An electronic device may include one or more output buffers each including a pair of final p-channel metal oxide semiconductor (PMOS) and n-channel metal oxide semiconductor (NMOS) transistors, a first pre-buffer to drive the PMOS transistor, and a second pre-buffer to drive the NMOS transistor. Each output buffer receives power from a pre-buffer supply filtering circuit, which may include a supply capacitor for stabilizing supply voltage, a low-pass first pre-buffer supply filter to filter the voltage supplied to the first pre-buffer, and a low-pass second pre-buffer supply filter the voltage supplied to the second pre-buffer.

The interface circuit includes a first transistor, a second transistor, a first switch, a first logic circuit and a second logic circuit. The first transistor is controlled by a enable signal. The second transistor is controlled by a first control signal. The first switch is coupled between a second end of the first transistor and the output end of the interface circuit, wherein the first switch is controlled by a second control signal. The first logic circuit generates the first control signal according to the enable signal and at least one indication signal. The second logic circuit generates the second control signal according to the first control signal and the enable signal.

A Schmitt trigger circuit includes a first and second set of transistors, a first and second feedback transistor, and a first and second circuit. The first set of transistors is connected between a first voltage supply and an output node. The first voltage supply has a first voltage. The second set of transistors is connected between the output node and a second voltage supply. The second voltage supply has a second voltage. The first feedback transistor is connected to the output node, a first node and a second node. The second feedback transistor is connected to the output node, a third node and a fourth node. The first circuit is coupled to and configured to supply the second supply voltage to the second node. The second circuit is coupled to and configured to supply the first supply voltage to the fourth node.

The present disclosure provides an SST driving circuit, a chip, and a driving output method. The SST driving circuit includes: a signal driver for driving and outputting a signal to be driven, the signal driver including termination resistors; a first electrostatic current discharge module, providing first discharge paths for electrostatic currents generated in the signal driver; a second electrostatic current discharge module, connected in series with the termination resistors, providing second discharge paths for the electrostatic currents; and a power clamp, used for conducting the power clamp circuit, the first discharge paths and the second discharge paths when a power supply voltage of the signal driver exceeds a clamping voltage. The present disclosure provides different discharge paths, which effectively reduces voltage borne by a protected device through a voltage division method, and improves the device's ability to protect against electrostatic discharge.

An electronic chip includes a chip core including an input terminal, an output terminal, an external pad, and an input-output circuit coupled to the chip core and the external pad. The input-output circuit includes an enable terminal coupled to the chip core, a connection terminal coupled to the external pad, a switchable diode device coupled between a supply voltage and a reference voltage, and a levelling circuit. The switchable diode device is coupled to the connection terminal and the enable terminal and is configured to operate as a diode in response to a control signal in a first state applied to the enable terminal and to operate as an open circuit in response to the control signal in a second state applied to the enable terminal. The levelling circuit is coupled to the connection terminal, the input terminal of the chip core, and the output terminal of the chip core.

An input/output (I/O) circuit may be provided. The I/O circuit may include an input control circuit and an output control circuit. The input control circuit may be configured to apply a stress to a transmission path based on an input signal while in a test mode and buffer the input signal using a drivability changed by the stress applied to the transmission path to generate first and second transmission signals while in a normal mode after the test mode. The output control circuit may be configured to drive and output an output signal according to the first and second transmission signals based on a test mode signal.

An ESD protection circuit has a driver transistor with a drain that is coupled to an I/O pad of an IC device and a source that is coupled to a first rail of a power supply in the IC device, and a diode that couples the I/O pad to the first rail and that is configured to be reverse-biased when a rated voltage is applied to the I/O pad. The rated voltage lies within a nominal operating range for voltage levels defined for the input/output pad. The ESD protection circuit has a gate pull transistor that couples a gate of the driver transistor to the I/O pad or the first rail. The gate pull transistor may be configured to present a high impedance path between the gate of the driver transistor and the I/O pad or the first rail when the rated voltage is applied to the I/O pad. The gate pull transistor may be configured to provide a low impedance path between the gate of the driver transistor and the I/O pad or the first rail when an overvoltage signal applied to the I/O pad has a magnitude that exceeds the nominal operating range of voltage levels defined for the I/O pad.

In examples, an input/output (I/O) circuit comprises an input, an output, and a first transistor having a first control terminal, a first current terminal and a second current terminal, the first current terminal coupled to the input. The circuit also includes a second transistor having a second control terminal, a third current terminal and a fourth current terminal, the third current terminal coupled to ground and the fourth current terminal coupled to the second current terminal. The circuit further includes a third transistor having a third control terminal, a fifth current terminal and a sixth current terminal, the third transistor coupled between the input and the output and the third control terminal coupled to the second current terminal.

Systems and techniques for applying voltage biases to gates of driver circuitry of an integrated circuit (IC) based on a detected bus voltage, IC supply voltage, or both are used to mitigate Electrical Over-Stress (EOS) issues in components of the driver circuitry caused, for instance, by high bus voltages in serial communication systems relative to maximum operating voltages of those components. A driver bias generator selectively applies bias voltages at gates of transistors of a stacked driver structure of an IC to prevent the voltage drop across any given transistor of the stacked driver structure from exceeding a predetermined threshold associated with the maximum operating voltage range of the transistors.

A cross-coupled differential activated latch circuit with circuitry comprising a plurality of n-FETs and inverters that can be implemented completely in GaN. The circuitry prevents the digital latched values on the outputs of the latch from changing unless the digital input values on the inputs are different, thus preventing common-mode voltage on the inputs from corrupting the stored latch values.