Disclosed are devices, systems and methods regarding ceramic-substrate ultra-wideband (UWB) antennas that utilize surface-mount technology (SMT) for installation, integration and connection to external devices, electronics and systems. Numerous configurations are disclosed for elements comprising each antenna. This ensures that the disclosed antennas may be configured in design to address varying performance requirements as well as to optimize performance across portions of the UWB spectrum.

A waveguide assembly which includes an elongated waveguide element (1) and a connector body (2). The connector body (2) is connected to an end of the elongated waveguide element (1) and has a substantially planar bottom surface (24) and an opposing top surface (23). The connector body is made from a single piece of partially metallized dielectric. The connector body has a waveguide coupling element (21) adjacent to the elongated waveguide element (1). The connector body further has an arrangement of electromagnetic band gap elements (27) adjacent to the waveguide coupling element (21).

A dielectric waveguide for propagating high-frequency waves is provided, the dielectric waveguide including a first section having a substantially uniform cross-section; and a second section having a larger cross-section than the first section. A method of manufacturing a dielectric waveguide is also provided. A dielectric waveguide assembly is also provided. A radar device is also provided, including the dielectric waveguide or a dielectric waveguide arrangement including the dielectric waveguide and a holder that at least partially surrounds the dielectric waveguide.

A device, including: a dielectric case or chassis; a first integrated circuit (IC) configured to produce a millimeter wave signal; a first IC antenna configured to receive the millimeter wave signal from the IC and radiate the millimeter wave signal; and a first waveguide configured to guide the radiated millimeter wave signal to the dielectric case, wherein the millimeter wave signal is coupled into to the dielectric case.

The present disclosure relates to a multilayer electromagnetic waveguide that includes a plurality of layers forming guide channels for an electromagnetic wave, and at least one transition device including at least one dielectric layer between two guide channels, referred to as coupled guide channels, extending as an extension. Each transition device includes at least one adaptation channel extending in a longitudinal direction, and each adaptation channel is defined by two electrically conductive walls. At least one wall extends along the dielectric spacer layer from one end of the coupled guide channel, over a length suitable for optimizing the transmission of an electromagnetic wave between the two coupled guide channels.

The present disclosure provides systems and methods associated with mode conversion for electromagnetic field modification. A mode converting structure (holographic metamaterial) is formed with a distribution of dielectric constants chosen to convert an electromagnetic radiation pattern from a first mode to a second mode to attain a target electromagnetic radiation pattern that is different from the input electromagnetic radiation pattern. A solution to a holographic equation provides a sufficiently accurate approximation of a distribution of dielectric constants that can be used to form a mode converting device for use with one or more transmission lines, such as waveguides. One or more optimization algorithms can be used to improve the efficiency of the mode conversion.

A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.

An object is to provide a transmission line having an air bridge structure in which grounding conductors of a transmission line are connected by wiring and which is stable in terms of mechanical strength by lowering an electrostatic capacitance in a region where the wirings connecting the central conductor and the grounding conductor intersect with each other. The transmission line includes a substrate, a first central conductor and a second central conductor that are formed on a surface of the substrate, a third central conductor that has a first erection portion and a second erection portion erected on the surface, and a first grounding conductor and a second grounding conductor. The transmission line further includes a third grounding conductor connecting the first grounding conductor and the second grounding conductor. The third central conductor and the third grounding conductor form an air bridge structure.

A dielectric filter unit includes three or more dielectric blocks including a first dielectric block and a second dielectric block and arranged in a predetermined direction, and a transmission line. The three or more dielectric blocks include at least one dielectric block between the first dielectric block and the second dielectric block. Each of the three or more dielectric blocks is electromagnetically coupled to one or two adjacent dielectric blocks included in the three or more dielectric blocks. The transmission line is electromagnetically coupled to the first dielectric block and the second dielectric block.

A multilayer wiring board having a first layer and a second layer laminated with a ground conductor, respectively, and having a differential wire line configured with a first wire line and a second wire line, includes a pair of through-holes and which is formed in the first layer and the second layer and electrically connects the first wire line and the second wire line arranged on one surface of the multilayer wiring board and the first wire line and the second wire line arranged on the other surface of the multilayer wiring board, respectively; and clearances and which insulate the ground conductor and the through-holes and, in which the pair of through-holes formed in the second layer is arranged so that a virtual line connecting centers of the pair of through-holes is inclined with respect to a line perpendicular to a signal propagation direction of the differential wire line.