A antenna may include a first dielectric layer having a first surface and a second surface opposing the first surface; a second dielectric layer having a third surface, and a fourth surface opposing the third surface; an adhesive layer disposed between the second surface and the third surface and connecting the first dielectric layer to the second dielectric layer; a patch pattern disposed on the second surface and embedded in the adhesive layer; and a coupling pattern disposed on the fourth surface and having at least a portion overlapping the patch pattern on a plane. Each of the first dielectric layer and the second dielectric layer may include an organic binder and an inorganic filler.

A multibeam hemispherical X-band array inserts nulls at horizontal and near horizontal angles to suppress interfering signals, without degrading authentic signals arriving at other angles. The multibeam hemispherical array includes three annular (360) rows of antenna elements, each row having 64 elements. Elements of the first row, which have the smallest elevation angle, have pairs of circular patches coupled with a phase delay line. Each pair of circular patches is spaced apart from and aligned with two pairs of similarly shaped (circular) and sized parasitic directors. The spacing between driven patches of adjacent elements in a row is about equal to one half of the wavelength of the radiated wave. The array fits within a conventional 24-inch diameter marine radome.

A wearable device is provided. The wearable device includes a housing, an input member disposed on a lateral surface of the housing and including an outer lateral surface including a conductive portion and a non-conductive portion, a metal member disposed inside the housing and in contact with the conductive portion of the outer lateral surface, a printed circuit board (PCB) disposed on the metal member, a patch antenna including a conductive patch disposed on a surface of the PCB facing the input member at a location corresponding to the non-conductive portion, a wireless communication circuit electrically connected to the PCB and the patch antenna, and a processor connected to the metal member. The wireless communication circuit transmits a signal by feeding power to the patch antenna, and the processor acquires user biometric information through the metal member and the conductive portion of the input member.

To provide a novel antenna, wireless communication module, and wireless communication device excellent in long-term reliability. The antenna includes a first conductor, a second conductor facing the first conductor in a first direction, a third conductor, a fourth conductor, a power supply line configured to be electromagnetically connected to the third conductor, and a reinforcing member including a dielectric material. The third conductor extends along the first direction, is located between the first conductor and the second conductor, and is configured to capacitively connect the first conductor and the second conductor. The fourth conductor extends along the first direction and is configured to be electrically connected to the first conductor and the second conductor. The reinforcing member is located on at least a portion of any of the first conductor and the second conductor.

An antenna package according to an embodiment includes a plurality of antenna units including first antenna units and second antenna units, a circuit board electrically connected to the antenna units. The circuit board includes a core layer including a first surface and a second surface facing each other, a first circuit wiring disposed on the first surface of the core layer and electrically connected to the first antenna units, and a second circuit wiring distributed on the first and second surfaces of the core layer and electrically connected to the second antenna units. Antenna units of different resonance frequencies can be efficiently included in the package using the circuit wiring design.

Provided is a 5G dual port beamforming antenna. The beamforming antenna according to an embodiment of the present disclosure includes a plurality of patch antennas, and the patch antenna includes: a first patch positioned on an upper portion; a second patch positioned on a left side under the first patch and having a plurality of feeding ports formed thereon; a third patch positioned on an upper portion of a right side of the second patch; and a fourth patch positioned on a lower portion of the right side of the second patch. Accordingly, 3D wide angle beamforming is possible in an antenna to be used in 5G mobile communication systems, military radar systems, etc.

An assortment of radar sensors in different variant embodiments. Each radar sensor has: a housing terminated by a radome, a circuit board that is equipped on the side facing away from the radome with at least one radio-frequency module, and an antenna structure on the side of the circuit board facing the radome. The housing is realized identically in all variant embodiments. The antenna structure has a planar antenna structure in at least one variant embodiment, and has a hollow conductor structure in at least one variant embodiment.

An electromagnetic wave transmission structure including a substrate, at least one transmission line, antennas, and tunable dielectric units is provided. The transmission line includes a first extending portion and second extending portions. The first extending portion is extended in a first direction. The second extending portions are respectively extended from two opposite edges of the first extending portion, and an extending direction thereof is parallel to a second direction. The second extending portions are arranged along the first direction. The antennas are disposed near the at least one transmission line. The tunable dielectric units are overlapped with portions of the at least one transmission line located between the antennas. Each tunable dielectric unit has an overlapped first electrode layer and controllable dielectric layer. The controllable dielectric layer is disposed between the first electrode layer and the at least one transmission line.

An antenna device comprising a first antenna, a second antenna and a circuit board. The first antenna includes a first insulating layer, a first signal-feeding line and two first grounding lines. The first signal-feeding line is disposed on a first surface of the first insulating layer. The first grounding lines are disposed on a second surface of the first insulating layer. The second antenna includes a second insulating layer, a second signal-feeding line and two second grounding lines. The second signal-feeding line is disposed on a first surface of the second insulating layer. The second grounding lines are disposed on a second surface of the second insulating layer. The first insulating layer and the second insulating layer intersect at about 90 degrees. The first and second antennas are disposed on a first surface of the circuit board. The first axis and the second axis are adjacent and substantially parallel.

In various embodiments, disclosed herein are systems and methods directed to the fabrication of a coreless semiconductor package (e.g., a millimeter (mm)-wave antenna package) having an asymmetric build-up layer count that can be fabricated on both sides of a temporary substrate (e.g., a core). The asymmetric build-up layer count can reduce the overall layer count in the fabrication of the semiconductor package and can therefore contribute to fabrication cost reduction. In further embodiments, the semiconductor package (e.g., a millimeter (mm)-wave antenna packages) can further comprise dummification elements disposed near one or more antenna layers. Further, the dummification elements disposed near one or more antenna layers can reduce image current and thereby increasing the antenna gain and efficiency.