Provided is a method for manufacturing a flexible film. The method for the manufacturing the flexible film includes providing a parent film on which a plurality of film areas are defined, each of which having a detection pattern formed thereon, applying a voltage to each of the film areas to detect whether a defect exists, removing the detection pattern from respective ones of the film areas on which the defect is detected, and cutting out others of the film areas on which the defect is not detected.

A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

A three-dimensional (3D) printed circuit board (PCB) composite structure includes a PCB and a 3D printed composite structure. The printed circuit board includes a plurality of grooves milled in a surface of the PCB, and retaining walls of the 3D printed composite structure are deposited within the plurality of grooves in the surface of the PCB, to improve adhesion of the 3D printed composite structure to the PCB.

The present invention aims at eliminating a need for a moving mechanism that moves a machining table and eliminating a need for a protective cover such as a bellows cover, and includes a machining table that holds a workpiece, a machining mechanism that machines the workpiece with a rotary tool while using a machining liquid, and a moving mechanism that linearly moves the machining mechanism at least in each of X and Y directions on a horizontal plane, in which the machining mechanism moved by the moving mechanism machines the workpiece with respect to the machining table, the machining table being fixed at least in the X and Y directions.

The present disclosure provides a circuit board arrangement comprising a main board comprising at least one longitudinal cutout, at least one reinforcing plate arranged in the at least one longitudinal cutout and mechanically coupled to the main board, wherein the plane of main extension of the main board is arranged perpendicular to the plane of main extension of the at least one reinforcing plate. Further, the present disclosure provides a differential probe circuit and a respective method.

A wiring board according to the present disclosure includes a core board including an upper surface, a lower surface, a through-hole penetrating from the upper surface to the lower surface, and a plurality of glass fibers located inside, and a through-hole conductor located in the through-hole. The through-hole conductor includes a first portion located on an inner wall of the through-hole, and second portions connected to the first portion and located inside the glass fibers. The second portions include portions in a first direction and a second direction intersecting the first direction in a planar direction of the core board, the portions having a shorter length in the planar direction from the inner wall of the through-hole than portions, of the second portions, in directions other than the first direction and the second direction.

A kirigami enabled manufacturing method and systems are provided. The method includes providing a plurality of substrate units for mounting electronic devices in an initial state; providing at least one connector connecting adjacent substrate units of the plurality of substrate units in the initial state, wherein the at least one connector includes one or more foldable areas defined by a plurality of creases and n stretchable layers stacking on one another; folding the one or more foldable areas of the connector along the plurality of creases by 180°; and flipping and expanding the n stretchable layers of the connector into one layer of a planar predetermined pattern connecting the plurality of substrate units. The enabled manufacturing method and systems expand a small area of thin film material to a large area network by the folding and expanding processes.

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

A wiring substrate includes an insulating layer, and a build-up part formed on the insulating layer and including an interlayer insulating layer and a conductor layer. The build-up part has a cavity penetrating through the build-up part such that the cavity is formed to accommodate an electronic component and has an inner wall and a bottom surface having a groove and that the groove is extending entirely in an outer edge part of the bottom surface and formed continuously from the inner wall surface of the cavity.

The present application relates to the technical field of circuit board fabricating, and provides a method for fabricating an asymmetric board, the method includes fabricating a master board, fabricating a second sub-board, thermal compression bonding the master board and the second sub-board, and milling a finished board; further includes at least one of the following three steps: laying copper on the connection positions of the master board except for the second copper layer of an outermost layer to obtain laying copper area, digging copper on the connection positions of the third copper layer, and after the step of milling the finished board, on each of the impositions, performing depth control milling at the connection positions from a side of the second sub-board on each imposition to obtain a depth control groove.