The invention relates to a variable sensor interface for a control unit, this variable sensor interface including a circuit board which is provided with components. In a sensor interface which can easily be used for the use of different sensor types, the circuit board has a predefined conductive track layout having a plurality of predefined mounting locations, the mounting locations being provided with components in a sensor-specific manner.

An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiply bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb has an oversize relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.

A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.

A membrane circuit structure with function expandability is provided. The membrane circuit structure includes a substrate, a lower circuit layer and a covering layer. The substrate includes a first region and at least one second region. The at least one second region is arranged near the first region. The lower circuit layer is printed on the first region. The lower circuit layer is made of a first conductive material. The covering layer is electroplated on a portion of a surface of the lower circuit layer. The covering layer is made of a second conductive material. At least one expansion line is welded on the corresponding second region, and electrically connected with the covering layer and a corresponding function-expanding unit.

A circuit board with wire conductive pads is provided for insertion of wires, and includes: a circuit board and a wire conductive pad. The wire conductive pad includes a main body in the form of a hollow column and an elastic locking piece extending from the main body. The main body includes a peripheral wall defining an insertion space. The elastic locking piece is inserted from the peripheral wall into the insertion space in an inclined manner to press towards the peripheral wall. Wires are inserted into the insertion space and clamped against the peripheral wall by the elastic piece, so that the wires can be prevented from falling off in a reverse direction, and thus can be connected to the circuit board in a more quick and stable manner.

A method for manufacturing a circuit board system comprising mechanical protection of electrical components is presented. The circuit board system comprises a circuit board (101) furnished with electrical components (103-111) and a protection element (102) attached to areas of the circuit board which are free from the electrical components. The protection element has thickness in the direction perpendicular to the circuit board and it is shaped to leave the electrical components unscreened in the direction perpendicular to the circuit board. Thus, the protection element constitutes barriers protecting the electrical components but still allows the electrical components to be accessed from the direction perpendicular to the circuit board for example in a flying probe testing. Furthermore, the protection element provides electrical connections between functional entities of the circuit board system.

Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB.

Disclosed herein is a board apparatus including a printed circuit board, including a first ground wiring disposed on one surface of the printed circuit board; a second ground wiring disposed on the other surface of the printed circuit board; and a switch module disposed in an overlapped region between the first ground wiring and the second ground wiring, and including a bolt which penetrates through the printed circuit board and a nut which is in contact with the second ground wiring and is coupled to a screw of the bolt.

A semiconductor package includes a substrate, a conductive layer, a first surface mount device (SMD) and a bonding wire. The substrate has a t top surface. The first conductive layer is formed on the top surface and has a first conductive element and a first pad separated from each other. The first SMD is mounted on the first pad, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.

A transmission cable includes a transmission cable, a first circuit board having a first power layout area, a first ground layout area, and a first circuit trace, and a second circuit board having a second power layout area, a second ground layout area, and a second circuit trace. The transmission cable includes a power wire, a pair of signal wires, and a drain wire. When the first power layout area, the first circuit trace, the second power layout area, and the second circuit trace are connected via a resistor, respectively, the drain wire connected between the first circuit trace and the second circuit trace will act as another power wire. Thus, a voltage drop at both ends of the transmission cable can be reduced by increasing the power wires to improve signal transmission quality.