An optical semiconductor module according to the embodiment includes: a board including a transmission line; a block including a low-permittivity material; an inductor mounted on the block, the inductor being connected with the transmission line via a first wire, the first wire having a first inductance; a semiconductor laser device mounted on the board, the semiconductor laser device being connected with the transmission line via a second wire, the second wire having a second inductance smaller than the first inductance; and

a housing configured to accommodate the board, the block, the inductor, and the semiconductor laser device.

An optical semiconductor module according to the embodiment includes: a board including a transmission line; a block including a low-permittivity material; an inductor mounted on the block, the inductor being connected with the transmission line via a first wire, the first wire having a first inductance; a semiconductor laser device mounted on the board, the semiconductor laser device being connected with the transmission line via a second wire, the second wire having a second inductance smaller than the first inductance; and

a housing configured to accommodate the board, the block, the inductor, and the semiconductor laser device.

An optical device according to one embodiment includes an optical element, a sleeve including a receptacle portion and an insertion portion, and a base having a lower plate having a main surface with the optical element being mounted thereon and a side wall having a hole with the insertion portion of the sleeve optically coupled with the optical element inserted into the hole. A step difference at a position lower than the main surface is formed at a lower position of the hole in the side wall.

A monolithic edge-emitting semiconductor diode array chip (100) comprises a one-dimensional array (70) of diode emitters (50), such as laser diodes, superluminescent diodes or semiconductor optical amplifiers. Semiconductor layers are arranged on a conductive substrate (1) and include active region layers (14) arranged between upper and lower cladding layers (12, 16) and separation layers (4, 5) arranged between the conductive substrate (1) and the lower cladding layer (16). The diode emitters (50) are formed by respective ridges (9) that are separated by trenches (25) which are sufficiently deep to penetrate into the separation layers (4, 5). Each diode (50) has its own upper and lower contacts (22, 24) that allow each diode (50) to be independently drivable with a current source driver circuit connected to push a modulated push current through its associated diode and/or a current sink connected to extract a modulated pull current through its associated diode.

A monolithic edge-emitting semiconductor diode array chip (100) comprises a one-dimensional array (70) of diode emitters (50), such as laser diodes, superluminescent diodes or semiconductor optical amplifiers. Semiconductor layers are arranged on a conductive substrate (1) and include active region layers (14) arranged between upper and lower cladding layers (12, 16) and separation layers (4, 5) arranged between the conductive substrate (1) and the lower cladding layer (16). The diode emitters (50) are formed by respective ridges (9) that are separated by trenches (25) which are sufficiently deep to penetrate into the separation layers (4, 5). Each diode (50) has its own upper and lower contacts (22, 24) that allow each diode (50) to be independently drivable with a current source driver circuit connected to push a modulated push current through its associated diode and/or a current sink connected to extract a modulated pull current through its associated diode.

An optical element mounting package includes an optical component and a base. The optical component reflects light. The base has a recess. In the recess, a first mounting portion and a second mounting portion are provided. On the first mounting portion, an optical element is to be mounted. On the second mounting portion, the optical component is mounted. The optical component includes a reflective surface and a transmission film on the reflective surface. A front surface of the transmission film is inclined relative to the reflective surface.

A compact optical package includes an RGB laser unit containing red, green, and blue laser diodes within a single package, with three lenses adjacent the RGB laser unit to collimate red, green, and blue laser light emitted by the red, green, and blue laser diodes. A beam combiner combines the red, green, and blue laser light into a single RGB laser beam and also outputs a lower power feedback beam. The compact optical package also includes a movable mirror apparatus, and a fixed folding mirror upon which the single RGB laser beam output by the beam splitter impinges and reflects the single RGB laser beam toward the movable mirror apparatus. The movable mirror apparatus directs the single RGB laser beam through an exit window and to scan the single RGB laser beam in a scan pattern to form at least one desired image on a target.

Provided here are: a sub-mount board that is provided with, on its front surface, a GND pattern, a capacitor mounting pattern and a signal line, and is provided with, on its back surface, a GND pattern; a light modulation element that is bonded to the surface of the GND pattern; a matching capacitor whose back surface is bonded to the surface of the capacitor mounting pattern and whose front surface is connected through a wire to a front surface electrode of the light modulation element; a matching resistor that makes a connection between the capacitor mounting pattern and the GND pattern; and a protective resistor that makes a connection between the signal line and the GND pattern across the sub-mount board in a board thickness direction, the signal line being connected through a wire to the front surface electrode of the light modulation element. Accordingly, the sub-mount board is small-sized.

Provided here are: a sub-mount board that is provided with, on its front surface, a GND pattern, a capacitor mounting pattern and a signal line, and is provided with, on its back surface, a GND pattern; a light modulation element that is bonded to the surface of the GND pattern; a matching capacitor whose back surface is bonded to the surface of the capacitor mounting pattern and whose front surface is connected through a wire to a front surface electrode of the light modulation element; a matching resistor that makes a connection between the capacitor mounting pattern and the GND pattern; and a protective resistor that makes a connection between the signal line and the GND pattern across the sub-mount board in a board thickness direction, the signal line being connected through a wire to the front surface electrode of the light modulation element. Accordingly, the sub-mount board is small-sized.

In one embodiment, the optoelectronic semiconductor component (1) comprises a semiconductor chip (2) for generating radiation and an inorganic housing (3). The semiconductor chip (2) is accommodated in a hermetically sealed manner in the housing (3). The housing (3) has a preferably ceramic base plate (31), a cover plate (33) and at least one preferably ceramic housing ring (32) and a plurality of electrical through-connections (51). A recess (15), in which the semiconductor chip (2) is located, is formed by the housing ring (32). The base plate (31) has a plurality of electrical connection surfaces (35) on a component underside (11). A plurality of through-connections (51) each extend through the base plate (31), through the cover plate (33) and through the housing ring (32). The base plate (31), the at least one housing ring (32) and the cover plate (33) are firmly connected to one another via continuous, peripheral inorganic sealing frames (6). Finally, the housing (3) comprises a radiation exit region (34) for emitting radiation.