A camera motor includes a motor housing, a lens bearing apparatus, a cushioning part, and a drive apparatus. The motor housing has an accommodating cavity, and the lens bearing apparatus is accommodated in the accommodating cavity and is spaced apart from an inner wall of the accommodating cavity. The cushioning part is disposed on an outer surface of the lens bearing apparatus. The drive apparatus is accommodated in the accommodating cavity, and the drive apparatus can drive the lens bearing apparatus to move in the accommodating cavity.

A camera motor includes a motor housing, a lens bearing apparatus, a cushioning part, and a drive apparatus. The motor housing has an accommodating cavity, and the lens bearing apparatus is accommodated in the accommodating cavity and is spaced apart from an inner wall of the accommodating cavity. The cushioning part is disposed on an outer surface of the lens bearing apparatus. The drive apparatus is accommodated in the accommodating cavity, and the drive apparatus can drive the lens bearing apparatus to move in the accommodating cavity.

Provided is an imaging device capable of efficiently dissipating heat from an imaging element. An imaging device 100 includes: an imaging element substrate 4 on which an insulating layer 51 and a conductor layer 52 are stacked and an imaging element 41 is mounted; and a housing 1 that accommodates the imaging element substrate 4. The surface of the imaging element substrate 4 has a mounting region 45 on which an electronic component 43 including the imaging element 41 is mounted, a covered region 46 in which the conductor layer 52 is covered with the insulating layer 51, and an exposed region 47 in which the conductor layer 52 is exposed from the insulating layer 51, and the exposed region 47 is connected to the housing 1.

The present embodiment relates to a camera module comprising: a bobbin, which has a through-hole formed therein; a lens module, which is accommodated in the through-hole and is coupled to the bobbin; a protrusion formed to protrude from the outer peripheral surface of the lens module; and a recess formed to be recessed from the inner peripheral surface of the bobbin so as to accommodate at least a part of the protrusion, wherein the recess comprises a first guide portion, which extends downwards from the upper end of the bobbin, and a second guide portion, which extends so as to slope from the first guide portion.

An electronic device includes a camera module and an external structure. The camera module includes an image sensor and a shielding structure that shields components of the camera module from electromagnetic interference (EMI). The external structure two-dimensionally surrounds the camera module, and a portion of the external structure is conductive. The shielding structure includes an accommodating portion that accommodates the image sensor, and a protruding portion that protrudes from the accommodating portion to contact the external structure.

A camera module includes a first lens barrel configured to receive one or more lens groups, a second lens barrel coupled to the first lens barrel and configured to support a front lens disposed on an object side of the one or more lens groups, an energy generating unit configured to contact the second lens barrel and configured to supply thermal energy to the second lens barrel, and a barrel holder coupled to the first lens barrel and configured to accommodate the energy generating unit.

A camera module includes a first lens barrel configured to receive one or more lens groups, a second lens barrel coupled to the first lens barrel and configured to support a front lens disposed on an object side of the one or more lens groups, an energy generating unit configured to contact the second lens barrel and configured to supply thermal energy to the second lens barrel, and a barrel holder coupled to the first lens barrel and configured to accommodate the energy generating unit.

An imaging device includes an imaging main body; a fan accommodation portion provided in an upper portion of the imaging main body; and a cooling fan disposed in the fan accommodation portion, wherein the fan accommodation portion includes an upper surface, a pair of side surfaces, and a front surface that cover the cooling fan, and an intake port and an exhaust port for the cooling fan to perform intake and exhaust are provided on a surface of the fan accommodation portion different from the upper surface.

An imaging device includes an imaging main body; a fan accommodation portion provided in an upper portion of the imaging main body; and a cooling fan disposed in the fan accommodation portion, wherein the fan accommodation portion includes an upper surface, a pair of side surfaces, and a front surface that cover the cooling fan, and an intake port and an exhaust port for the cooling fan to perform intake and exhaust are provided on a surface of the fan accommodation portion different from the upper surface.

A sensor device according to the present disclosure includes: a Peltier element; a sensor element thermally connected to a cooling surface of the Peltier element; and a package substrate that is thermally connected to a heat dissipation surface of the Peltier element and accommodates the Peltier element and the sensor element. In addition, the package substrate has a heat dissipation member, made of a material having a higher thermal conductivity than a material of the package substrate, on at least a part of a surface facing the heat dissipation surface of the Peltier element.