A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.

A capacitance module may include at least one capacitive sensor layer; an antenna connected to the capacitive sensor layer; and at least one haptic actuator connected to the capacitive sensor layer.

An antenna structure for a metal-cased electronic device includes a radiator, a feed portion, and a slit. The feed portion can feed signals into the radiator, the radiator includes a first end and a second end, the first end disposes a first radiation portion, the second end disposes a second radiation portion and a third radiation portion, the second radiation portion and the third radiation portion are coupled to each other to radiate a radiation signal at a first frequency band, the slit and the radiator is spaced at intervals, and the slit is coupled to the first radiation portion to radiate the radiation signal at a second frequency band. The present disclosure also provides an electronic device with the antenna structure.

A base station antenna comprises a reflector, a plurality of first radiating elements arranged in a first column that extends in a vertical direction, a plurality of second radiating element arranged in a second column that extends in the vertical direction, and a plurality of parasitic elements, where the parasitic elements are arranged around the first radiating elements and/or second radiating elements. Each parasitic element is configured as a rod-shaped metal part, where a longitudinal axis of the rod-shaped metal part extends at an angle of between 70° to 110° with respect to a plane defined by the reflector, and the parasitic elements are positioned in front of the reflector in and are electrically floating with respect to the reflector.

An assortment of radar sensors in different variant embodiments. Each radar sensor has: a housing terminated by a radome, a circuit board that is equipped on the side facing away from the radome with at least one radio-frequency module, and an antenna structure on the side of the circuit board facing the radome. The housing is realized identically in all variant embodiments. The antenna structure has a planar antenna structure in at least one variant embodiment, and has a hollow conductor structure in at least one variant embodiment.

An electronic device is provided, which includes a display unit included in a first housing; a second housing; and a hinge part configured to couple the first housing and the second housing. The display unit includes a first PCB; a first antenna pattern at least partially disposed at a first side surface of the first housing adjacent to the hinge part; a conductive member electrically connected to the first antenna pattern; and a first conductive plate electrically connected to at least a portion of the conductive member. The second housing includes a second conductive plate electrically connected to the first conductive plate; a third conductive plate electrically connected to the second conductive plate; and a second PCB at which a ground electrically connected to the third conductive plate is disposed.

An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier, an antenna portion, a first portion and a second portion. The antenna portion is located on the carrier. The first portion is located on the carrier. The second portion is located on the carrier and is configured for blocking a material from entering the antenna area, wherein the material covers a lateral surface of the carrier.

An electronic device and method for controlling the electronic device are provided. The electronic device includes a first surface in a first direction, a second surface in a second direction opposite to the first direction, and a third surface enclosing at least a portion of a space formed between the first surface and the second surface. The electronic device also includes an audio module changing an audio signal input to the electronic device into an electronic signal, and a processor being operationally connected to the display and the audio module. The processor is configured to detect the audio signal input via the audio module from a first user via the first surface, detect a touch signal dragged from the third surface in the direction of the second surface, and display in the second surface a translation corresponding to the audio signal.

What is disclosed is a module arrangement. An antenna device and at least one electronic component are arranged next to each other and within one plane between a top side and a bottom side of the module arrangement. A shielding device which has a shielding effect relative to electromagnetic signals is located between the antenna device and the electronic component. Additionally, a method for manufacturing a module arrangement is disclosed.

A method for providing electromagnetic shielding of a semiconductor die includes attaching a semiconductor die to a package substrate of a packaged radio frequency module, where the package substrate includes one or more radio frequency circuits fabricated therein. The method also includes encapsulating the semiconductor die with a molding compound. The method also includes at least partially covering the molding compound with an electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.