Patent classifications
H01P5/085
Surface wave excitation device having a multi-layer PCB construction with closed regions therein
A surface wave excitation device includes a transmission line disposed on a wire layer PCB, and a same quantity of layers are respectively disposed above and below the wire layer PCB. A copper wire is disposed on each layer of PCB, and the copper wire forms a closed region. Closed regions on the PCB that are respectively disposed above and below the wire layer PCB and that have a same distance from the wire layer PCB are in a same shape, and a closed region on a PCB farther away from the wire layer PCB occupies a larger area. The wire layer PCB includes first and second closed regions, the first closed region is disposed on one side of the transmission line, and the second closed region is disposed on the other side, and shapes of the first and second closed regions are mutually symmetrical with the transmission line as a symmetry axis.
SIGNAL TRANSMITTING DEVICE
A signal transmitting device is configured to transmit a radio frequency signal outputted from a chip. The signal transmitting device includes a substrate and a connecter. The substrate is coupled to the chip. The substrate includes a waveguide, and the waveguide is configured to transmit the radio frequency signal along a first direction. The connecter is coupled to the substrate and configured to extract the radio frequency signal from the substrate to transmit the same along a second direction. The second direction is perpendicular to the substrate.
CONNECTION ASSEMBLY FOR ANTENNA AND BASE STATION ANTENNA
A connection assembly for an antenna includes a printed circuit board and a coaxial cable connected to the printed circuit board. A transmission trace and a solder pad are provided on the printed circuit board. An opening for receiving an end portion of the coaxial cable is also provided in the printed circuit board, and an exposed outer conductor of the end portion extends into the opening, and an exposed inner conductor reaches the solder pad. The connection assembly further includes a ground structure, which is electrically connected to a ground metal layer on a second surface of the printed circuit board, and the ground structure is at least partially arranged on both sides of the exposed inner conductor and/or the exposed outer conductor.
High-frequency line connection structure
A high-frequency line connection structure connects a coaxial line and a planar line. The high-frequency line connection structure includes a conductive base that is formed into a planar shape having a length that matches a length of the planar line along a lengthwise direction of a substrate, where the planar line is disposed on a surface of the conductive base, and a protrusion structure provided in a region, on the surface of the conductive base, adjacent to the coaxial line, the protrusion structure protruding from the surface of the conductive base, where the protrusion structure is in contact with a side surface of a region along the lengthwise direction of the substrate, where a ground conductive film with a smaller width out of a pair of ground conductive films of the planar line, is formed.
ANTENNA MODULE HAVING MULTILAYER IMPEDANCE CONVERTER, AND ELECTRONIC DEVICE COMPRISING SAME
Provided is an electronic device having an antenna module according to one embodiment. The electronic device comprises: a transceiver circuit disposed in the antenna module composed of a multi-layer substrate; a first transmission line disposed on the first layer of the antenna module and configured to be electrically connected to the transceiver circuit; a second transmission line disposed on the second layer of the antenna module and configured to be electrically connected to the antenna; and a vertical via configured to vertically connect the first transmission line and the second transmission line, wherein at least one of the first and second transmission lines connected to the vertical via has an impedance converter.
Well thermalized stripline formation for high-density connections in quantum applications
A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.
Adapter Device, Feeder Device, and Antenna
An adapter device, a feeder device, and an antenna are provided. The adapter device includes a coaxial cable, an air dielectric microstrip, a ground plane, and a non-flat metal part. An outer conductor of the coaxial cable is electrically connected to the non-flat metal part, the non-flat metal part and the ground plane form non-flat capacitive coupling, and an inner conductor of the coaxial cable is electrically connected to the air dielectric microstrip. The outer conductor of the coaxial cable is grounded.
DYADIC RADIAL COUPLER
A two-port dyadic radial coupler for RF communications between PCB layers is disclosed. The coupler includes an input port, an impedance matching transformer, a coaxial conductor, and at least one coupled port. The input or coupled port has an at least partially annular conducting strip axially aligned with the coaxial conductor, causing radial coupling excitation by an RF signal to couple the signal between the input port and coupled port. The coupler is configured for coupling of RF signals within a select frequency range at 0 dB attenuation. In other embodiments, the coupler is configured for frequency-selective coupling to attenuate undesired frequencies. In various embodiments, the RF signal is parasitically coupled to a plurality of coupled ports on intermediate layers of the PCB. In additional embodiments, the coupled port may be left disconnected from additional circuit elements, causing the coupler to act as an antenna.
Radio frequency connectors, omni-directional WiFi antennas, omni-directional dual antennas for universal mobile telecommunications service, and related devices, systems, methods, and assemblies
Antenna systems have an RF connector, a PCB dipole antenna, and a radome. The RF connector provides a direct connection to the PCB and limits PIM. An omni-directional WiFi antenna has a pair of horizontal dipole antennas on a PCB having different wavelengths and same frequency. An omni-directional UMTS dual antenna has a vertical arrangement of two independent antennas on a PCB and has a jumper printed circuit board connecting the RF connector to the upper antenna. Corresponding connectors, radomes, and ways of combining antenna elements on a single PCB are also disclosed. A single frequency omnidirectional antenna includes both half and full wavelength dipole elements. A plus-shaped radome enhances the omnidirectional radiation pattern of the enclosed antenna. A jumper printed circuit board allows independent antennas on a single circuit board without the degradation of internal coaxial connections. The connector provides a direct interface with a circuit board to reduce the number of parts and also reduce passive intermodulation.
METHOD TO DESIGN AND ASSEMBLE A CONNECTOR FOR THE TRANSITION BETWEEN A COAXIAL CABLE AND A MICROSTRIP LINE
A method to design and assemble a connector for the transition between a coaxial cable and a microstrip line involves in connecting a coaxial connector in series with a metallic ring to form a new coaxial connector, wherein the thickness of the metallic ring and the diameter of its through hole are important design parameters to determine the frequency response of the transition. By properly selecting their values and connecting the new coaxial connector to the microstrip line, a resonant response caused by the excitation of the first higher-order mode of the original coaxial connector can be attenuated or even eliminated from the frequency response. Thus, the method improves the insertion loss of the transition at high frequencies, and increases its 1-dB passband. Note that the signal line of the microstrip line is not inserted into the through hole of the metallic ring in the final assembly of the transition.