A displacement magnification device has a first link portion including a first rigid body and a first plate spring that couples the first rigid body to a supporting portion and a movable portion. A second link portion includes a second rigid body and a second plate spring that couples the second rigid body to the supporting portion and the movable portion. In this structure, the first rigid body and the second rigid body play roles to suppress the bending of the first plate spring and the second plate spring. In addition, a connection portion between the first plate spring and the supporting portion, a connection portion between the second plate spring and the supporting portion, a connection portion between the first plate spring and the movable portion, and a connection portion between the second plate spring and the movable portion play roles of elastic hinges.

A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.

A flow sensor includes a semiconductor, an electric control circuit, a lead frame, and a spacer. The spacer is disposed in a clearance between the lead frame and the semiconductor device on an opposite side from a joint portion of the semiconductor device with the lead frame on a side of the electric control circuit across the diaphragm disposed therebetween. A surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while the air flow sensing unit is exposed. At the joint portion, the semiconductor device is attached to the lead frame via an adhesive.

An electronic device includes: a sensor mounting portion; an inertial force sensor unit detecting an inertial force, the inertial force sensor unit being mounted on the sensor mounting portion; a mounting base substrate arranged in a housing; and a support beam having multiple connection portions connecting with the sensor mounting portion and having multiple connection portions connecting with the mounting base substrate, the support beam includes an angular portion at which an extension direction of the support beam is angled. The mounting base substrate defines a substrate penetration portion that penetrates the mounting base substrate in a thickness direction of the mounting base substrate. The sensor mounting portion is arranged at an inner side of the substrate penetration portion of the mounting base substrate when viewed from the thickness direction of the mounting base substrate.

Embodiments described herein include systems and techniques for converting (i.e., transducing) a quantum-level (e.g., single photon) signal between the three wave forms (i.e., optical, acoustic, and microwave). A suspended crystalline structure is used at the nanometer scale to accomplish the desired behavior of the system as described in detail herein. Transducers that use a common acoustic intermediary transform optical signals to acoustic signals and vice versa as well as microwave signals to acoustic signals and vice versa. Other embodiments described herein include systems and techniques for storing a qubit in phonon memory having an extended coherence time. A suspended crystalline structure with specific geometric design is used at the nanometer scale to accomplish the desired behavior of the system.

A pressure sensor structure includes a sensor body including a diaphragm plate that functions as a sense electrode, a base electrode that faces the diaphragm plate, and a sidewall layer maintaining a gap between the diaphragm plate and the base electrode, and a conductive guard substrate to support the sensor body. The sidewall layer includes a guard electrode layer and upper and lower electrically insulating layers to electrically insulate the guard electrode layer. An electrically insulating layer is between the guard substrate and the sensor body to electrically insulate the guard substrate. The guard substrate is electrically connected to the guard electrode layer to function as a guard electrode together with the guard electrode layer.

Provided is a synaptic device including a substrate, a channel layer on the substrate, a gate dielectric layer on the channel layer; and a gate electrode on the gate dielectric layer, wherein the gate dielectric layer includes a charge supply dielectric film and a piezoelectric film, wherein the charge supply dielectric film includes a metal oxide or metal sulfide, wherein the piezoelectric film includes a piezoelectric material that converts a pressure stimulation into an electrical signal, wherein accordance to a change in a signal applied to the gate electrode, a magnitude and aspect of a current flowing through the channel layer are changed.

Provided is a synaptic device including a substrate, a channel layer on the substrate, a gate dielectric layer on the channel layer; and a gate electrode on the gate dielectric layer, wherein the gate dielectric layer includes a charge supply dielectric film and a piezoelectric film, wherein the charge supply dielectric film includes a metal oxide or metal sulfide, wherein the piezoelectric film includes a piezoelectric material that converts a pressure stimulation into an electrical signal, wherein accordance to a change in a signal applied to the gate electrode, a magnitude and aspect of a current flowing through the channel layer are changed.

A transducer in which electrical connections between electrode sheets and leading wires can be secured via an approach other than soldering or welding is provided. In a sheet body portion, a dielectric layer and a first electrode sheet are joined by a first main fusion layer formed of a fusion material. A first conductive portion of a first leading wire is fixed to the sheet body portion by a first clamp. The first clamp includes a plurality of first leg portions that penetrates the sheet body portion in a thickness direction, a first coupling portion that couples the proximal ends of the plurality of first leg portions and is disposed across the first conductive portion, and a plurality of first bent-back portions that is formed by bending the respective distal ends of the plurality of first leg portions and is locked with a second surface of the sheet body portion.

A micro pressure sensor includes a body having a compartmentalized chamber provided by membranes anchored between opposing walls of the body and carrying electrodes disposed on surfaces of the membranes. The body has a first pair of opposing walls and a second pair of opposing walls orthogonal to the first pair that define a chamber, a plurality of membranes having a correspond electrode layer over a surface, the plurality of membranes disposed in the chamber, anchored between the first pair of opposing walls of the body to provide plural compartments, a first set of ports coupled to a first set of the plural compartments, the first set of ports disposed in corresponding portions of a first one of the first pair of opposing walls of the body, with a second one of the first pair of opposing walls of the body being a solid portion of the body; and a second set of ports coupled to a second different set of the plural compartments, the second set of ports disposed in corresponding portions of the second one of the first pair of opposing walls of the body, with the first one of the first pair of walls of the body being a solid portion of the body.