A conductive tape formed by laying a conductive pathway on a tape layer is disclosed. Various apparatus and methods for laying conductive pathways to form conductive tape are disclosed. The conductive pathways may be laid by varying the lateral position of the conductive pathway on the tape substrate. Such patterns all stretchable conductive tape to be realized. Multiple conductive pathways may be laid in the tape and the lateral separation of the pathways in the tape may vary. In some embodiments the pathways are formed from conductive yarn or by printing or laying conductive ink.

A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.

A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.

Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

An electric melting method for forming metal components provides an electric melting head (6) and a base material (2) being connected to the anode and the cathode of a power supply (12). During the forming of the component, the raw metal wire (1) is sent to the base material (2) and the electric melting head (6) to generate electric arc (9) between the raw wire (1) and the base material (2). The electric arc melts a part of the deposited auxiliary material (3) and creates a molten slag pool (8). Electric current generates the resistance heat and the electroslag heat. The raw wire (1) is molten under the high-energy heat resource composed of the electric arc heat, the resistance heat and the electroslag heat, and thereby creating a molten pool (11) on partial surface of the base material (2).

An elastic flexible substrate includes an insulating base material having a first insulating film and a second insulating film, and a plurality of wires, each of which is disposed on one of the first insulating film and the second insulating film. The insulating base material has a plurality of bonding portions that are surface-bonded, openings are formed between the bonding portions, and two of the plurality of wires are electrically connected in the bonding portions.

An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.

The present invention comprises a method of manufacturing electronics without PCBs and an apparatus for manufacturing electronics without PCBs.

This disclosure relates to embodiments of work vehicle systems including multilayer wiring panels (MWPs), which provide electrical interconnections to various electronic devices integrated into the work vehicle system. In embodiments, a work vehicle system includes a work vehicle component having a component housing which a first MWP is mounted. The first MWP includes a multilayer panel body having a non-planar cross-sectional shape generally conformal with a topology of a non-planar mounting surface of the component housing, preplaced wires embedded in the multilayer panel body, and panel input/output (I/O) interfaces electrically connected by the preplaced wires. The panel I/O interfaces contain first and second panel I/O interfaces electrically coupled to the controller and to the first integrated electronic device, respectively, such that the controller is placed in signal communication with the first integrated electronic device through the first MWP during operation of the work vehicle system.