H04N23/52

Methods for controlling an apparatus adapted to clean a sensor assembly
11554755 · 2023-01-17 · ·

A method for controlling a sensor assembly cleaning apparatus includes receiving sensor data from various vehicle sensors, determining a level of obscurement of the transparent surface, and determining whether the level of obscurement exceeds a threshold level. If the transparent surface is obscured beyond the threshold level, a control signal may be sent to the apparatus to initiate the ejection of pressurized air onto the transparent surface. Optionally, the method may further evaluate other parameters such as the vehicle velocity in relation to a threshold vehicle velocity prior to sending the control signal to ensure that the cleaning operation using pressurized air would not be superfluous in light of the vehicle velocity. In addition, a method for selectively activating the sensor assembly cleaning apparatus includes determining an activation schedule for the apparatus based on an arrangement of transparent surfaces and controlling the apparatus to operate based on the activation schedule.

AN INTERNALLY ALIGNED CAMERA AND A MANUFACTURING METHOD THEREOF
20230009451 · 2023-01-12 · ·

The invention provides an internally aligned camera device comprising a front housing assembly, a first printed circuit board (PCB), a second PCB and a flexible PCB, a PCB retention cage and a rear housing assembly. The front housing assembly comprises lens elements for forming an image on an image sensor operably coupled to the first PCB, said image sensor optically aligned with said front housing assembly comprising said lens elements. The second PCB is electrically coupled to said first PCB using a flexible PCB, where the second PCB folded over said first circuit board. The PCB retention cage retains the second PCB in position. The rear housing assembly comprises a metal shield which clamps down the second PCB and said PCB retention cage in position. Further, said front housing assembly is centrally aligned and attached with said rear housing assembly. A method of manufacturing the camera device is also described.

CAMERA MODULE, SPACER COMPONENT, AND METHOD FOR PRODUCING CAMERA MODULE

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

Utilizing dual cameras for continuous camera capture
11575877 · 2023-02-07 · ·

An eyewear device that adjusts an on time and an off time of a pair of cameras to control heat of the cameras and of the eyewear device. Each of the pair of cameras has a duty cycle determining when the respective camera is on and off. A camera control chart contains the duty cycles. The eyewear may have a temperature sensor such that the on and off times of the cameras are a function of the temperature sensor.

Modular camera with interchangeable image head and sub-system bases
11711603 · 2023-07-25 · ·

An image head including a housing, side rails, a port, and internal componentry. The housing includes a first side and a second side located opposite the second side. The side rails are located on or within the first side, the second side, or both and the side rails are configured to provide sliding directional control of the image head when connecting to a base. The port is configured to electrically connect the image head to the base. The internal componentry includes a printed circuit board; an integrated lens and sensor assembly (ISLA) configured to generate an image; and memory located on the printed circuit board configured to store the image.

Devices and methods for detecting and removing vapor

The present disclosure relates to devices and methods for detecting and removing vapor for an imaging acquisition device. A device for detecting and removing vapor may include a first light guide. The first light guide may include a first end to receive a light beam, and a second end to output the light beam at a predetermined angle with respect to a reference plane, so that when the light beam enters a target light transmission media from the first light guide, the light beam substantially perfectly reflects between a first surface and a second surface of the target light transmission media. The first surface and second surface may substantially parallel to the reference plane.

Devices and methods for detecting and removing vapor

The present disclosure relates to devices and methods for detecting and removing vapor for an imaging acquisition device. A device for detecting and removing vapor may include a first light guide. The first light guide may include a first end to receive a light beam, and a second end to output the light beam at a predetermined angle with respect to a reference plane, so that when the light beam enters a target light transmission media from the first light guide, the light beam substantially perfectly reflects between a first surface and a second surface of the target light transmission media. The first surface and second surface may substantially parallel to the reference plane.

Vehicular camera module with focus athermalization

A vehicular camera module includes a front camera housing portion having an imager, a lens having a plurality of optical elements, and an imager printed circuit board. The imager is disposed at a front side of the imager printed circuit board and the lens is optically aligned with the imager. A rear camera housing portion is mated with the front camera housing portion to form a camera housing. A thermal element is disposed between the imager printed circuit board and the camera housing. The thermal element has a coefficient of thermal expansion (CTE) of 13 ppm/° C. or less. With the vehicular camera module disposed at a vehicle, circuitry of the vehicular camera module is in electrical connection with a wire harness of the vehicle.

IMAGE CAPTURE DEVICE WITH INTERCHANGEABLE INTEGRATED SENSOR-OPTICAL COMPONENT ASSEMBLIES

An image capture device includes an image capture module and a base module. The image capture module is releasably connectable to the base module. The image capture module includes an integrated image sensor and optical component for capturing image data. The base module includes a processor. The processor is configured and the base module is calibrated based on identification data provided by the image capture module when releasably connected to the base module. The image information and identification data may be wirelessly transferred from the image capture module to the base module.

CAMERA MODULE
20230236478 · 2023-07-27 · ·

A camera module comprises: a first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed in the inner space of the first housing and the second housing; an image sensor disposed on the first printed circuit board; and a shield can disposed under the first printed circuit board in the second housing, wherein the shield can comprises a rib which comes into contact with the lower surface of the first printed circuit board.