An optoelectronic semiconductor structure is revealed. The optoelectronic semiconductor structure includes a substrate, a first electrode, an electrode contact, a semiconductor layer, and a second electrode. After a photoactive layer of the semiconductor structure absorbs energy from a light source to generate an exciton, the exciton dissociates into a first carrier and a second carrier. The first carrier is transferred to the first electrode through the first interface layer while the second carrier is transferred from the second electrode to the electrode contact directly by a tunneling effect.

An optoelectronic semiconductor structure is revealed. The optoelectronic semiconductor structure includes a substrate, a first electrode, an electrode contact, a semiconductor layer, and a second electrode. After a photoactive layer of the semiconductor structure absorbs energy from a light source to generate an exciton, the exciton dissociates into a first carrier and a second carrier. The first carrier is transferred to the first electrode through the first interface layer while the second carrier is transferred from the second electrode to the electrode contact directly by a tunneling effect.

The present technology relates to a light detecting element and a method of manufacturing the same that make it possible to reduce pixel size. The light detecting element includes a plurality of pixels arranged in the form of a matrix. Each of the pixels includes a first semiconductor layer of a first conductivity type formed in an outer peripheral portion in the vicinity of a pixel boundary, and a second semiconductor layer of a second conductivity type opposite from the first conductivity type formed on the inside of the first semiconductor layer as viewed in plan. A high field region formed by the first semiconductor layer and the second semiconductor layer when a reverse bias voltage is applied is configured to be formed in a depth direction of a substrate. The present technology is, for example, applicable to a photon counter or the like.

An imaging element which is formed by sequentially stacking at least an anode, an anode-side buffer layer, a photoelectric conversion layer, and a cathode, in which the anode-side buffer layer includes a material having structural formula ##STR00001##
in which thiophene and carbazole are combined.

A photoelectric conversion element, including a first electrode, a second electrode, and at least one organic layer being present between the first electrode and the second electrode, in which the organic layer contains at least two kinds of compounds having the same skeletons and different substituents in combination.

The present technology relates to an imaging device, a manufacturing device, and a manufacturing method capable of preventing a substance such as hydrogen from entering and preventing change in performance. The imaging device includes an organic photoelectric conversion film, an upper electrode provided in an upper portion of the organic photoelectric conversion film, a lower electrode provided in a lower portion of the organic photoelectric conversion film, and a metal thin film provided between the organic photoelectric conversion film and the upper electrode or between the organic photoelectric conversion film and the lower electrode. The metal thin film is provided between the organic photoelectric conversion film and the upper electrode. The upper electrode is formed of an oxide semiconductor, a metal oxide, and the metal thin film. The present technology can be applied to a vertical spectral imaging device.

A first semiconductor element according to one embodiment of the present disclosure includes: an element substrate including an element region in which a wiring layer and a first semiconductor layer including a compound semiconductor material are provided as a stack, and a peripheral region outside the element region; a readout circuit substrate opposed to the first semiconductor layer with the wiring layer interposed therebetween, and electrically coupled to the first semiconductor layer with the wiring layer interposed therebetween; a first electrode provided in the wiring layer and electrically coupled to the first semiconductor layer; a second electrode opposed to the first electrode with the first semiconductor layer interposed therebetween; and an insulating layer provided on the second electrode and having a non-reducing property.

An imaging element includes a layered structural body formed of a first electrode, a light receiving layer formed on the first electrode, and a second electrode formed on the light receiving layer, and a single first buffer layer formed of an amorphous organic material and a single second buffer layer formed of an amorphous inorganic material are provided between the light receiving layer and the second electrode from the light receiving layer side.

Disclosed is a photodiode, which includes a graphene-silicon quantum dot hybrid structure, having improved optical and electrical characteristics by controlling the sizes of silicon quantum dots and the doping concentration of graphene. The photodiode including the graphene-silicon quantum dot hybrid structure of the present disclosure may be easily manufactured, may be manufactured over a large area, has a wide photodetection band from the ultraviolet light region to the near infrared region, and allows selective absorption energy control.

The present invention provides an optical semiconductor device in which damage of a lens when being mounted and mounting displacement due to suction failures of a chip can be suppressed.

An optical semiconductor device according to an embodiment includes: a semiconductor substrate having a first surface and a second surface facing the first surface; an electrode formed over the first surface of the semiconductor substrate; an optical element that is electrically coupled to the electrode and is formed in the semiconductor substrate; and a lens arranged on the second surface side of the optical element. A concave part is formed in the second surface of the semiconductor substrate, and the lens is arranged at the bottom of the concave part. A top part on the second surface side of the lens is located on the first surface side relative to the second surface located around the concave part.