A pulsed laser diode array driver includes an inductor having a first terminal configured to receive a source voltage, a source capacitor coupled between the first terminal of the inductor and ground, a bypass capacitor connected between a second terminal of the inductor and ground, a bypass switch connected between the second terminal of the inductor and ground, a laser diode array with one or more rows of laser diodes, and one or more laser diode switches, each being connected between a respective row node of the laser diode array and ground. The laser diode switches and the bypass switch are configured to control a current flow through the inductor to produce respective high-current pulses through each row of the laser diode array, each of the high-current pulses corresponding to a peak current of a resonant waveform developed at that row of the laser diode array.

A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

The purpose of the present technology is to provide a video projection device capable of obtaining a satisfactory video (image) while achieving reduction in power consumption and reduction in size of the device. Provided is a video projection device including at least: a monolithic semiconductor laser array including multiple light emitting units, each of which emits a laser light beam; an optical waveguide that guides the laser light beam in a predetermined direction; a mirror that scans the laser light beam in two axes; and a diffractive element that diffracts the laser light beam in a specific direction in front of an eye and projects the laser light beam on a retina. The multiple light emitting units are respectively optically coupled to different input ports among multiple input ports included in the optical waveguide.

An optical member includes a first wavelength conversion member including a wavelength conversion portion and a ceramic portion surrounding lateral surfaces of the wavelength conversion portion, and a light shielding film arranged on an outer lateral surface of the first wavelength conversion member.

An optoelectronic package structure is provided. The optoelectronic package structure includes a heat source, a thermal conductive element, and a first optoelectronic component and a second optoelectronic component. The thermal conductive element is disposed over the heat source. The thermal conductive element defines a thermal conduction path P2 by which heat is transferred from the heat source to the thermal conductive element. The first optoelectronic component and the second optoelectronic component are arranged along an axis different from a thermal conduction path P2.

A beam combining device and method for a Bragg grating external-cavity laser module has a plurality of side by side light-emitting modules that use a Bragg grating to perform wavelength locking. Output light of the modules is incident to a beam combining element after passing through a focusing optical element for beam combining, and light subjected to beam combining is reflected partially and transmitted partially under the effect of a light splitting element. A part is incident into a dispersion element at a diffraction angle of the element. Parallel light is formed under the effect of a conversion optical element. Spots of the light beams of corresponding wavelengths of the light-emitting modules are formed on an image acquisition mechanism. Whether the wavelengths of the corresponding light-emitting modules are locked is determined by whether there is a deviation between preset spots and spots formed by the module on the acquisition mechanism.

Described herein are photonic sources and related system architectures that can satisfy the optical power requirements of large photonic accelerators. Some embodiments relate to a computer comprising a photonic accelerator configured to perform matrix multiplication; a fiber array optically coupled to the photonic accelerator; and a photonic source optically coupled to the fiber array. The photonic source comprising a laser array comprising a plurality of monolithically co-integrated lasers, and a coupling lens array comprising a plurality of monolithically co-integrated lenses, the coupling lens array optically coupling the laser array to the fiber array. The laser array is configured to output between 0.1 W and 10 W of optical power.

A pulsed laser diode driver includes an inductor having a first terminal configured to receive a source voltage. A source capacitor has a first terminal connected to the first terminal of the inductor to provide the source voltage. A bypass switch has a drain node connected to a second terminal of the inductor and to a first terminal of a bypass capacitor. A laser diode switch has a drain node connected to the second terminal of the inductor. A laser diode has an anode connected to a source node of the laser diode switch and a cathode connected to a bias voltage node. The laser diode switch and the bypass switch control a current flow through the inductor to produce a high-current pulse through the laser diode, the high-current pulse corresponding to a peak current of a resonant waveform developed at the anode of the laser diode.

A pulsed laser diode array driver includes an inductor having a first terminal configured to receive a source voltage, a source capacitor coupled between the first terminal of the inductor and ground, a bypass capacitor connected between a second terminal of the inductor and ground, a bypass switch connected between the second terminal of the inductor and ground, a laser diode array with one or more rows of laser diodes, and one or more laser diode switches, each being connected between a respective row node of the laser diode array and ground. The laser diode switches and the bypass switch are configured to control a current flow through the inductor to produce respective high-current pulses through each row of the laser diode array, each of the high-current pulses corresponding to a peak current of a resonant waveform developed at that row of the laser diode array.