Superconducting interconnects with ultra-low thermal conductivity capable of providing a direct connection between a millikelvin temperature environment and a 70 K temperature environment.

Superconducting interconnects with ultra-low thermal conductivity capable of providing a direct connection between a millikelvin temperature environment and a 70 K temperature environment.

A connection structure of a superconducting layer of an embodiment incudes a first superconducting member including a first superconducting layer, and extends in a first direction, a second superconducting member including a second superconducting layer facing the first superconducting layer, and extends in the first direction, the second superconducting member having a first region, a second region, and a third region which is separated in the second direction from the second region, and a connection layer that contains a rare earth element (RE), barium (Ba), copper (Cu), and oxygen (O), and connects the first superconducting layer and the second superconducting layer. The first superconducting layer is present in a third direction between the second region and the third region, the third direction being perpendicular to the first direction and perpendicular to the second direction.

A connection structure of a superconducting layer of an embodiment incudes a first superconducting member including a first superconducting layer, and extends in a first direction, a second superconducting member including a second superconducting layer facing the first superconducting layer, and extends in the first direction, the second superconducting member having a first region, a second region, and a third region which is separated in the second direction from the second region, and a connection layer that contains a rare earth element (RE), barium (Ba), copper (Cu), and oxygen (O), and connects the first superconducting layer and the second superconducting layer. The first superconducting layer is present in a third direction between the second region and the third region, the third direction being perpendicular to the first direction and perpendicular to the second direction.

A method of manufacturing an insulated superconducting wire material comprising the steps of: removing a flux (S01) by heating a superconducting wire material at a temperature equals to or higher than a flux volatilization temperature and equals to or lower than a heatproof temperature of the superconducting wire material, the superconducting wire material comprising a channel with a channel groove and a superconducting core wire material accommodated in the channel groove of the channel, and the channel groove and the superconducting core wire material being bonded with a solder including the flux; and forming an insulated superconducting wire material (S02) of forming an insulating film on a surface of the superconducting wire material.

A method of manufacturing an insulated superconducting wire material comprising the steps of: removing a flux (S01) by heating a superconducting wire material at a temperature equals to or higher than a flux volatilization temperature and equals to or lower than a heatproof temperature of the superconducting wire material, the superconducting wire material comprising a channel with a channel groove and a superconducting core wire material accommodated in the channel groove of the channel, and the channel groove and the superconducting core wire material being bonded with a solder including the flux; and forming an insulated superconducting wire material (S02) of forming an insulating film on a surface of the superconducting wire material.

A superconducting flexible interconnecting cable connector for supercomputing systems is provided. The cable connector includes a base with a recessed area defined therein to receive superconducting flexible interconnecting cables and superconducting connecting chips to electrically connect the superconducting flexible interconnecting cables to each other. A cover is provided to cover the superconducting flexible interconnecting cables and the superconducting connecting chips when the cover is in a closed position. A compression device compresses the superconducting connecting chips together to secure the superconducting flexible interconnecting cables and the superconducting connecting chips inside the recessed area of the base when the cover is in the closed position.

A superconducting flexible interconnecting cable connector for supercomputing systems is provided. The cable connector includes a base with a recessed area defined therein to receive superconducting flexible interconnecting cables and superconducting connecting chips to electrically connect the superconducting flexible interconnecting cables to each other. A cover is provided to cover the superconducting flexible interconnecting cables and the superconducting connecting chips when the cover is in a closed position. A compression device compresses the superconducting connecting chips together to secure the superconducting flexible interconnecting cables and the superconducting connecting chips inside the recessed area of the base when the cover is in the closed position.

When bending a superconducting cable of a stack conductor structure in which a plurality of layers of tape wires are stacked, a twisting process is performed for the superconducting cable immediately before a bending portion of the superconducting cable.

When bending a superconducting cable of a stack conductor structure in which a plurality of layers of tape wires are stacked, a twisting process is performed for the superconducting cable immediately before a bending portion of the superconducting cable.