An arrangement for subsea cooling of a semiconductor module. The arrangement includes a tank. The tank is filled with a dielectric fluid. The arrangement includes at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module includes semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink includes a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink includes a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is configured to lie vertically higher than the second part.

An arrangement for subsea cooling of a semiconductor module. The arrangement includes a tank. The tank is filled with a dielectric fluid. The arrangement includes at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module includes semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink includes a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink includes a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is configured to lie vertically higher than the second part.

A semiconductor package includes a substrate, an integrated circuit disposed on the substrate, a memory support disposed on the integrated circuit, stacked memory disposed on the memory support and in communication with the integrated circuit, and a lid connected to the substrate. The integrated circuit has a low power region and a high power region. The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port, a second port, and a lid volume fluidly connecting the first port and the second port. The lid volume is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.

Embodiments of the present invention provide efficient and cost-effective systems for a lidded electronic device. The lidded electronic device includes an electronic module including an integrated circuit chip built on a substrate. The lidded electronic device also includes a module lid having a heat transferring feature, which extends above the top surface of the module lid. A manifold structure can be placed over the top surface of the module lid using a variety of techniques.

A cooling system is adapted for reduction of evaporative loss of a liquid coolant and for efficient cooling of plural electronic devices densely accommodated in a cooling bath of a small volume. A cooling system accommodates plural electronic devices in an open space of a cooling bath provided with an inlet port and an outlet port for a liquid coolant. The cooling system is configured to directly cool the electronic devices by immersion of the electronic devices in the liquid coolant circulated in the open space. The liquid coolant contains a perfluorinated compound as a main component. The liquid coolant is adapted to exhibit a liquid weight loss percentage of 1.5% or less as determined by allowing 10 ml of the liquid coolant in a 10-ml measuring cylinder (opening diameter: 11.5 mm) to spontaneously evaporate under normal environment at a room temperature of 25° C. for 100 hours.

A cooling system is adapted for reduction of evaporative loss of a liquid coolant and for efficient cooling of plural electronic devices densely accommodated in a cooling bath of a small volume. A cooling system accommodates plural electronic devices in an open space of a cooling bath provided with an inlet port and an outlet port for a liquid coolant. The cooling system is configured to directly cool the electronic devices by immersion of the electronic devices in the liquid coolant circulated in the open space. The liquid coolant contains a perfluorinated compound as a main component. The liquid coolant is adapted to exhibit a liquid weight loss percentage of 1.5% or less as determined by allowing 10 ml of the liquid coolant in a 10-ml measuring cylinder (opening diameter: 11.5 mm) to spontaneously evaporate under normal environment at a room temperature of 25° C. for 100 hours.

A three-dimensional stacked integrated circuit is configured such that a package provided with a semiconductor chip and an interposer substrate provided with an opening are alternately stacked with respective electrode terminals and electrode pads, the package and the interposer substrate include electrode terminals having a shape in which a gap is generated between the electrode terminals in a stacking direction in a stacked state, an electrode pad for connecting the electrode terminals, and a guide hole for holding accurate positioning and connection at a time of stacking, an interlayer communication path is formed by connecting the package and the interposer substrate, and a cooling liquid flows through the gap to perform liquid immersion cooling.

Embodiments of the present disclosure relate to a cooling device, including a housing and a heat dissipation assembly. A sealed space for accommodating cooling liquid is formed in the housing. The cooling liquid is in contact with a to-be-cooled component. The heat dissipation assembly includes a heat dissipation assembly body and a heat conducting pipe communicating with the heat dissipation assembly body. The heat dissipation assembly body is arranged in the sealed space formed by the housing. The heat dissipation assembly body is configured to, after the cooling liquid transforms into the gas by absorbing the heat of the to-be-cooled component, absorb the heat of the gas to convert the gas into the liquid. The heat conducting pipe is at least partially located outside the housing. The heat dissipation assembly body is arranged at ½ to ¾ the position along the height direction in the housing.

A thermal management system for a computing device includes an immersion tank with a cooling fluid therein, a computing device positioned in the cooling fluid in the immersion tank, and a thermal block positioned in the cooling fluid in the immersion tank. The computing device heats the cooling fluid, and the thermal block is configured to receive heat from the cooling fluid. The thermal block includes a fluid management feature to direct flow of the cooling fluid relative to the thermal block and computing device.

A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.