Provided is an acoustic wave device that uses a plate wave. The acoustic wave device includes a piezoelectric film and a first resonator and a second resonator each including an IDT electrode located on an upper surface of the piezoelectric film. The thickness of the piezoelectric film is smaller than twice the period of the electrode fingers of the IDT electrodes. The duty of the electrode fingers of the first resonator and the duty of the electrode fingers of the second resonator are different from each other.

An acoustic wave device includes: a substrate; a first electrode on the substrate; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer. A bonding interface is located between the substrate and the first electrode. The full width at half maximum (FWHM) in the X-ray diffraction pattern of the crystal plane <002> of the piezoelectric layer is between 10 arc-sec and 3600 arc-sec.

Filter devices are disclosed. A filter device includes a piezoelectric plate comprising a supported portion, a first diaphragm, and a second diaphragm. The supported portion is attached to a substrate and the first and second diaphragms spans respective cavities in the substrate. A first interdigital transducer (IDT) has interleaved fingers on the first diaphragm. A second interdigital transducer (IDT) has interleaved fingers on the second diaphragm. A first dielectric layer is between the interleaved fingers of the first IDT, and a second dielectric layer is between the interleaved fingers of the second IDT. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer. The piezoelectric plate and the first and second IDTs are configured such that radio frequency signals applied to first and second IDTs excite primary shear acoustic modes in the respective diaphragms.

Piston mode Lamb wave resonators are disclosed. A piston mode Lamb wave resonator can include a piezoelectric layer, such as an aluminum nitride layer, and an interdigital transducer on the piezoelectric layer. The piston mode Lamb wave resonator has an active region and a border region, in which the border region has a velocity with a lower magnitude than a velocity of the active region. The border region can suppress a transverse mode.

A surface acoustic wave (SAW) device having a high electromechanical coupling coefficient based on double-layer electrodes and a preparation method thereof. A structure of the SAW device includes a Cu electrode, a piezoelectric film and an Al electrode on a substrate in sequence. A signal terminal of the Cu electrode is opposite to a ground terminal of the Al electrode. A ground terminal of the Cu electrode is opposite to a signal terminal of the Al electrode. Since Sezawa wave mode that is adopted is formed by coupling film thickness vibration and transverse vibration, a longitudinal electric field (in a direction of thickness of a film) and a transverse electric field (in a propagation direction of SAW) are excited through the double-layer electrodes so that the electromechanical coupling coefficient of the SAW device is improved by changing a coupling pattern between the electric fields and the piezoelectric film.

In a piezoelectric device, a layered portion includes, at a position at least above a recess, a single crystal piezoelectric layer and a pair of electrode layers to apply voltage to the single crystal piezoelectric layer. At least a portion of the pair of electrode layers includes a lower electrode layer extending along a surface of the single crystal piezoelectric layer, the surface being closer to a base. The lower electrode layer is present only inside the recess.

A filter circuit has a cascaded resonator circuit with a first acoustic resonator and a second acoustic resonator connected in series on a printed circuit board (PCB). The admittances as functions of frequency of the first and second acoustic resonators are substantially identical. The filter circuit also has a composite resonator circuit formed by a capacitor connected in parallel with the second acoustic resonator on the PCB. The capacitor improves a steepness of an upper bandpass edge of the filter circuit.

Methods of fabricating resonator and filter devices. A first conductor pattern formed on a front surface of a piezoelectric plate includes a first plurality of contact pads and an interdigital transducer (IDT). The IDT and the piezoelectric plate are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. An acoustic Bragg reflector is between a substrate and a back surface of the piezoelectric plate, the acoustic Bragg reflector configured to reflect the shear primary acoustic mode. A second conductor pattern including a second plurality of contact pads is formed on a back surface of the interposer. The first plurality of contact pads is directly connected to respective contact pads of the second plurality of contact pads. A perimeter of the acoustic resonator chip is sealed to a perimeter of the interposer.

An acoustic wave device includes first and second IDT electrodes electrically connected in series with each other by a common busbar common to the first and second IDT electrodes. In each of a first acoustic impedance layer and a second acoustic impedance layer, at least one of at least one high acoustic impedance layer and at least one low acoustic impedance layer is a conductive layer. At least a portion of the conductive layer in the first acoustic impedance layer and at least a portion of the conductive layer in the second acoustic impedance layer do not overlap with the common busbar when viewed in plan from a thickness direction of a piezoelectric layer. The conductive layer in the first acoustic impedance layer and the conductive layer in the second acoustic impedance layer are electrically insulated from each other.

An acoustic wave device includes a support substrate including silicon, a piezoelectric layer provided directly or indirectly on the support substrate, and an interdigital transducer (IDT) electrode provided on the piezoelectric layer. When a wavelength defined by an electrode finger pitch of the IDT electrode is λ, a thickness of the piezoelectric layer is about 1λ or less. V.sub.L, which is an acoustic velocity of a longitudinal wave component of a bulk wave propagating through the piezoelectric layer, satisfies Unequal Equation (2) below in relation to an acoustic velocity V.sub.Si-1 determined by Equation (1) below:
V.sub.Si-1=(V.sub.2).sup.1/2 (m/sec)  Equation (1),
V.sub.Si-1≤V.sub.L  Unequal Equation (2), V.sub.2 in Equation (1) is a solution of Equation (3), and
Ax.sup.3+Bx.sup.2+Cx+D=0  Equation (3).