H01Q13/22

Connecting unit for connecting to first and second interfaces, where the connecting unit comprises an internal conductor disposed within a housing formed by half-shell construction

A connecting unit for radio-frequency components has: a housing; a first interface and a second interface which are arranged on the housing and are designed to be coupled to in each case one radio-frequency component; an internal conductor which runs in the housing and is connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; a spacer which surrounds the internal conductor and extends at least along a portion of the length of the internal conductor. The housing is manufactured from an electrically conductive and rigid material and the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections.

Connecting unit for connecting to first and second interfaces, where the connecting unit comprises an internal conductor disposed within a housing formed by half-shell construction

A connecting unit for radio-frequency components has: a housing; a first interface and a second interface which are arranged on the housing and are designed to be coupled to in each case one radio-frequency component; an internal conductor which runs in the housing and is connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; a spacer which surrounds the internal conductor and extends at least along a portion of the length of the internal conductor. The housing is manufactured from an electrically conductive and rigid material and the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections.

Slot antenna device

A slot antenna device includes a first electrical conductor including first and second electrically conductive surfaces, a second electrical conductor including a third electrically conductive surface that opposes the second electrically conductive surface, a waveguide body on the second electrically conductive surface, and an artificial magnetic conductor extending on both sides of the waveguide body. The first electrical conductor includes a slot. The waveguide body includes a waveguide surface that opposes the third electrically conductive surface. The third electrically conductive surface, the waveguide surface, and the artificial magnetic conductor define a waveguide. The waveguide body includes a first ridge and a second ridge. As viewed from a direction perpendicular or substantially perpendicular to the waveguide surface, the slot is located between the one end of the first ridge and the one end of the second ridge.

Slot antenna device

A slot antenna device includes a first electrical conductor including first and second electrically conductive surfaces, a second electrical conductor including a third electrically conductive surface that opposes the second electrically conductive surface, a waveguide body on the second electrically conductive surface, and an artificial magnetic conductor extending on both sides of the waveguide body. The first electrical conductor includes a slot. The waveguide body includes a waveguide surface that opposes the third electrically conductive surface. The third electrically conductive surface, the waveguide surface, and the artificial magnetic conductor define a waveguide. The waveguide body includes a first ridge and a second ridge. As viewed from a direction perpendicular or substantially perpendicular to the waveguide surface, the slot is located between the one end of the first ridge and the one end of the second ridge.

Broadband conformal antenna

A broadband conformal antenna (“BCA”) is disclosed. The BCA includes a narrow approximately rectangular outer conductive (“NARO”) housing, a plurality of dielectric layers within the NARO housing forming a laminated dielectric structure, and an inner conductor formed within the laminated dielectric structure. The NARO housing includes a top broad wall and the BCA further includes an antenna slot within the top broad wall. The BCA is configured to support a transverse electromagnetic signal within the NARO housing.

Broadband conformal antenna

A broadband conformal antenna (“BCA”) is disclosed. The BCA includes a narrow approximately rectangular outer conductive (“NARO”) housing, a plurality of dielectric layers within the NARO housing forming a laminated dielectric structure, and an inner conductor formed within the laminated dielectric structure. The NARO housing includes a top broad wall and the BCA further includes an antenna slot within the top broad wall. The BCA is configured to support a transverse electromagnetic signal within the NARO housing.

Curved near-field-focused slot array antennas

A slot array antenna including a smooth curved surface and planar feed structures which are respectively disposed at two ends of the smooth curved surface and are tangent to the smooth curved surface. The smooth curved surface includes at least two arcs mutually connected by smooth transition. The at least two arcs each includes an upper copper metal layer, a lower copper metal layer, and a dielectric substrate layer between the upper and lower copper metal layers. The upper copper metal layer includes radiating slots, and the adjacent radiating slots in a linear array have opposite offsets along the center line of the slot array antenna. The dielectric substrate layer includes metallic vias symmetrically arranged on both sides of the central line of the antenna to form a substrate integrated waveguide.

Curved near-field-focused slot array antennas

A slot array antenna including a smooth curved surface and planar feed structures which are respectively disposed at two ends of the smooth curved surface and are tangent to the smooth curved surface. The smooth curved surface includes at least two arcs mutually connected by smooth transition. The at least two arcs each includes an upper copper metal layer, a lower copper metal layer, and a dielectric substrate layer between the upper and lower copper metal layers. The upper copper metal layer includes radiating slots, and the adjacent radiating slots in a linear array have opposite offsets along the center line of the slot array antenna. The dielectric substrate layer includes metallic vias symmetrically arranged on both sides of the central line of the antenna to form a substrate integrated waveguide.

TFT substrate, scanning antenna provided with TFT substrate, and method for producing TFT substrate
10937812 · 2021-03-02 · ·

A TFT substrate includes a transmission and/or reception region including a plurality of antenna unit regions, and a non-transmission and/or reception region located in a region other than the transmission and/or reception region. Each of the plurality of antenna unit regions includes a TFT and a patch electrode electrically connected to a drain electrode of the TFT. The TFT substrate includes a source metal layer including: a source electrode of the TFT, the drain electrode, and a source bus line; a gate metal layer formed on the source metal layer and including a gate electrode of the TFT, a gate bus line, and a patch electrode; a gate insulating layer formed between the source metal layer and the gate metal layer; and a conductive layer formed on the gate metal layer, and the TFT substrate does not include an insulating layer between the gate metal layer and the conductive layer.

TFT substrate, scanning antenna provided with TFT substrate, and method for producing TFT substrate
10937812 · 2021-03-02 · ·

A TFT substrate includes a transmission and/or reception region including a plurality of antenna unit regions, and a non-transmission and/or reception region located in a region other than the transmission and/or reception region. Each of the plurality of antenna unit regions includes a TFT and a patch electrode electrically connected to a drain electrode of the TFT. The TFT substrate includes a source metal layer including: a source electrode of the TFT, the drain electrode, and a source bus line; a gate metal layer formed on the source metal layer and including a gate electrode of the TFT, a gate bus line, and a patch electrode; a gate insulating layer formed between the source metal layer and the gate metal layer; and a conductive layer formed on the gate metal layer, and the TFT substrate does not include an insulating layer between the gate metal layer and the conductive layer.