric, each with an intervening bonding layer. At least one cavity is provided on both sides of the fabric, adjoining the fabric, between the respective edge regions. In addition, the fabric includes at least one first fiber which is electrically conductive and second fibers which are non-conductive and which have a lower melting temperature than the first fiber. The method further includes heating the stacked elements to a temperature below the melting temperature of the first fiber and above the melting temperature of the second fibers.

A protective element has a body, an inner connection layer, an outer connection layer, a heating layer and a low-melting-point alloy layer. The body is made of a single insulation material. The inner and outer connection layers are formed on two upper and lower surfaces of the body. The low-melting-point alloy layer is formed on the upper surface of the body and is electrically connected to the inner connection layer. The heating layer is mounted inside the body and is electrically connected to the low-melting-point alloy layer by the inner connection layer. The outer connection layer is electrically connected to the low-melting-point alloy layer and the heating layer. The outer connection layer is soldered on a power circuit. When the power circuit encounters overcurrent, the heating layer is heated to fuse the low-melting-point alloy layer faster. Thus, power circuit is cut to protect the power circuit.

A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.

A novel temperature-triggered fuse device is configured to be activated at a designer-specified ambient temperature by utilizing wetting force among a pair of wetting material bays and a solder bridge or a solder ball. The solder bridge or the solder ball is typically positioned on top of the pair of wetting material bays separated by an electrically-insulated gap. Preferably, the wetting material bays are at least partly made of gold, nickel, or other elements suitable for generating an increased wetting force to the solder bridge or the solder ball upon increases in ambient temperature. The novel temperature-triggered fuse device can be integrated into various types of integrated circuits (IC's), or can function as a discrete fuse connected to one or more electronic components for robust protection from power surges and/or thermal runaway-related device malfunctions, meltdowns, or explosions. Various methods of producing the temperature-triggered fuse device are also disclosed herein.

The present disclosure discloses a miniature super surface mount fuse, comprising: a fuse element provided with a low overload fusing point and at least two high breaking capacity fusing points connected in series with the low overload fusing point and respectively arranged on two sides of the low overload fusing point, at least two cavity plates provided with cavities, the low overload fusing point and the high breaking capacity fusing points being located at corresponding positions of the cavities; the present disclosure further provides a manufacturing method for a surface mount fuse; the miniature super surface mount fuse of the present disclosure can provide the protection for the civil consumer electronic circuit under various overload conditions without the occurrence of safety hazards such as smoking or cracking of the housing or explosion.

A chip-type fuse has a substrate. Two pads are disposed over a first side of the substrate. At least one fusible element is disposed over the first side of the substrate and electrically connects to the pads. A protective layer covers the first side of the substrate and the fusible element. The fusible element has a cross-section that is substantially circular, so the time durations for heat conduction from the center to points on the radial edge at the cross-section of the fusible element are almost equal. Thus, the fusible element can be uniformly heated. Therefore, when the circuit is overheated, the blow of the fusible element is uniform, which may effectively interrupt the circuit and protect the circuit.

A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes an elongated planar substrate, a plurality of fusible weak spots, and a conductor. The weak spots are formed on the substrate and are longitudinally spaced from one another on the substrate. The conductor is separately provided from the substrate and the weak spots. The conductor includes a solid elongated strip of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The solid elongated strip of metal includes coplanar connector sections that are mounted to respective ones of the weak spots and obliquely extending sections bent out of plane of the connector sections to extend above the substrate.

Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a top surface thereof. The method further includes protecting the metal gates and the capping material during an etching process which forms a recess in a dielectric material. The method further includes forming an insulator material and metal material within the recess. The method further includes forming a contact in direct electrical contact with the metal material.

A flexible and non-magnetic fuse that can be used in a MRI. The fuse is made up of a substrate and a first layer located upon the substrate. The first layer including a first electrical conductor material suspended within a first base material. Upon the first layer is located a second layer. This second is made up of a material that is suspended within a second base material. The second layer has a solid to liquid phase transition temperature lower than a solid to liquid phase transition temperature of a material of the first layer and the second base material intermixes with the first base material at the transition temperature the second layer.